Product Overview
Our Stacked Micro Via PCBs represent the pinnacle of high-density interconnect (HDI) technology, delivering exceptional performance for space-constrained electronic applications. These advanced printed circuit boards utilize precision-engineered micro vias arranged in stacked configurations to maximize routing density while maintaining superior signal integrity and reliability.
Key Features
Ultra-High Density Interconnection Micro vias with diameters as small as 0.1mm (4 mil) enable unprecedented component placement density and routing flexibility. Multiple stacked via layers create efficient vertical interconnection pathways between circuit layers.
Advanced Via Stacking Architecture Our proprietary stacking technology supports multiple via-in-via configurations, including 2+N+2, 3+N+3, and custom stacking arrangements. This allows for complex routing solutions in packages with layer counts ranging from 8 to 32+ layers.
Superior Signal Performance Optimized via geometry and controlled impedance design minimize signal loss, crosstalk, and electromagnetic interference. Perfect for high-speed digital applications, RF circuits, and mixed-signal designs operating at frequencies up to several GHz.
Exceptional Reliability Advanced manufacturing processes ensure robust via connections with excellent thermal cycling performance and mechanical stability. Meets IPC Class 3 reliability standards for mission-critical applications.
Technical Specifications
- Via Diameter: 0.1mm – 0.15mm (4-6 mil)
- Aspect Ratio: Up to 1:1 for micro vias
- Layer Count: 8-32+ layers
- Minimum Trace Width: 0.075mm (3 mil)
- Minimum Spacing: 0.075mm (3 mil)
- Board Thickness: 0.4mm – 3.2mm
- Operating Temperature: -55ยฐC to +125ยฐC
Applications
Ideal for cutting-edge electronics requiring maximum miniaturization:
- Smartphones and mobile devices
- Wearable technology
- High-performance computing systems
- Automotive electronics and ADAS
- Aerospace and defense systems
- Medical implantable devices
- IoT sensors and modules
Manufacturing Excellence
Produced using state-of-the-art sequential lamination processes with laser drilling technology for precise via formation. Our quality control systems ensure consistent via registration, reliable plating coverage, and optimal electrical performance across all production volumes.
Why Choose Our Stacked Micro Via PCBs
With over a decade of HDI expertise, we deliver industry-leading micro via technology that enables your most demanding designs. Our engineering team provides comprehensive design support to optimize your layout for manufacturability while achieving your performance targets.
Contact our technical specialists today to discuss how our Advanced Via Stacking technology can solve your high-density interconnect challenges.
