Product Specifications
Core Features
The XC2S50E-6FTG256C incorporates 1,728 logic cells with 50,000 system gates, providing substantial processing power for complex digital implementations. This FPGA features 4 dedicated multipliers and 60 KB of total block RAM, ensuring efficient data handling and arithmetic operations.
Package and Pin Configuration
- Package Type: FTG256 (Fine-pitch Ball Grid Array)
- Pin Count: 256 pins
- Package Size: 17mm x 17mm
- Speed Grade: -6 (high-performance grade)
- Commercial Temperature Range: 0ยฐC to +85ยฐC
Memory and I/O Specifications
- User I/O Pins: 176
- Distributed RAM: 24 KB
- Block RAM: 4 blocks (16 KB each)
- Maximum Frequency: Up to 200 MHz
- Supply Voltage: 2.5V core, 3.3V I/O
Logic Resources
- Configurable Logic Blocks (CLBs): 432
- Logic Cells: 1,728
- Flip-Flops: 1,728
- 4-input LUTs: 1,728
Pricing Information
The XC2S50E-6FTG256C is competitively priced within the mid-range FPGA market segment. Pricing varies based on quantity, distribution channel, and current market conditions. For the most accurate and up-to-date pricing information, please contact authorized Xilinx distributors or visit official semiconductor marketplace platforms.
Typical Price Range: $25-$45 USD (varies by quantity and supplier)
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications, timing parameters, and package information
- User Guide: Comprehensive implementation guidelines and design recommendations
- Programming Manual: Detailed instructions for device configuration and programming
- Application Notes: Specific use-case implementations and optimization techniques
Design Resources
- Reference Designs: Pre-verified implementations for common applications
- Evaluation Boards: Development platforms for rapid prototyping
- Software Tools: ISE Design Suite compatibility and optimization guides
Related Resources
Development Tools
The XC2S50E-6FTG256C is fully supported by Xilinx ISE Design Suite, providing comprehensive tools for design entry, synthesis, implementation, and verification. Engineers can leverage ModelSim for simulation and ChipScope Pro for in-system debugging.
Compatible Products
- XC2S30E-6FTG256C: Lower gate count alternative (30,000 gates)
- XC2S100E-6FTG256C: Higher capacity option (100,000 gates)
- XC2S150E-6FTG256C: Maximum performance variant (150,000 gates)
Application Areas
The XC2S50E-6FTG256C excels in telecommunications, industrial automation, automotive electronics, consumer devices, and prototyping applications where moderate complexity and cost-effectiveness are priorities.
Environmental & Export Classifications
Environmental Compliance
The XC2S50E-6FTG256C meets stringent environmental standards including RoHS (Restriction of Hazardous Substances) compliance, ensuring lead-free manufacturing processes. The device is manufactured using environmentally responsible practices and materials.
Operating Conditions
- Commercial Temperature Range: 0ยฐC to +85ยฐC
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% (non-condensing)
- MSL Rating: Moisture Sensitivity Level 3
Export and Trade Classifications
- ECCN: 3A001.a.2 (Export Control Classification Number)
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Varies by manufacturing facility
The XC2S50E-6FTG256C represents an excellent balance of performance, features, and cost-effectiveness, making it a preferred choice for engineers developing next-generation electronic systems requiring programmable logic capabilities.
