1. Product Specifications
Core Architecture
- Device Family: Spartan-IIE 1.8V FPGA
- System Gates: 400,000 gates
- Logic Elements: 10,800 configurable logic blocks (CLBs)
- Adaptive Logic Modules: 4,800 ALMs
- Technology Node: 0.15ฮผm CMOS process
Memory Resources
- Block RAM: Up to 288K bits total capacity
- Distributed RAM: Up to 221,184 bits
- Embedded Memory: 160 kbit integrated memory
- SelectRAMโข Hierarchical Memory: 16 bits/LUT distributed RAM
- True Dual-Port Block RAM: Configurable 4K-bit blocks
Performance Specifications
- Maximum Operating Frequency: 357 MHz
- Speed Grade: -6 (commercial grade)
- Core Voltage (VCCINT): 1.8V ยฑ10%
- I/O Voltage (VCCO): 1.8V to 3.3V compatible
- Operating Temperature: 0ยฐC to +85ยฐC (commercial)
Package & I/O
- Package Type: 456-pin Fine-pitch Ball Grid Array (FBGA)
- Package Code: FGG456
- Total I/O Pins: 329 user I/O
- I/O Standards: 19 selectable standards including LVTTL, LVCMOS, GTL, HSTL, LVDS
- Delay-Locked Loops (DLLs): 4 dedicated DLLs for clock management
Advanced Features
- In-System Programmability: Unlimited reprogramming capability
- Configuration Options: JTAG, slave serial, master serial modes
- Clock Management: Four DLLs with advanced clock synthesis
- Fast Interconnect: Predictable routing for timing closure
- Design Security: Optional bitstream encryption support
2. Price
Current Market Pricing (2025)
Pricing for XC2S400E-6FGG456I varies based on quantity and supplier:
- Single Unit: Contact distributors for current pricing
- Small Quantities (1-99): Pricing available upon request
- Volume Orders (100+): Significant volume discounts available
- Production Quantities (1000+): Contact for enterprise pricing
Note: The XC2S400E-6FGG456I is marked as “NOT RECOMMENDED FOR NEW DESIGN” by Xilinx/AMD. Current availability is primarily through authorized distributors and surplus inventory suppliers.
Cost Factors
- Market availability affects pricing due to legacy status
- Lead times vary depending on stock levels
- Volume discounts typically range from 10-30% for quantities over 100 units
- Educational pricing may be available through academic partners
For Current Pricing: Contact authorized distributors including:
- Mouser Electronics
- IC-Components
- Lisleapex Electronic
- FPGAkey
- Veswin Electronics
3. Documents & Media
Technical Documentation
Primary Documentation:
- Official Datasheet: DS077 – Spartan-IIE 1.8V FPGA Family Complete Data Sheet
- User Guide: Spartan-IIE FPGA User Guide with architectural details
- DC and Switching Characteristics: Module 3 of 4 timing specifications
- Configuration Guide: Programming and configuration methodology
Design Resources:
- Application Notes: XAPP179 and related design guidelines
- PCB Layout Guidelines: Package-specific routing recommendations
- Thermal Management Guide: Heat dissipation and cooling strategies
- Pin-out Documentation: Complete pin assignment and signal descriptions
Software Support
Development Tools:
- Xilinx ISE Design Suite: Complete development environment
- ISE WebPACK: Free version with Spartan-IIE support
- Synthesis Tools: XST (Xilinx Synthesis Technology)
- Implementation Tools: Place and route optimization
- Timing Analysis: Static timing analysis and constraints
Programming Support:
- IMPACT: Configuration and programming utility
- ChipScope Pro: Integrated logic analyzer
- Hardware Debug: Boundary scan and JTAG support
- IP Core Libraries: Pre-verified intellectual property blocks
Reference Designs
- Evaluation Board Schematics: Reference hardware designs
- Example Projects: Starter designs and tutorials
- IP Core Examples: Communication and DSP implementations
- Performance Benchmarks: Speed and resource utilization data
4. Related Resources
Development Platforms
Evaluation Boards:
- Spartan-IIE evaluation kits for rapid prototyping
- Third-party development modules and carrier boards
- Educational training boards for learning applications
- Custom evaluation platforms from design service partners
Compatible Products:
- XC2S100E-6FGG456I: Smaller 100K gate variant
- XC2S200E-6FGG456I: 200K gate mid-range option
- XC2S600E-6FGG456I: Higher density 600K gate device
- Configuration Memory: XC18V series configuration PROMs
Migration Path
Recommended Alternatives:
- Spartan-6 Family: Modern replacement with enhanced features
- Artix-7 Series: Advanced 28nm technology migration path
- Zynq-7000 SoCs: ARM + FPGA system-on-chip solutions
Support Ecosystem
Technical Support:
- Xilinx Community Forums: Peer-to-peer technical discussions
- Application Engineering: Professional design consultation
- Training Programs: Certification courses and workshops
- Design Services: Authorized third-party design partners
IP and Cores:
- Xilinx CORE Generator: Optimized IP library
- Third-Party IP: Licensed cores from partner vendors
- Open Source Cores: Community-developed IP blocks
- Custom IP Development: Professional IP creation services
Application Examples
- Digital Signal Processing: FIR/IIR filters, FFT implementations
- Communications: Protocol processors, packet switching
- Industrial Control: Motor control, sensor interfaces
- Consumer Electronics: Video processing, audio systems
- Networking: Ethernet controllers, packet classification
5. Environmental & Export Classifications
Environmental Compliance
RoHS Compliance:
- Lead-Free Package: Compliant with RoHS directive 2011/65/EU
- Manufacturing Process: Lead-free soldering and assembly
- Halogen-Free Options: Available for environmentally sensitive applications
- REACH Compliance: European chemical regulation conformity
Environmental Standards:
- WEEE Compliant: Waste Electrical and Electronic Equipment directive
- Conflict Minerals: Reporting available per Dodd-Frank requirements
- Green Manufacturing: Environmentally responsible production processes
- Packaging: ESD-safe, recyclable packaging materials
Quality & Reliability
Quality Certifications:
- ISO 9001: Certified manufacturing processes
- Automotive Grade: AEC-Q100 qualified variants available
- Military Standards: MIL-STD screening options
- Quality Assurance: 100% electrical testing and traceability
Reliability Specifications:
- MTBF: Mean Time Between Failures data available
- Moisture Sensitivity: MSL-3 classification per JEDEC standards
- ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested
- Latch-up Immunity: CMOS latch-up resistant design
Export Control Classifications
Trade Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- Harmonized Tariff Schedule (HTS): Electronics classification
- Country of Origin: Manufacturing location documentation
- Export Licensing: Requirements vary by destination country
Regulatory Compliance:
- FCC Part 15: Electromagnetic compatibility testing
- CE Marking: European Conformity declaration
- International Standards: IEC, ANSI compliance where applicable
- Technology Transfer: Controlled technology export compliance
Package Information
Handling Requirements:
- ESD Precautions: Electrostatic discharge sensitive device
- Storage Conditions: Temperature and humidity controlled environment
- Shelf Life: Moisture-sensitive device storage guidelines
- Soldering Guidelines: Reflow profile specifications for assembly
Traceability:
- Date Codes: Manufacturing date and lot identification
- Serial Numbers: Individual device tracking capability
- Quality Records: Test data and performance verification
- Supply Chain: Authorized distributor verification
Conclusion
The XC2S400E-6FGG456I represents a proven solution for engineers requiring reliable, high-performance FPGA capabilities in legacy designs and maintenance applications. While marked as not recommended for new designs, this device continues to serve critical roles in existing systems requiring long-term support and replacement components.
Key Benefits:
- Mature, well-characterized technology with extensive documentation
- Strong ecosystem support through development tools and IP libraries
- Cost-effective solution for moderate complexity digital designs
- Reliable supply chain through authorized distributors and surplus markets
For new design projects, consider migrating to current-generation Xilinx/AMD FPGA families such as Spartan-7, Artix-7, or Zynq-7000 series devices that offer enhanced performance, lower power consumption, and long-term availability.
