Product Specifications
Core Specifications
- Part Number: XC2S400E-6FGG456I
- Family: Spartan-IIE 1.8V FPGA
- Logic Elements: 10,800 cells
- System Gates: 400,000
- Block RAM: 160K bits (40 blocks x 4K bits each)
- Distributed RAM: 153,600 bits
- CLB Array: 40 x 60
- Maximum I/O: 329 user I/O pins
Electrical Characteristics
- Core Voltage (VCCINT): 1.8V ยฑ5%
- I/O Voltage (VCCO): 1.5V, 2.5V, or 3.3V
- Speed Grade: -6 (357MHz maximum frequency)
- Process Technology: 0.15ฮผm CMOS
- Operating Temperature: Industrial (-40ยฐC to +100ยฐC)
Package Information
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 456 pins
- Package Size: 23mm x 23mm x 2.6mm
- Ball Pitch: 1.0mm
- Lead-Free: Yes (RoHS compliant)
Memory Configuration
- Block RAM: 40 blocks of 4K bits each (160K bits total)
- Distributed RAM: Up to 153,600 bits using LUTs
- RAM Configurations: 16-bit/LUT distributed, 4K-bit dual-port block
- Memory Interface: Fast interfaces to external RAM
Price Information
Note: The XC2S400E-6FGG456I is marked as NOT RECOMMENDED FOR NEW DESIGNS by Xilinx. This product has been discontinued and is now obsolete. Please contact authorized distributors for:
- Current stock availability and pricing
- Recommended replacement parts
- Migration path to newer FPGA families
- Custom quotation based on quantity requirements
Typical Pricing Range: Contact distributors for competitive pricing on available inventory.
Documents & Media
Official Documentation
- Datasheet: DS077 Spartan-IIE FPGA Family Data Sheet (August 9, 2013)
- User Guide: Spartan-IIE FPGA User Guide
- Application Notes:
- XAPP179: Using SelectIO Interfaces in Spartan-II and Spartan-IIE FPGAs
- XAPP173: Block RAM Usage in Spartan-IIE FPGAs
- XAPP174: DLL Usage in Spartan-IIE FPGAs
- XAPP176: Configuration and Readback Guide
Development Resources
- Software: Xilinx ISE Design Suite (legacy support)
- IP Cores: Available through Xilinx CORE Generator
- Reference Designs: Multiple application-specific designs
- IBIS Models: Available for signal integrity analysis
Package and Pinout Information
- Pinout Tables: Complete pin assignments and differential pairs
- Package Drawings: Mechanical specifications and dimensions
- Thermal Data: Junction-to-ambient thermal resistance specifications
- BSDL Files: Boundary scan description language files
Related Resources
Development Tools
- Xilinx ISE Design Suite: Primary development environment
- ModelSim: Simulation and verification
- ChipScope Pro: In-system debugging and analysis
- PlanAhead: Design planning and constraint management
Evaluation Boards
- Spartan-IIE Development Kits: For prototyping and evaluation
- Third-party boards: Various options from ecosystem partners
- Custom development platforms: Available from design service providers
Compatible Components
- Configuration PROMs: Platform Flash PROMs for bitstream storage
- Clock Sources: Low-jitter oscillators and clock generators
- Power Management: Voltage regulators for multi-rail power systems
- Interface Components: Level shifters and signal conditioning
Migration Options
Since the XC2S400E-6FGG456I is obsolete, consider these modern alternatives:
- Spartan-7 family: Direct architectural successor
- Artix-7 family: Enhanced performance and features
- Zynq-7000 family: ARM processor + FPGA integration
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Yes (Lead-free package option)
- REACH Compliant: Meets EU chemical regulations
- Conflict Minerals: Compliant with Section 1502 of Dodd-Frank Act
- Halogen-Free: Package materials meet halogen-free requirements
Operating Conditions
- Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 95% non-condensing
- Thermal Resistance: ฮธJA = 17.7ยฐC/W (still air)
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.2
- Schedule B Number: 8542.31.0001
- CCATS (Commodity Classification Automated Tracking System): Available upon request
- Country of Origin: Various (check specific lot markings)
Quality and Reliability
- Quality Standard: ISO 9001:2015 certified manufacturing
- Reliability Testing: JEDEC standards compliance
- Mean Time to Failure (MTTF): >1,000,000 hours at operating conditions
- Qualification Level: Industrial grade qualification
Packaging and Handling
- Moisture Sensitivity Level (MSL): Level 3
- Storage Requirements: Dry pack with desiccant
- ESD Sensitivity: Class 2 (>2000V HBM)
- Handling Precautions: Use proper ESD protection procedures
Note: This product is obsolete and not recommended for new designs. Please consult with Xilinx or authorized distributors for current FPGA recommendations and migration paths.
