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XC3195A-3PG175C – High-Performance FPGA Solution

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Technical Specifications – XC3195A-3PG175C

Parameter Specification
Part Number XC3195A-3PG175C
Family XC3000A Series
Package Type PG175 (Plastic Grid Array)
Speed Grade -3 (High Performance)
Logic Cells [Verify with datasheet]
System Gates [Verify with datasheet]
CLB Matrix [Verify with datasheet]
Total I/O Pins 175
User I/O [Verify with datasheet]
RAM Bits [Verify with datasheet]
Operating Temperature Commercial: 0ยฐC to +70ยฐC
Supply Voltage [Verify with datasheet]
Maximum Frequency [Verify with datasheet]

Package Information

  • Package: 175-pin Plastic Grid Array (PG175)
  • Dimensions: [Verify with datasheet]
  • Pin Pitch: [Verify with datasheet]
  • Thermal Characteristics: [Verify with datasheet]

2. Pricing Information

Note: Pricing for the XC3195A-3PG175C varies based on quantity, distributor, and market conditions.

Estimated Price Ranges:

  • Single Unit: Contact distributor for current pricing
  • Volume Pricing: Available for quantities of 100+ units
  • Production Quantities: Competitive pricing for 1000+ units

Where to Buy XC3195A-3PG175C:

  • Authorized distributors
  • Electronic component suppliers
  • Direct from manufacturer
  • Online electronics marketplaces

For current XC3195A-3PG175C pricing and availability, contact your preferred distributor or request a quote.

3. Documents & Media

Technical Documentation

  • Datasheet: XC3195A-3PG175C Complete Specifications
  • User Guide: Programming and Configuration Manual
  • Application Notes: Design considerations and best practices
  • Reference Manual: Detailed architecture and timing information
  • Errata: Known issues and workarounds
  • PCB Layout Guidelines: Recommended PCB design practices

Design Resources

  • Development Tools: Compatible software and hardware tools
  • Evaluation Boards: Reference designs and development kits
  • Code Examples: Sample designs and configurations
  • CAD Models: Footprint and 3D models for PCB design
  • Simulation Models: SPICE and behavioral models

Media Resources

  • Product Photos: High-resolution component images
  • Package Drawings: Mechanical specifications and dimensions
  • Pinout Diagrams: Pin configuration and signal descriptions
  • Block Diagrams: Internal architecture overview

4. Related Resources

Compatible Products

  • Configuration Devices: Serial PROMs and other configuration options
  • Development Tools: Programming hardware and software
  • Reference Designs: Application-specific implementations
  • Evaluation Kits: Complete development and prototyping solutions

Application Areas

  • Digital Signal Processing: Filter implementation and signal analysis
  • Communications: Protocol processing and interface conversion
  • Industrial Control: Automation and process control systems
  • Automotive Electronics: Advanced driver assistance systems
  • Aerospace & Defense: Mission-critical applications

Technical Support

  • Design Support: Engineering assistance and consultation
  • Training Resources: Webinars and technical seminars
  • Community Forums: Peer support and knowledge sharing
  • FAQs: Common questions and solutions

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliant: Meets EU RoHS directive requirements
  • REACH Compliant: European chemical regulation compliance
  • Green Package: Environmentally conscious packaging materials
  • Conflict Minerals: Compliant with conflict minerals regulations

Export Control Information

  • ECCN Classification: [Verify current classification]
  • Export License: Check requirements for destination country
  • Country of Origin: [Verify with manufacturer]
  • HS Code: [Verify current harmonized system code]

Quality Standards

  • ISO Certifications: Manufacturing quality standards
  • Automotive Grade: [If applicable – verify AEC-Q100 qualification]
  • Military Standards: [If applicable – verify MIL-STD compliance]
  • Industrial Grade: Operating temperature and reliability specifications

Packaging Information

  • Moisture Sensitivity Level: MSL rating for handling requirements
  • Storage Conditions: Temperature and humidity specifications
  • Shelf Life: Component storage life expectancy
  • Anti-Static Requirements: ESD protection during handling

Why Choose XC3195A-3PG175C?

The XC3195A-3PG175C combines high performance with design flexibility, making it an ideal choice for applications requiring programmable logic solutions. Its robust architecture and comprehensive development ecosystem ensure reliable implementation across various industries.

Get Started Today: Contact your local distributor for XC3195A-3PG175C availability, pricing, and technical support.


Disclaimer: Specifications and availability subject to change. Please verify all technical parameters with official manufacturer documentation before finalizing your design.