1. Product Specifications
Core Features
- Device Family: Xilinx Spartan-II
- System Gates: 300,000
- Speed Grade: -6 (standard performance)
- Package Type: FTG256 (Fine-Pitch Ball Grid Array)
- Pin Count: 256 pins
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial grade)
Technical Specifications
- Logic Cells: 6,144 equivalent
- Block RAM: 40 Kbits
- Distributed RAM: 96 Kbits
- Maximum User I/O: 176
- Digital Clock Manager (DCM): 4 units
- Supply Voltage: 2.5V core, 3.3V I/O
- Power Consumption: Low power consumption optimized for battery-powered applications
Performance Characteristics
- Maximum Operating Frequency: Up to 200 MHz
- Logic Delay: Industry-leading propagation delays
- I/O Standards Support: LVTTL, LVCMOS, GTL, SSTL, HSTL
- Configuration: SRAM-based with multiple configuration modes
2. Pricing Information
The XC2S300E-6FTG256C typically ranges from $45 to $85 per unit, depending on quantity and supplier. Volume pricing is available for orders over 100 units. Contact authorized distributors for current pricing and availability, as semiconductor prices fluctuate based on market conditions and lead times.
Pricing Factors:
- Order quantity (volume discounts available)
- Lead time requirements
- Packaging options (tape and reel vs. tray)
- Regional availability
3. Documents & Media
Technical Documentation
- Datasheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive implementation guidelines
- Reference Manual: Detailed architecture and configuration information
- Application Notes: Design examples and best practices
- Errata: Known issues and workarounds
Development Resources
- Development Boards: Evaluation and prototyping platforms
- IP Cores: Pre-verified intellectual property blocks
- Design Examples: Reference designs for common applications
- Software Tools: ISE Design Suite compatibility information
Multimedia Resources
- Block Diagrams: Visual architecture representations
- Package Drawings: Mechanical dimensions and pin assignments
- Thermal Plots: Heat dissipation characteristics
- Application Videos: Implementation tutorials and demonstrations
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Complete design environment
- ModelSim: HDL simulation software
- ChipScope Pro: Integrated logic analyzer
- PlanAhead: Physical design and analysis tool
Compatible Products
- Configuration Devices: Platform Flash PROMs
- Development Boards: Spartan-II evaluation kits
- IP Portfolio: DSP, networking, and interface cores
- Training Materials: Online courses and documentation
Technical Support
- Design Services: Professional implementation assistance
- Community Forums: Peer-to-peer technical discussions
- Knowledge Base: Searchable technical articles
- Field Application Engineers: Direct technical support
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: EU chemical safety compliance
- Conflict Minerals: Responsible sourcing certification
- Green Packaging: Environmentally friendly materials
Operating Conditions
- Temperature Range: 0ยฐC to +85ยฐC (Commercial)
- Humidity: Non-condensing environments
- Altitude: Up to 2000 meters operational
- Vibration Resistance: MIL-STD-883 compliant
Export Classifications
- ECCN: 3A001.a.2 (Export Administration Regulations)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location varies
- Export Restrictions: Subject to US export control regulations
Quality Standards
- ISO 9001: Quality management system certification
- TS 16949: Automotive industry quality standards
- MIL-STD-883: Military standard reliability testing
- IPC Standards: Electronic assembly guidelines
Applications
The XC2S300E-6FTG256C excels in diverse applications including:
- Digital signal processing systems
- Telecommunications infrastructure
- Industrial control systems
- Automotive electronics
- Medical device interfaces
- Consumer electronics prototyping
Conclusion
The XC2S300E-6FTG256C represents an excellent balance of performance, cost-effectiveness, and versatility for FPGA-based designs. Its robust feature set, comprehensive development ecosystem, and proven reliability make it a preferred choice for engineers developing next-generation digital systems.
