Product Specifications
Core Features
- Device Family: Spartan-II Extended (Spartan-IIE)
- Logic Cells: 300,000 system gates
- Configuration Memory: SRAM-based
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
- Package Type: 256-pin Fine Pitch Ball Grid Array (FT256)
- Speed Grade: -6 (standard performance)
Technical Specifications
- CLB Array: 24 x 24 Configurable Logic Blocks
- Total CLBs: 576
- Logic Cells: 6,912
- Block RAM: 16 blocks (4KB each, 64KB total)
- Distributed RAM: 86KB
- Dedicated Multipliers: 12 (18×18 bit)
- Maximum User I/O: 176 pins
- Digital Clock Manager (DCM): 4 units
- Global Clock Networks: 8
Electrical Characteristics
- Core Voltage: 1.8V ยฑ5%
- I/O Voltage: 1.5V to 3.3V
- Maximum Operating Frequency: Up to 200MHz
- Power Consumption: Low power CMOS technology
- Static Current: <10mA typical
Pricing Information
The XC2S300E-6FT256I pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing:
- Small Quantities (1-99): Contact for quote
- Production Quantities (100+): Volume discounts available
- Development Kits: Available through Xilinx and partners
Note: Prices subject to change. Contact suppliers for real-time pricing and availability.
Documents & Media
Technical Documentation
- Datasheet: XC2S300E complete electrical and timing specifications
- User Guide: Spartan-IIE FPGA Family comprehensive design guide
- Package Information: FT256 mechanical drawings and pinout diagrams
- Application Notes: Design implementation best practices
- Errata: Known issues and workarounds
Development Resources
- ISE Design Suite: Complete development environment
- IP Core Libraries: Pre-verified intellectual property blocks
- Reference Designs: Example implementations and starter projects
- Simulation Models: VHDL and Verilog behavioral models
Related Resources
Development Tools
- Xilinx ISE Design Suite: Integrated development environment
- ChipScope Pro: Real-time debugging and analysis
- System Generator: MATLAB/Simulink integration
- EDK (Embedded Development Kit): Embedded processor design
Compatible Products
- Configuration Devices: Platform Flash PROMs
- Development Boards: Spartan-IIE evaluation platforms
- IP Cores: DSP, processor, and connectivity cores
- Design Services: Third-party design and support services
Application Areas
- Digital signal processing systems
- Communications infrastructure
- Industrial automation and control
- Automotive electronics
- Medical device applications
- Aerospace and defense systems
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package options available
- REACH Regulation: EU chemical safety compliance
- Conflict Minerals: Compliant with Dodd-Frank Act requirements
- Green Package: Halogen-free options available
Operating Conditions
- Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Thermal Resistance: ฮธJA = 23ยฐC/W (typical)
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.2.a
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Various (check specific part marking)
- Export License: May be required for certain destinations
Quality and Reliability
- Quality Standard: ISO 9001:2015 certified manufacturing
- Reliability Testing: JEDEC standards compliance
- MTBF: >1,000,000 hours at 55ยฐC
- ESD Protection: Class 1C (>1000V) HBM
The XC2S300E-6FT256I represents an excellent balance of performance, features, and cost-effectiveness for mid-range FPGA applications. Its industrial temperature rating and comprehensive feature set make it suitable for demanding applications across multiple market segments.
