1. Product Specifications
Core Architecture
- Device Family: Spartan-IIE
- Part Number: XC2S300E-6FG456I
- Logic Cells: 300,000 system gates
- Configurable Logic Blocks (CLBs): 1,176 CLBs
- Input/Output Blocks: 284 user I/O pins
- Block RAM: 216 Kbits total block RAM
- Distributed RAM: 38 Kbits
Performance Characteristics
- Speed Grade: -6 (high performance)
- Maximum System Clock: Up to 200 MHz
- Propagation Delay: 4.5ns typical
- Operating Temperature Range: Industrial (-40ยฐC to +85ยฐC)
- Supply Voltage: 2.5V core, 3.3V I/O
Package Details
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Package Size: 456-pin FBGA
- Package Code: FG456
- Pitch: 1.0mm ball pitch
- Package Dimensions: 23mm x 23mm
Memory and Storage
- Configuration Memory: SRAM-based
- Configuration Time: <100ms typical
- Memory Interface: Supports various memory types including SDRAM, DDR, and Flash
- On-chip Memory: Dual-port block RAM with flexible width configurations
2. Pricing Information
Current Market Pricing
- Unit Price (1-99 qty): $45.50 – $52.00 USD
- Volume Pricing (100-999 qty): $38.75 – $43.25 USD
- High Volume (1000+ qty): Contact for custom pricing
- Lead Time: 8-12 weeks standard delivery
- Availability: In stock from authorized distributors
Note: Prices are subject to change based on market conditions and volume requirements. Contact authorized Xilinx distributors for current pricing and availability.
3. Documents & Media
Technical Documentation
- Product Brief: XC2S300E-6FG456I datasheet (PDF, 2.4MB)
- User Guide: Spartan-IIE FPGA User Guide (PDF, 8.7MB)
- Application Notes:
- XAPP154: Using Block RAM in Spartan-IIE Devices
- XAPP176: Power Consumption in Spartan-IIE FPGAs
- XAPP189: High-Speed PCB Design Guidelines
Design Resources
- Reference Designs: Available through Xilinx Design Hub
- Development Boards: Spartan-IIE Starter Kit compatible
- Software Tools: ISE WebPACK (free) and ISE Foundation support
- IP Cores: Access to Xilinx LogiCORE IP library
Media Assets
- Product Images: High-resolution package photos and pinout diagrams
- Block Diagrams: System architecture and internal structure
- Video Resources: Getting started tutorials and design walkthroughs
- CAD Files: IBIS models, footprint libraries, and 3D models
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Complete development environment
- ChipScope Pro: Integrated logic analyzer for debugging
- EDK (Embedded Development Kit): For embedded processor designs
- System Generator: Simulink integration for DSP applications
Compatible Products
- Configuration Devices: XC18V02 and XC18V04 Platform Flash PROMs
- Power Management: XC2S300E-compatible voltage regulators
- Oscillators: Low-jitter clock sources for optimal performance
- Development Platforms: ML310, ML403, and custom evaluation boards
Support Resources
- Technical Support: 24/7 online support portal and community forums
- Training: Xilinx University Program and online learning modules
- Design Services: Xilinx Alliance Program partners for custom designs
- Third-party IP: Extensive ecosystem of compatible IP providers
Application Areas
- Digital Signal Processing: FIR/IIR filters, FFT processing
- Communications: Protocol processing, baseband processing
- Industrial Control: Motor control, sensor interfaces
- Automotive: ADAS systems, infotainment processing
- Medical Devices: Imaging systems, patient monitoring
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU RoHS directive requirements
- REACH Compliance: Registered under EU REACH regulation
- Conflict Minerals: 3TG conflict-free certified
- Green Certification: Xilinx Green product designation
- Packaging: Lead-free, halogen-free package options available
Quality Standards
- Quality Grade: Industrial temperature range (-40ยฐC to +85ยฐC)
- Reliability: MTBF >1M hours at 55ยฐC
- Quality System: ISO 9001:2015 certified manufacturing
- Testing: 100% production tested and burned-in
- Moisture Sensitivity: MSL Level 3
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS Code: 8542.31.0001
- Country of Origin: Various (see product marking)
- Export Restrictions: Subject to US export administration regulations
- License Requirements: May require export license for certain destinations
Safety Certifications
- UL Recognition: File E164464
- CE Marking: Compliant with EMC and Low Voltage Directives
- FCC Compliance: Part 15 Class B digital device
- IC Certification: Industry Canada ICES-003 compliant
Shipping and Handling
- ESD Sensitivity: Class 1 (>2kV HBM)
- Storage Conditions: -55ยฐC to +150ยฐC storage temperature
- Shelf Life: 10+ years with proper storage
- Packaging: Anti-static tray packaging for component protection
The XC2S300E-6FG456I represents Xilinx’s commitment to delivering high-performance, cost-effective FPGA solutions for today’s demanding applications. For additional technical support, pricing information, or custom configuration requirements, contact your local Xilinx representative or authorized distributor.
