Product Specifications
Core Features
- Part Number: XC3064A-7TQG144I
- Family: XC3000A Series FPGA
- Logic Cells: 1,200 equivalent gates
- Speed Grade: -7 (High Performance)
- Package Type: TQFP (Thin Quad Flat Pack)
- Pin Count: 144 pins
- Temperature Grade: Industrial (-40ยฐC to +85ยฐC)
Technical Specifications
- Supply Voltage: 5V ยฑ10%
- Logic Blocks: 64 Configurable Logic Blocks (CLBs)
- I/O Pins: Up to 117 user I/O pins
- Flip-Flops: 256 flip-flops
- Programming Technology: SRAM-based configuration
- Configuration Memory: Volatile, requires external configuration device
- Maximum Frequency: Varies by design complexity
- Power Consumption: Low power design optimized for efficiency
Package Details
- Package Dimensions: 20mm x 20mm x 1.4mm (typical TQFP144)
- Pitch: 0.5mm lead spacing
- Lead Material: Tin-plated copper alloy
- Moisture Sensitivity: Level 3
- Storage Temperature: -65ยฐC to +150ยฐC
Pricing Information
The XC3064A-7TQG144I pricing varies based on quantity, supplier, and current market conditions. As a legacy component from Xilinx’s established XC3000A series, pricing considerations include:
Pricing Factors
- Quantity Breaks: Volume discounts available for orders of 100+ units
- Market Availability: Limited production status may affect pricing
- Distribution Channel: Authorized distributors vs. independent suppliers
- Lead Time: Standard vs. expedited delivery options
Cost Considerations
- Competitive pricing for 144-pin TQFP package
- Value-oriented solution for cost-sensitive applications
- Long-term availability through specialized distributors
- Potential NRE (Non-Recurring Engineering) costs for new designs
Note: Contact authorized distributors for current pricing and availability information.
Documents & Media
Technical Documentation
- Datasheet: Comprehensive electrical and mechanical specifications
- User Guide: Detailed implementation guidelines and best practices
- Application Notes: Design examples and optimization techniques
- Errata: Known issues and recommended workarounds
- Migration Guide: Upgrade paths to newer FPGA families
Design Resources
- Pinout Diagrams: Complete pin assignment and signal descriptions
- Package Drawings: Mechanical specifications and land patterns
- Timing Models: Setup, hold, and propagation delay characteristics
- Power Analysis: Consumption estimates and thermal considerations
- Reference Designs: Proven implementation examples
Software Support
- Design Tools: Compatible with legacy Xilinx development environments
- Libraries: Pre-compiled IP cores and design elements
- Simulation Models: VHDL and Verilog behavioral models
- Constraints Files: Timing and placement constraint templates
Related Resources
Compatible Products
- Configuration Devices: XC1700 series PROMs for bitstream storage
- Development Boards: Evaluation platforms featuring XC3064A-7TQG144I
- Programming Cables: Download cables for device configuration
- Software Tools: Xilinx Foundation or Alliance development suites
Design Support
- Reference Manuals: XC3000A Architecture and Implementation guides
- Training Materials: Online courses and technical seminars
- Community Forums: User groups and technical discussion boards
- Technical Support: Application engineer assistance and consultation
Upgrade Path Options
- Modern Alternatives: Equivalent functionality in current FPGA families
- Migration Tools: Automated design conversion utilities
- Compatibility Analysis: Feature comparison and translation guides
- Obsolescence Management: Long-term support and lifecycle planning
Third-Party Ecosystem
- IP Providers: Specialized cores and design services
- Tool Vendors: Complementary design and verification tools
- System Integrators: Professional design services and consultation
- Training Partners: Certification programs and skill development
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Restriction of Hazardous Substances directive compliant
- REACH Regulation: European chemicals regulation compliance
- Conflict Minerals: Responsible sourcing verification
- Green Packaging: Environmentally conscious packaging materials
- Recyclability: End-of-life disposal and recycling guidelines
Operating Environment
- Temperature Range: Industrial grade (-40ยฐC to +85ยฐC)
- Humidity Tolerance: Up to 85% relative humidity (non-condensing)
- Vibration Resistance: Suitable for mobile and automotive applications
- Shock Tolerance: Meets industrial equipment standards
- EMI/EMC: Electromagnetic compatibility for sensitive environments
Export Control Classifications
- ECCN: Export Control Classification Number designation
- Country Restrictions: Applicable export licensing requirements
- End-Use Monitoring: Technology transfer compliance guidelines
- Re-export Controls: Secondary distribution restrictions
- Documentation Requirements: Compliance certification and tracking
Quality Standards
- ISO Certifications: Manufacturing quality management systems
- Automotive Grade: Meets automotive industry quality standards
- Reliability Testing: Extended temperature and stress testing
- Traceability: Complete supply chain documentation
- Warranty Coverage: Standard manufacturer warranty terms
Safety Certifications
- UL Recognition: Underwriters Laboratories component recognition
- CE Marking: European Conformity declaration
- FCC Compliance: Federal Communications Commission certification
- International Standards: IEC and other global safety standards
- Industry Specific: Compliance with sector-specific requirements
The XC3064A-7TQG144I represents proven FPGA technology suitable for industrial applications requiring reliable, programmable logic solutions. Contact authorized distributors for detailed specifications, current availability, and application-specific guidance.
