Product Specifications
Core Features of XC2S300E-6FG456C
- Logic Cells: 300,000 system gates equivalent
- Speed Grade: -6 (high-performance grade)
- Package Type: FG456 (Fine-pitch Ball Grid Array)
- Pin Count: 456 pins
- Operating Voltage: 2.5V core, 3.3V I/O
- Temperature Range: Commercial (0ยฐC to +85ยฐC)
- Configuration Memory: SRAM-based
- Distributed RAM: 12,288 bits
- Block RAM: 216,000 bits total
- Dedicated Multipliers: 12 x 18-bit multipliers
- Digital Clock Managers (DCMs): 4 units
- Maximum User I/O: 333 pins
Performance Characteristics
The XC2S300E-6FG456C delivers impressive performance metrics with maximum operating frequencies exceeding 200 MHz for typical designs. The -6 speed grade ensures optimal timing closure for demanding applications requiring high-speed data processing and real-time performance.
Pricing Information
Note: XC2S300E-6FG456C pricing varies based on quantity, distribution channel, and current market conditions. For accurate, up-to-date pricing information, please contact authorized Xilinx distributors or visit official semiconductor pricing platforms. Volume discounts are typically available for production quantities.
Documents & Media
Essential Documentation
- Product Data Sheet: Complete electrical specifications and AC/DC characteristics
- User Guide: Detailed implementation guidelines and design recommendations
- Package Information: Mechanical drawings, pin assignments, and thermal data
- Migration Guide: Upgrade paths from previous Spartan generations
- Application Notes: Design examples and best practices
- IBIS Models: Signal integrity simulation models
- Constraint Files: Timing and placement constraints for development tools
Development Resources
- Xilinx ISE Design Suite: Complete development environment
- IP Core Libraries: Pre-verified intellectual property modules
- Reference Designs: Proven implementation examples
- Simulation Models: VHDL and Verilog behavioral models
Related Resources
Compatible Development Boards
- Spartan-IIE Evaluation Kit
- Third-party development platforms supporting FG456 package
- Custom PCB reference designs
Software Tools
- Xilinx ISE WebPACK: Free development software
- ModelSim: Advanced simulation environment
- ChipScope Pro: Integrated logic analyzer
- CORE Generator: IP core customization tool
Support Ecosystem
- Technical documentation library
- Community forums and user groups
- Application engineering support
- Training and certification programs
Environmental & Export Classifications
Environmental Compliance
The XC2S300E-6FG456C meets stringent environmental standards:
- RoHS Compliant: Lead-free manufacturing process
- Halogen-Free: Environmentally conscious packaging materials
- REACH Compliant: European chemical regulation conformance
- Green Package: Recyclable materials and reduced environmental impact
Export Control Information
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Various (check specific lot marking)
- Export License Requirements: May require license for certain destinations
Quality and Reliability
- Qualification Level: Commercial temperature range
- Package Reliability: Meets JEDEC standards
- Electrostatic Discharge (ESD): HBM Class 1C (>2000V)
- Latch-up Current: >200mA at 125ยฐC
Operating Conditions
- Supply Voltage Tolerance: ยฑ5% typical
- Junction Temperature Range: -40ยฐC to +125ยฐC
- Thermal Resistance: Package-dependent specifications
- Power Consumption: Dynamic and static power optimization
The XC2S300E-6FG456C represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. Its comprehensive feature set, combined with mature development tools and extensive documentation, makes it a reliable choice for both prototyping and production applications across various industries.
For technical support, detailed specifications, or custom solutions involving the XC2S300E-6FG456C, consult with qualified design engineers or authorized Xilinx representatives.
