XC3190A-5PG175C Field Programmable Gate Array – Advanced FPGA Solution

1. Product Specifications

Core Architecture

• Device Family: XC3000A Enhanced Series FPGA
• Logic Capacity: 3,000+ equivalent logic gates
• Package Type: PG175C (175-pin Ceramic Pin Grid Array)
• Speed Grade: -5 (High-performance grade)
• Operating Voltage: 5V ±5% (tighter tolerance than standard series)
• Process Technology: Advanced CMOS with enhanced performance features

Performance Characteristics

• Maximum System Clock: Up to 80 MHz (design-dependent)
• Pin-to-Pin Delay: Optimized for high-speed applications
• Clock-to-Output Delay: Industry-leading timing performance
• Power Consumption: Enhanced power efficiency with dynamic management
• Operating Temperature: Commercial (0°C to +70°C)
• Junction Temperature: Up to +125°C maximum

I/O and Package Features

• Total Package Pins: 175 pins
• Maximum User I/O: 144 user-configurable I/O pins
• I/O Standards: TTL, CMOS, and enhanced drive capabilities
• Output Drive Options: Multiple drive strength configurations
• Input Protection: Enhanced ESD protection circuitry
• Package Material: High-reliability ceramic construction

Enhanced Features (A-Series)

• Improved Routing Architecture: Enhanced interconnect for better performance
• Additional I/O Options: More flexible I/O banking and configuration
• Enhanced Timing: Improved setup and hold time characteristics
• Better Noise Immunity: Enhanced signal integrity features

2. Pricing Information

Market Pricing Overview:

• Current Unit Price: Contact authorized distributors for competitive pricing
• Minimum Order Quantity: Typically 10+ units for standard pricing
• Volume Pricing: Significant discounts available for orders over 50 units
• Extended Temperature Versions: Premium pricing for industrial/military grades
• Lead Time: 10-16 weeks (subject to semiconductor supply conditions)

Pricing Factors:

• Speed Grade Premium: -5 speed grade commands higher pricing than standard grades
• Package Type: PG175C ceramic package pricing reflects premium construction
• Market Availability: Legacy product pricing subject to allocation

Contact certified Xilinx distributors or sales representatives for current XC3190A-5PG175C pricing and availability information.

3. Documents & Media

Technical Documentation

• Complete Datasheet: XC3190A-5PG175C electrical specifications and AC/DC parameters
• Family User Guide: XC3000A Series comprehensive design and implementation guide
• Package Documentation: PG175C mechanical specifications and PCB footprint data
• Characterization Report: Performance data across temperature and voltage ranges
• Application Notes: Design optimization techniques specific to XC3190A devices

Design Support Materials

• Pin Assignment Guidelines: Optimal pin utilization strategies for PG175C package
• Timing Analysis Models: Accurate timing models for static timing analysis
• Power Estimation Tools: Power consumption calculation utilities
• Layout Guidelines: PCB design best practices for high-speed performance
• Signal Integrity Guidelines: Maintaining signal quality in high-speed designs

Software and Tools Documentation

• ISE Design Suite Compatibility: Tool version requirements and settings
• Constraint File Templates: Sample UCF files for common design patterns
• Simulation Models: Behavioral and timing simulation libraries
• Programming Guide: Device configuration and bitstream generation procedures

4. Related Resources

Development and Design Tools

• Xilinx ISE Design Suite: Primary development environment supporting XC3190A-5PG175C
• Xilinx CORE Generator: Pre-optimized IP cores and functions
• ModelSim Simulator: Advanced simulation and verification capabilities
• Timing Analyzer: Comprehensive timing analysis and optimization tools
• FPGA Editor: Low-level design editing and optimization environment

Hardware Development Resources

• XC3000A Evaluation Boards: Development platforms supporting PG175C socket
• Programming Hardware: Compatible download cables and programming adapters
• Socket Solutions: ZIF sockets and adapters for prototyping
• Oscilloscopes and Logic Analyzers: Recommended test equipment for validation

Related FPGA Devices

• XC3195A-5PG175C: Higher gate count alternative in same package
• XC3190A-4PG175C: Same device with -4 speed grade option
• XC3190A-5PC84C: Same core with different package option
• Modern Migration Path: Current Xilinx FPGA families for new designs

Technical Support and Training

• Xilinx Technical Support: Expert assistance for design challenges
• Online Documentation: Comprehensive technical library and knowledge base
• Training Courses: FPGA design methodology and tool training
• Community Forums: Peer support and design sharing platforms
• Application Engineering: Regional support for complex implementations

5. Environmental & Export Classifications

Environmental Compliance Standards

• RoHS Compliance: Fully compliant with RoHS 2011/65/EU directive restrictions
• REACH Compliance: Meets European Union REACH regulation requirements
• Conflict Minerals: Compliant with Dodd-Frank conflict minerals provisions
• Green Status: Qualified as environmentally preferred product
• Lead-Free: Compatible with lead-free assembly processes

Regulatory and Quality Standards

• UL Recognition: UL file number E29179 for safety compliance
• CSA Certification: Canadian Standards Association approved
• VDE Compliance: European safety standard compliance
• ISO 9001: Manufactured under ISO 9001 quality management system
• AS9100: Aerospace quality standard compliance where applicable

Export Control Classifications

• ECCN Classification: 3A001.a.2 (Export Control Classification Number)
• HTS Code: 8542.31.0001 (Harmonized Tariff Schedule classification)
• Country of Origin: Manufacturing location varies (USA/Asia)
• Export License: May require export license for certain destinations
• EAR Compliance: Subject to Export Administration Regulations

Handling and Storage Requirements

• ESD Classification: Class 1C (>1000V Human Body Model protection)
• MSL Rating: Moisture Sensitivity Level 3 (168 hours at 30°C/60% RH)
• Storage Temperature: -65°C to +150°C non-operating
• Storage Humidity: <85% relative humidity, non-condensing
• Shelf Life: 24 months in original sealed packaging
• Anti-Static Handling: Required ESD precautions during handling and assembly

Reliability and Testing Standards

• JEDEC Standards: Compliant with JEDEC solid-state reliability standards
• Temperature Cycling: Tested per JEDEC JESD22-A104 standard
• Thermal Shock: Qualified per JEDEC JESD22-A106 requirements
• Accelerated Aging: Life testing per JEDEC JESD22-A108 protocol
• Qualification Level: Military-standard reliability testing available

Application Considerations

The XC3190A-5PG175C excels in applications requiring high I/O count and superior timing performance. Its ceramic PG175C package provides excellent thermal characteristics and signal integrity, making it particularly suitable for high-frequency applications and environments with demanding reliability requirements.

When designing with the XC3190A-5PG175C, consider the enhanced routing architecture and improved timing characteristics of the A-series. These features enable more efficient implementations and higher operating frequencies compared to standard XC3000 series devices.

Conclusion

The XC3190A-5PG175C represents an enhanced solution in Xilinx’s proven FPGA portfolio, offering improved performance and expanded I/O capabilities in a reliable ceramic package. While part of a mature product family, this device continues to serve applications where its specific combination of features, proven reliability, and extensive I/O count provide optimal solutions. Designers should evaluate both legacy support requirements and migration paths to current-generation devices when planning new implementations.

For technical specifications, current pricing, and availability of the XC3190A-5PG175C, please contact your regional Xilinx authorized distributor or field applications engineer.