“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XC3020-70PG84C – Xilinx XC3000 Series Field Programmable Gate Array (FPGA)

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Features

  • Part Number: XC3020-70PG84C
  • Manufacturer: Xilinx (now AMD)
  • Product Family: XC3000 Series FPGAs (Original Generation)
  • Speed Grade: -70 (70MHz operation)
  • Temperature Grade: Commercial (C suffix)
  • Architecture: Logic Cell Array (LCA)

Technical Specifications

Parameter Specification
Logic Capacity 1000 Gates / 1.5K Gates equivalent
Configurable Logic Blocks (CLBs) 64 CLBs
Logic Elements/Cells 64 Cells
Maximum Frequency 70MHz
Speed Grade -70 (Standard performance)
Toggle Rate 70MHz guaranteed
Logic Delay ~9ns (typical for -70 speed grade)
I/O Capacity Enhanced I/O capability with 84-pin package

Power and Package Details

Parameter Specification
Supply Voltage 5V (Operating)
Package Type 84-Pin CPGA (Ceramic Pin Grid Array)
Package Code CPGA-84
Terminal Configuration Pin/Peg (Through-hole mount)
Number of Terminals 84
Package Shape Square
Package Material Ceramic (High-performance)
Pin Configuration Gold-plated pins in matrix pattern
Mounting Style Through-hole socket or direct solder

Operating Conditions

Parameter Range
Operating Temperature 0ยฐC to +85ยฐC (Commercial grade)
Storage Temperature -65ยฐC to +150ยฐC (typical)
Technology CMOS Static Memory Technology
Performance Class Standard 70MHz grade

2. Pricing Information

Current Market Pricing

The XC3020-70PG84C is a legacy/obsolete component from the original XC3000 series with pricing reflecting its historic significance and ceramic package premium. The FPGAkey search engine monitors the XC3020-70PG84C inventory quantity and price of global electronic component suppliers in real time.

Reference Pricing:

  • FOB Price Range: $515.025 – $572 (1 piece minimum order)
  • Package Premium: Higher cost due to ceramic package construction
  • Historical Significance: Premium for original XC3000 series devices
  • Availability: Limited factory excess stock and franchised distributor sources

Pricing Factors:

  • Ceramic Package: Premium cost for superior thermal and electrical performance
  • Original XC3000 Series: Historical significance as foundational FPGA technology
  • Obsolete Status: Limited availability drives higher pricing
  • 84-Pin Package: Enhanced I/O capability commands premium
  • Condition: New original stock highly valued for legacy applications

Current Market Status:

  • Lead Time: Extended due to obsolete status
  • MOQ: 1 piece minimum order quantity
  • Stock Sources: Factory excess stock and specialized distributors
  • Market Position: Premium legacy component for historical and maintenance applications

3. Documents & Media

Technical Documentation

  • Primary Datasheet: XC3000 Series Logic Cell Array Data Sheet
  • Application Notes: Original Xilinx application notes for XC3000 series implementation
  • Design Guidelines: PCB layout recommendations for 84-pin CPGA package
  • Programming Manual: XACT development system configuration procedures

Development Resources

The XACT development system provides schematic capture and auto place-and-route for design entry. Logic and timing simulation, and in-circuit emulation are available as design verification alternatives. The design editor is used for interactive design optimization, and to compile the data pattern that represents the configuration program.

Available Documentation:

  • Comprehensive XC3000 series datasheet (PDF format)
  • Detailed 84-pin CPGA pinout diagrams and package drawings
  • Electrical characteristics and timing specifications for -70 speed grade
  • CPGA package mechanical drawings and socket recommendations
  • XACT development system user guides and tutorials
  • Original Xilinx application notes and design examples

Legacy Development Tools

The XC3020-70PG84C was developed using the original XACT development environment, representing the foundation of modern FPGA design tools.

Historical Development Environment:

  • XACT Development System: Original Xilinx FPGA design software
  • Schematic Capture: Graphical design entry methods
  • Auto Place-and-Route: Automated implementation tools
  • Logic Simulation: Functional verification capabilities
  • In-Circuit Emulation: Hardware debugging support

4. Related Resources

Compatible Configuration Devices

The XC3020-70PG84C supports various configuration methods typical of the original XC3000 series, including external memory-based configuration storage.

Development Software

For XC3000 series devices, the original XACT development system was the primary design environment, though modern tools may provide limited legacy support.

Historical Software Tools:

  • XACT Development System (original Xilinx FPGA design environment)
  • XACT Design Editor for interactive optimization
  • Legacy simulation and verification tools
  • Original schematic capture and synthesis tools

Pin-Compatible Alternatives

Speed Grade Variants:

  • XC3020-50PG84C (Faster 50MHz performance)
  • XC3020-100PG84C (Slower 100MHz timing)
  • XC3020-70PG84B (Different temperature/package variant)
  • XC3020-70PG84I (Industrial temperature grade)
  • XC3020-70PG84M (Military temperature grade)

Package Alternatives:

  • XC3020-70PC84C (84-pin PLCC plastic package)
  • XC3020-70PC68C (68-pin PLCC package)
  • XC3020-70PQ100C (100-pin PQFP package)

Ceramic Package Advantages

The CPGA (Ceramic Pin Grid Array) package offers several benefits:

  • Superior Thermal Performance: Enhanced heat dissipation capabilities
  • Excellent Electrical Performance: Low inductance and superior signal integrity
  • High Reliability: Ceramic construction for demanding applications
  • Enhanced I/O Density: 84-pin configuration for increased connectivity
  • Gold-Plated Pins: Superior electrical contact and corrosion resistance

Technical Support Services

FPGA technical engineer will help you with the XC3020-70PG84C pinout information, replacement, datasheet in PDF, programming tools, starter kit, and legacy system support.

Available Support:

  • Legacy system maintenance consultation
  • Original XC3000 series technical documentation
  • CPGA package mounting and socket guidance
  • Historical design migration assistance

5. Environmental & Export Classifications

Environmental Compliance Status

Classification Status
RoHS Compliance No RoHS (Legacy product predates RoHS regulations)
Lead Content Contains Lead (Standard for era of manufacture)
Environmental Status Not Applicable (Obsolete legacy product)
REACH Compliance Contact manufacturer for current status

Temperature and Environmental Ratings

  • Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
  • Storage Temperature Range: -65ยฐC to +150ยฐC (typical)
  • Humidity: Standard commercial environment
  • Temperature Classification: Commercial grade (C suffix designation)
  • Package Rating: Ceramic package suitable for demanding environments

Package and Handling Classifications

  • Package Material: Ceramic (CPGA – Ceramic Pin Grid Array)
  • Terminal Finish: Gold-plated pins for superior electrical contact
  • MSL Rating: Not applicable (ceramic package, not moisture sensitive)
  • ESD Classification: Handle with standard ESD precautions
  • Mounting: Through-hole socket or direct PCB solder mounting

Trade and Export Information

  • ECCN Classification: Consult current export control regulations
  • Harmonized Tariff Code: 8542.33.0001 (typical for integrated circuits)
  • Country of Origin: Varies by manufacturing date and facility
  • Documentation: Certificate of Conformance available for qualified applications
  • Lifecycle Status: Obsolete (no longer in production)

Ceramic Package Considerations

  • Thermal Expansion: Consider CTE matching with PCB materials
  • Socket Compatibility: Use appropriate CPGA sockets for removable applications
  • PCB Layout: Enhanced thermal and electrical design requirements
  • Environmental Ruggedness: Superior performance in demanding conditions

Applications and Use Cases

Historical and Legacy Applications

The XC3020-70PG84C is particularly suited for:

  • Legacy System Maintenance: Original XC3000 series replacement needs
  • Historical Preservation: Maintaining vintage computer and electronic systems
  • Educational Applications: Teaching FPGA fundamentals and history
  • Museum and Archive Systems: Preserving original electronic designs
  • Research Applications: Historical technology studies and analysis

Ceramic Package Benefits

  • High-Reliability Applications: Superior package reliability
  • Thermal-Critical Designs: Enhanced heat dissipation requirements
  • Electrical Performance: Low-inductance, high-speed applications
  • Harsh Environments: Applications requiring robust packaging
  • Long-Term Reliability: Extended operational lifetime requirements

System Integration Considerations

  • Socket Mounting: Removable installation for maintenance access
  • Thermal Management: Enhanced cooling capabilities with ceramic package
  • PCB Design: Specialized layout for 84-pin CPGA footprint
  • Legacy Compatibility: Maintaining original system specifications
  • Configuration Methods: Traditional external memory-based programming

Summary

The XC3020-70PG84C represents a significant piece of FPGA history as part of Xilinx’s original XC3000 series that established the Field Programmable Gate Array as a revolutionary technology. The XC3020-70PG84C manufactured by Xilinx is FPGA XC3000 Family 1.5K Gates 64 Cells 70MHz 5V 84-Pin CPGA, offering the proven architecture that launched the programmable logic revolution.

This historic FPGA features the same fundamental 64 CLB, 1000 gate architecture that defined early FPGA capabilities, housed in a premium 84-pin ceramic pin grid array package that provides superior thermal and electrical performance compared to plastic alternatives. The ceramic package construction offers enhanced reliability and performance characteristics ideal for demanding applications and long-term operation.

As an obsolete product with significant historical importance, the XC3020-70PG84C remains valuable for legacy system maintenance, educational purposes, and applications requiring the specific characteristics of the original XC3000 architecture. The ceramic package provides additional benefits for applications requiring superior thermal management, electrical performance, and long-term reliability.

While modern FPGAs offer vastly superior performance and capabilities, the XC3020-70PG84C continues to serve critical roles in maintaining existing systems and providing insight into the foundational technology that established Xilinx as the inventor of the FPGA and created an entire industry around programmable logic devices.