Product Overview
The XCVU095-1FFVD1924I is a cutting-edge AMD (formerly Xilinx) Virtex UltraScale FPGA that delivers exceptional performance and integration capabilities for demanding applications. Built on advanced 20nm technology, this high-end field programmable gate array provides unprecedented levels of system performance, I/O bandwidth, and logic capacity for next-generation designs.
1. Product Specifications
Core Architecture
- FPGA Family: Virtex UltraScale Series
- Logic Cells: 1,176,000 logic cells
- Logic Blocks: 537,600 configurable logic blocks (CLBs)
- Manufacturing Process: 20nm technology node
- Core Voltage: 0.95V (922mV to 979mV operating range)
Package Details
- Package Type: FFVD1924I (1924-pin Flip Chip Ball Grid Array)
- Pin Count: 1924 pins
- Speed Grade: -1 (Standard speed grade)
- Operating Temperature: -40ยฐC to +100ยฐC (TJ)
- Mounting Type: Surface Mount Technology (SMT)
Memory and Storage
- Block RAM: 62,259 Kbit total on-chip memory
- UltraRAM: Advanced on-chip memory for reduced BOM cost
- Memory Controllers: Integrated high-performance controllers
I/O and Connectivity
- I/O Pins: High-density I/O configuration optimized for the FFVD package
- Serial Transceivers: Multiple high-speed GTH/GTY transceivers
- Data Rates: Up to 28+ Gbps per transceiver
- Interface Support: PCIe Gen3, 100G Ethernet, 150G Interlaken
Processing Capabilities
- DSP Slices: High-performance DSP48E2 slices for signal processing
- Clock Management: Multiple MMCM and PLL clock generators
- Maximum Frequency: Up to 725 MHz operating frequency
- ASIC Gate Equivalent: Up to 6.4M ASIC gates
2. Pricing Information
Price Range: $8,000 – $15,000+ (varies by distributor and quantity)
Pricing Factors:
- Volume Discounts: Available for bulk purchases (100+ units)
- Lead Time: Standard lead time 16-30 weeks from authorized distributors
- Market Conditions: Pricing subject to semiconductor market fluctuations
- Regional Variations: Prices may vary by geographic region
Authorized Distributors:
- Avnet
- Arrow Electronics
- Digi-Key Electronics
- Mouser Electronics
- Newark/element14
- Future Electronics
Note: Contact authorized distributors for current pricing and availability. Prices are subject to change without notice.
3. Documents & Media
Technical Documentation
- Official Datasheet: DS890 Virtex UltraScale FPGAs Data Sheet
- Package and Pinout Guide: UG575 UltraScale Architecture Package and Pinout Guide
- User Guide: UG573 UltraScale Architecture Configurable Logic Block User Guide
- PCB Design Guide: UG583 UltraScale Architecture PCB Design User Guide
Design Resources
- Vivado Design Suite: Complete design environment and tools
- Reference Designs: Application-specific reference implementations
- IP Cores: Extensive library of verified IP blocks
- Development Boards: VCU108 Evaluation Kit and third-party boards
CAD Models & Symbols
- IBIS Models: Signal integrity simulation models
- Package Drawings: Mechanical package specifications
- Footprint Libraries: PCB layout footprints for major CAD tools
- 3D Models: STEP files for mechanical design verification
4. Related Resources
Development Tools
- AMD Vivado Design Suite: Complete FPGA design environment
- Vivado HLS: High-Level Synthesis for C/C++ to RTL conversion
- PetaLinux Tools: Linux development environment
- System Generator: Model-based design for DSP applications
Application Notes
- AN869: UltraScale Architecture Configuration
- AN912: High-Speed Serial I/O Design Guidelines
- AN835: Power Distribution Network Design
- AN888: Signal Integrity Design Guidelines
Training and Support
- AMD University Program: Educational resources and training
- Community Forums: Technical support and user discussions
- Design Services: Authorized partner design services
- Documentation Portal: Comprehensive technical documentation
Compatible IP Cores
- Video & Imaging: H.264/H.265 codecs, video processing
- Networking: Ethernet MAC/PHY, packet processing engines
- Wireless: 5G/LTE baseband processing, software-defined radio
- AI/ML: Deep learning processing units, neural network accelerators
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS3 Compliant (Restriction of Hazardous Substances)
- REACH Regulation: Compliant with EU REACH requirements
- Conflict Minerals: DRC conflict-free sourcing certified
- Green Packaging: Lead-free and halogen-free packaging options
Operating Conditions
- Temperature Range: -40ยฐC to +100ยฐC junction temperature
- Humidity: 5% to 95% relative humidity (non-condensing)
- Storage Temperature: -65ยฐC to +150ยฐC
- Thermal Resistance: Package-dependent thermal characteristics
Export Control Classification
- ECCN: 3A001.a.7 (Export Control Classification Number)
- Country of Origin: Manufactured in Asia-Pacific region
- Export Licensing: May require export license for certain destinations
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
Quality Standards
- ISO Certification: Manufactured under ISO 9001:2015 quality standards
- Automotive Grade: AEC-Q100 qualified variants available
- Reliability Testing: Extensive qualification and reliability testing
- Traceability: Full manufacturing traceability and lot tracking
Packaging and Handling
- Moisture Sensitivity: MSL-3 (Moisture Sensitivity Level 3)
- ESD Protection: Class 1C ESD sensitive device
- Storage Requirements: Dry pack storage recommended
- Handling Precautions: Proper ESD handling procedures required
The XCVU095-1FFVD1924I represents the pinnacle of FPGA technology, combining high performance, extensive I/O capabilities, and advanced features in a single device. Ideal for applications requiring maximum processing power, high-speed connectivity, and system integration.
Keywords: XCVU095-1FFVD1924I, Virtex UltraScale FPGA, AMD FPGA, high-performance FPGA, 20nm FPGA, system-on-chip, programmable logic, FFVD1924I package
