XC3030-70PC68C Compact FPGA – Complete Product Guide & Technical Specifications

1. Product Specifications

Complete Technical Specifications – XC3030-70PC68C

Parameter	Specification
Part Number	XC3030-70PC68C
Manufacturer	AMD (formerly Xilinx)
Product Family	XC3000 Series Commercial FPGA
Speed Grade	-70 (70MHz maximum frequency)
Temperature Grade	Commercial (0°C to +70°C)
Package Type	68-Pin PLCC (Plastic Leaded Chip Carrier)
Package Dimensions	24.23mm x 24.23mm x 4.57mm
Logic Architecture	100 Configurable Logic Blocks (CLBs)
Gate Equivalent	~2,000 gates (1,500 usable gates)
Total RAM Bits	22,176 bits
User I/O Pins	58 bidirectional pins
Maximum Clock Frequency	70 MHz
Operating Voltage	4.75V to 5.25V (5V ± 5%)
Combinatorial Delay (CLB)	9.0ns maximum
Technology Process	CMOS static memory configuration
Configuration Method	SRAM-based reprogrammable

Advanced Architecture Details

The XC3030-70PC68C features identical internal logic to the 84-pin version but with optimized pin allocation for compact applications:

Core Logic Resources:

• 100 Configurable Logic Blocks (CLBs) in 10×10 array arrangement
• Input/Output Blocks (IOBs) with flexible electrical characteristics
• Programmable Interconnect Matrix for flexible signal routing
• Configuration Storage using internal SRAM technology

Performance Features:

• Global Clock Networks with low-skew distribution
• High-Speed Interconnect for critical timing paths
• TTL/CMOS Compatible I/O with programmable input thresholds
• 3-State Bus Support for internal bus architectures
• On-Chip Oscillator amplifier for crystal connections

Pin Configuration & Package Comparison

68-Pin PLCC Package Advantages:

• Reduced Footprint: 24.23mm x 24.23mm vs. 29.31mm x 29.31mm (84-pin)
• Lower Cost: Fewer pins reduce package and assembly costs
• Board Space Savings: 30% smaller PCB footprint than 84-pin version
• Suitable I/O Count: 58 pins adequate for many applications

Pin Allocation Breakdown:

• Total Pins: 68 pins in J-lead configuration
• User I/O Pins: 58 configurable as input, output, or bidirectional
• Power Supply Pins: VCC (+5V), GND (multiple pins)
• Configuration Pins: Programming and mode control
• Clock Inputs: Dedicated global clock inputs
• Control Signals: RESET, DONE, PROGRAM_B

I/O Pin Comparison:

• XC3030-70PC68C: 58 user I/O pins
• XC3030-70PC84C: 74 user I/O pins
• Pin Savings: 16 fewer I/O pins, 23% reduction in package size

2. Pricing Information

Current Market Pricing for XC3030-70PC68C

Important Notice: The XC3030-70PC68C is classified as an obsolete/legacy product with limited availability from specialized distributors.

Market Price Ranges:

Quantity Range	Price Per Unit (USD)	Typical Condition
1-9 pieces	$16-30	New Old Stock
10-49 pieces	$14-25	New/Refurbished
50-199 pieces	$11-20	Mixed condition
200+ pieces	Contact for quotes	Volume pricing

Cost Advantages vs. 84-Pin Version:

• 10-15% Lower Cost: Reduced package complexity
• Assembly Savings: Fewer solder joints, faster placement
• PCB Cost Reduction: Smaller footprint, simpler routing
• Better Availability: More inventory due to space-saving popularity

Where to Purchase XC3030-70PC68C

Primary Distribution Channels:

• IC Components – New original stock with 55+ pieces available
• DigiPart – Electronic component aggregator with multiple suppliers
• Specialty Parts Inc. – Refurbished components with 25-year experience
• FPGAkey – Global FPGA component marketplace

Online Marketplaces:

• Electronic surplus dealers – Used and new old stock
• Industrial component brokers – Obsolete parts specialists
• Auction sites – Individual and bulk lots
• OEM equipment refurbishers – Harvested components

Procurement Considerations:

• Verify authenticity and electrical specifications
• Request proper anti-static packaging and handling
• Consider purchasing extra units due to obsolescence
• Validate date codes and storage conditions

Pricing reflects market conditions as of 2025. Contact suppliers for current availability and volume discounts.

3. Documents & Media

Essential Technical Documentation

Core Documentation for XC3030-70PC68C:

1. XC3000 Family Datasheet – Complete electrical specifications and timing parameters
2. 68-Pin PLCC Package Guide – Mechanical specifications and footprint details
3. Pin Assignment Documentation – Detailed pinout with signal descriptions
4. Application Guidelines – Design recommendations for 68-pin package
5. Package Migration Guide – Comparison with 84-pin and other package options

Development Tools & Software Support

Legacy Development Environment:

• XACT Development System – Original Xilinx design tools (discontinued)
• Foundation Series – Schematic capture and place-and-route
• Alliance Series – Advanced FPGA development platform

Last Supported Modern Tools:

• ISE Design Suite 14.7 – Final version supporting XC3000 series
• WebPACK ISE – Free version with limited XC3000 support
• Third-Party Synthesis Tools – Alternative VHDL/Verilog compilers

Programming and Configuration:

• Bitstream Generation – Device configuration file creation
• PROM Programming – Serial configuration memory support
• JTAG Interface – Boundary scan testing and debugging
• Parallel Configuration – Direct programming methods

Design Resources & Reference Materials

Application Examples:

• Space-constrained embedded controller designs
• Communication interface implementations
• Digital signal processing applications
• Educational and prototyping projects

Key Application Notes:

• XAPP003 – XC3000 68-Pin Package Design Guidelines
• XAPP028 – I/O Optimization for Reduced Pin Count Packages
• XAPP045 – Migration from 84-Pin to 68-Pin Packages
• XAPP065 – PCB Layout Best Practices for Compact FPGAs

Media Resources:

• High-resolution package photographs and dimensions
• PCB footprint CAD files and libraries
• Pin assignment charts and signal reference guides
• Comparative analysis charts vs. other package options

4. Related Resources

Package Variants & Alternatives

XC3030 Package Family:

• XC3030-70PC44C – Ultra-compact 44-pin PLCC (44 I/O pins)
• XC3030-70PC68C – This device – compact 68-pin PLCC (58 I/O pins)
• XC3030-70PC84C – Standard 84-pin PLCC (74 I/O pins)
• XC3030-70PG84C – Pin grid array version (74 I/O pins)

Speed Grade Alternatives:

• XC3030-50PC68C – Lower speed grade (50MHz operation)
• XC3030-100PC68C – Higher performance (100MHz operation)
• XC3030-70PC68I – Industrial temperature range (-40°C to +85°C)

Logic Capacity Alternatives:

• XC3020-70PC68C – Smaller capacity (64 CLBs, 48 I/O pins)
• XC3042-70PC68C – Increased capacity (144 CLBs, 58 I/O pins)

Modern FPGA Migration Strategy

Recommended Upgrade Paths:

• Spartan-3E Series – Direct architectural successor with pin compatibility options
• Spartan-6 LX Series – Modern alternative with migration tools and compact packages
• Spartan-7 Series – Latest technology with backward compatibility features

Migration Considerations for Compact Packages:

• I/O Planning: Optimize pin usage for reduced count packages
• Voltage Level Translation: 5V to modern 3.3V/1.8V systems
• Package Footprint: Modern alternatives in similar form factors
• Tool Chain Updates: Transition from ISE to Vivado Design Suite

Development Resources & Support

Evaluation and Prototyping:

• Custom PCB development for 68-pin PLCC packages
• Adapter boards for breadboard prototyping
• Socket solutions for development and testing

Design Services:

• Legacy FPGA Consultants – Specialists in XC3000 series design
• PCB Layout Services – Optimized routing for compact packages
• Design Migration Services – Upgrade to modern FPGA families

Community Resources:

• Vintage Computing Forums – Legacy FPGA user communities
• Academic Institutions – Universities with XC3000 expertise
• Open Source Projects – Reverse engineering and documentation efforts

Technical Support & Documentation

Expert Assistance:

• AMD/Xilinx legacy product support (limited)
• Independent FPGA design consultants
• Electronic component testing and validation services
• Reverse engineering for lost design files

Documentation Archives:

• Legacy Xilinx documentation repositories
• Technical paper databases and research publications
• Educational course materials and tutorials
• Community-maintained knowledge bases

5. Environmental & Export Classifications

Environmental Specifications & Compliance

Operating Environmental Conditions:

• Temperature Range: 0°C to +70°C (Commercial grade specification)
• Storage Temperature: -65°C to +150°C (Non-operating storage)
• Relative Humidity: 85% non-condensing during operation
• Junction Temperature: Maximum +125°C with appropriate thermal design

Thermal Management:

• Thermal Resistance (θJA): ~32°C/W in still air (68-pin package advantage)
• Lower Power Dissipation: Improved thermal performance vs. larger packages
• Heat Sink Compatibility: Standard mounting options available
• Operating Altitude: Up to 2,000 meters standard conditions

Physical Durability Specifications:

• Vibration Resistance: Commercial electronics standards compliance
• Shock Tolerance: Suitable for standard transportation and handling
• Moisture Sensitivity: Level 3 per JEDEC J-STD-020 standard
• Lead-Free Compatibility: Package suitable for lead-free soldering processes

Package Construction & Materials

Package Material Specifications:

• Body Material: UL94-V0 rated flame-retardant plastic compound
• Lead Frame: Copper alloy with tin-lead plating finish
• Die Attachment: Gold-silicon eutectic for thermal and electrical performance
• Wire Bonding: Gold wire for reliable electrical connections

Environmental Impact Information:

• Lead Content: Contains lead in package construction (Pre-RoHS manufacturing)
• Precious Metal Content: Gold content suitable for recovery in large quantities
• Recycling Requirements: Electronic waste disposal following local regulations
• Package Size Advantage: Reduced material usage vs. larger packages

Regulatory Compliance & Standards

Quality and Manufacturing Standards:

• ISO 9001: Manufactured under certified quality management systems
• JEDEC Compliance: Meets solid-state technology reliability standards
• IPC Standards: Compatible with standard PCB assembly processes
• ESD Protection: Proper handling procedures for static-sensitive devices

RoHS Compliance Status:

• Current Classification: Non-RoHS compliant (legacy manufacturing)
• Lead Content: Package contains lead in solder plating
• Modern Alternatives: Contact suppliers for RoHS-compliant replacement options
• Grandfathering: Existing inventory exempt from RoHS restrictions

Export Control & International Trade

Export Control Classification:

• ECCN Classification: 3A001.a.7 (General-purpose integrated circuits)
• Export License: No License Required (NLR) for most commercial destinations
• Restricted Countries: Check current BIS Entity List for export restrictions

International Trade Information:

• Country of Origin: United States (Xilinx/AMD manufacturing)
• Harmonized Tariff Code: 8542.31.0001 (Microprocessors and controllers)
• Trade Agreement Eligibility: NAFTA/USMCA preferential treatment available
• Documentation: Standard commercial electronics export classification

Import/Export Considerations:

• No special licensing required for standard commercial applications
• Military or aerospace end-use may require additional documentation
• Dual-use technology considerations for certain applications
• Customs documentation available from authorized distributors

Disposal & Lifecycle Management

End-of-Life Considerations:

• Electronic Waste Classification: Requires certified e-waste recycling
• Precious Metal Recovery: Gold and copper recovery economically viable
• Lead Disposal: Hazardous material handling for lead-containing components
• Documentation Requirements: Maintain disposal records for compliance

Sustainable Practices:

• Inventory Management: Plan for long-term component availability
• Design Migration: Develop transition plans to modern, RoHS-compliant alternatives
• Component Reuse: Consideration for equipment refurbishment applications
• Packaging Optimization: Compact package reduces overall material usage

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Summary

The XC3030-70PC68C represents an optimal balance of performance, space efficiency, and cost-effectiveness from AMD’s XC3000 legacy FPGA series. This compact 68-pin PLCC device delivers the same 100 configurable logic blocks and 70MHz performance as larger package variants while offering significant space and cost savings for commercial applications with moderate I/O requirements.

Space-Optimized Advantages of XC3030-70PC68C:

• ✅ Compact Footprint – 30% smaller PCB area than 84-pin equivalent
• ✅ Cost-Effective Design – Reduced package costs and assembly complexity
• ✅ Adequate I/O Count – 58 user pins sufficient for many applications
• ✅ Standard SMT Package – Compatible with automated assembly processes
• ✅ Proven Reliability – Same internal architecture as larger variants

Ideal Applications:

• Space-constrained embedded systems
• Cost-sensitive consumer electronics
• Educational and research projects
• Prototyping and development systems
• Legacy system upgrades with size constraints
• Industrial control with limited I/O requirements

Technical Highlights:

• Identical 100 CLB internal architecture to 84-pin version
• 58 user I/O pins providing flexible interface capabilities
• 70MHz operation suitable for moderate-speed applications
• 5V operation maintaining compatibility with legacy systems
• SRAM-based configuration enabling unlimited reprogrammability

Design Considerations:

• I/O Planning: Careful pin assignment required due to reduced pin count
• Thermal Management: Improved thermal characteristics due to smaller package
• PCB Layout: Compact footprint enables higher integration density
• Cost Optimization: Lower overall system cost through reduced package complexity

While the XC3030-70PC68C is now classified as obsolete, it remains highly valuable for space-critical applications and cost-sensitive designs where 58 I/O pins are sufficient. The compact 68-pin package offers the best compromise between functionality and form factor in the XC3030 series.

Procurement Strategy:

• Source from specialized obsolete parts distributors for guaranteed authenticity
• Consider adequate backup inventory due to limited long-term availability
• Validate I/O pin count meets application requirements before design commitment
• Plan migration to modern compact FPGA families for new product development

For technical documentation, design support, or sourcing assistance for the XC3030-70PC68C, contact specialized FPGA component distributors or legacy electronics suppliers with XC3000 series expertise.