1. Product Specifications
Core Architecture
- Part Number: XC2S300E-7FG456C
- Family: Spartan-IIE 1.8V FPGA
- System Gates: 300,000 gates
- Logic Cells: 6,912 cells
- Technology Node: 0.15 micron CMOS process
- Supply Voltage: 1.8V core voltage
Performance Characteristics
- Speed Grade: -7 (400MHz maximum frequency)
- Maximum Operating Frequency: Up to 400MHz
- CLBs (Configurable Logic Blocks): 1,536
- Total Distributed RAM: Up to 221,184 bits
- Block RAM: Up to 288K bits
Package & Physical Specifications
- Package Type: FG456C (Fine-pitch Ball Grid Array)
- Pin Count: 456 pins
- Package Size: 23mm x 23mm
- Ball Pitch: 1.0mm
- Operating Temperature Range: Commercial (0ยฐC to +85ยฐC)
I/O & Interface Features
- User I/O Pins: Up to 333 user I/O
- I/O Standards: 19 selectable I/O standards supported
- Voltage Levels: 1.2V to 3.3V I/O support
- DLLs (Delay-Locked Loops): 4 integrated DLLs for clock management
Memory Architecture
- SelectRAM Hierarchical Memory:
- 16 bits/LUT distributed RAM
- Configurable 4K-bit true dual-port block RAM
- Flexible memory implementation options
2. Pricing Information
Current Market Pricing (2025)
- Typical Unit Price: $35.00 – $45.00 USD (varies by distributor and quantity)
- Volume Pricing: Available for quantities of 100+ units
- Lead Time: 2-4 weeks for standard orders
- Availability: Limited stock available through authorized distributors
Ordering Information
- Minimum Order Quantity (MOQ): Typically 1-25 pieces depending on distributor
- Packaging Options: Tray packaging standard
- Alternative Grades Available:
- XC2S300E-6FG456C (slower speed grade)
- XC2S300E-4FG456C (industrial temperature range)
3. Documents & Media
Technical Documentation
- Official Datasheet: [DS077 – Spartan-IIE FPGA Family Data Sheet]
- User Guide: Spartan-IIE FPGA User Guide
- Application Notes:
- XAPP151: Virtex Series Configuration Architecture
- XAPP052: Efficient Shift Registers, LFSR Counters
- XAPP174: ClockDLL Technology and Applications
Design Resources
- Development Software: AMD Vivado Design Suite, ISE Design Suite (legacy)
- IP Cores: Compatible with Xilinx LogiCORE IP library
- Reference Designs: Available through AMD developer resources
- PCB Layout Guidelines: Package-specific layout recommendations
- Thermal Management Guidelines: Junction temperature and thermal resistance data
Support Materials
- Pinout Information: Complete pin assignment and ball map documentation
- IBIS Models: Available for signal integrity analysis
- BSDL Files: Boundary scan description files for testing
- Timing Models: Setup, hold, and propagation delay specifications
4. Related Resources
Development Tools & Software
- AMD Vivado Design Suite: Primary development environment for newer projects
- ISE Design Suite 14.7: Legacy tool support for existing designs
- ModelSim/QuestaSim: Simulation and verification tools
- ChipScope Pro: Integrated logic analyzer for debugging
Evaluation & Development Boards
- Spartan-IIE Starter Kit: Entry-level development platform
- Third-party Development Boards: Various options from partners
- Evaluation Modules: Custom evaluation solutions available
Compatible Devices & Alternatives
- Higher Density Options:
- XC2S400E-7FG456C (400K gates)
- XC2S600E-7FG456C (600K gates)
- Alternative Packages:
- XC2S300E-7FT256C (256-pin FTBGA)
- XC2S300E-7PQ208C (208-pin PQFP)
Technical Support
- AMD Support Center: Online technical support and documentation
- Community Forums: Active user community and design discussions
- Training Resources: Online courses and webinars
- Design Services: Professional design and consultation services
5. Environmental & Export Classifications
Environmental Compliance Status
- RoHS Compliance: โ ๏ธ NOT RoHS Compliant – Fails to meet current RoHS standards
- REACH Regulation: Under evaluation for SVHC (Substances of Very High Concern)
- Lead Content: Contains lead in solder bumps and internal connections
- Environmental Status: NOT RECOMMENDED for NEW DESIGNS due to environmental restrictions
Regulatory Classifications
- ECCN (Export Control Classification Number): 3A991.d
- USHTS (US Harmonized Tariff Schedule): 8542310060
- TARIC Code: 8542399000
- Country of Origin: Various (Malaysia, China, depending on manufacturing facility)
Packaging & Material Information
- MSL (Moisture Sensitivity Level): Level 3 (168 hours floor life at โค30ยฐC/60% RH)
- Package Material: FR4 substrate with solder ball array
- Die Attach: Lead-containing high-temperature solder
- Wire Bonds: Gold wire bonds (lead-free)
Disposal & Recycling
- WEEE Directive: Subject to electronic waste recycling requirements in EU
- Conflict Minerals: Compliant with conflict-free sourcing requirements
- Recyclability: Limited due to hazardous material content
Important Environmental Notes
- โ ๏ธ Design Recommendation: This device is marked as “NOT RECOMMENDED for NEW DESIGN” due to environmental compliance issues
- Alternative Solutions: Consider newer Spartan-7 or Artix-7 series for new designs requiring environmental compliance
- Legacy Support: Suitable for maintenance and repair of existing systems
- Handling Precautions: Follow proper ESD and environmental handling procedures
Application Areas
The XC2S300E-7FG456C is ideal for:
- Communications Infrastructure: Network switching and routing equipment
- Industrial Control Systems: Automation and process control applications
- Test & Measurement: High-speed data acquisition and processing
- Legacy System Maintenance: Replacement parts for existing designs
- Prototyping & Development: Educational and research applications
Note: For new designs requiring environmental compliance, consider migrating to current-generation Spartan-7 or Artix-7 FPGAs that offer improved performance and full RoHS compliance.
Last Updated: July 2025 | Product information subject to change without notice
