Product Overview
The XCVU095-2FFVA1760E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) Virtex UltraScale family. This advanced 20nm technology FPGA delivers exceptional processing power, programmable acceleration, and superior I/O bandwidth for demanding applications requiring heterogeneous processing capabilities.
1. Product Specifications
Core Specifications
- Manufacturer: AMD (formerly Xilinx)
- Product Family: Virtex UltraScale
- Part Number: XCVU095-2FFVA1760E
- Package Type: 1760-Pin FCBGA (Flip Chip Ball Grid Array)
- Process Technology: 20nm
- Core Voltage: 0.95V
- Speed Grade: -2
Logic Resources
- Logic Cells: 940,800 cells
- System Logic Blocks: 537,600
- Macrocells: 1,176,000
- Total RAM Bits: 62,259 Kbit
- I/O Count: 702 I/O pins
Key Features
- UltraScale Architecture: Built on AMD’s advanced UltraScale architecture for optimal power efficiency
- Stacked Silicon Interconnect (SSI) Technology: Enables high-performance through innovative die stacking
- High DSP Count: Optimized for digital signal processing applications
- Advanced Block RAM: High block RAM-to-logic ratios for efficient memory management
- Next-Generation Transceivers: Support for PCIe, 100G Ethernet, and 150G Interlaken protocols
- Enhanced Power Management: Up to 40% lower power consumption vs. previous generation
- ASIC-like Clocking: Fine granular clock gating capabilities
2. Pricing
Market Pricing Information:
- The XCVU095-2FFVA1760E is a premium enterprise-grade FPGA with pricing typically available through authorized distributors
- Pricing varies based on order quantity, with volume discounts available
- Reference pricing from similar UltraScale variants ranges from $11,000 to $15,000+ depending on specifications and quantity
- Contact authorized distributors for current pricing and availability
Price Factors:
- Order quantity (volume discounts available)
- Lead time requirements
- Market conditions and supply chain status
- Customer classification (OEM, distributor, end-user)
3. Documents & Media
Technical Documentation
- Product Datasheet: Comprehensive specifications and electrical characteristics
- Pinout Documentation: Complete pin assignment and signal descriptions
- Package Information: Mechanical drawings and thermal specifications
- Design Guide: Implementation guidelines and best practices
Development Resources
- Vivado Design Suite: Primary development environment
- Reference Designs: Pre-built application examples
- IP Cores: Extensive library of verified intellectual property
- Application Notes: Implementation guides for specific use cases
Media Resources
- Product Images: High-resolution component photographs
- Block Diagrams: System architecture illustrations
- Performance Benchmarks: Comparative analysis data
- Video Tutorials: Design implementation guidance
4. Related Resources
Development Tools
- Vivado Design Suite: Complete FPGA design environment
- Vitis Unified Software Platform: Acceleration development platform
- ChipScope Pro: Real-time debugging and analysis
- System Generator: Model-based design tool
Development Boards
- VCU110 Development Kit: Complete evaluation platform
- ZedBoard: Popular prototyping platform
- Nexys4-DDR: Educational development board
- DE10-Nano: Intel/Terasic development kit alternative
Compatible Devices
- XCVU095-2FFVB1760E: Alternative package variant
- XCVU095-2FFVA2104E: Higher I/O count version
- XCVU095-1FFVA1760E: Speed grade -1 variant
- XCVU080: Lower logic capacity alternative
Technical Support
- AMD Technical Support: Direct manufacturer assistance
- Community Forums: Peer-to-peer technical discussions
- Training Resources: Online courses and certification programs
- Application Engineers: Design consultation services
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical safety regulations
- Operating Temperature Range: Commercial (0ยฐC to 85ยฐC) and Industrial (-40ยฐC to 100ยฐC) grades available
- Storage Temperature: -65ยฐC to 150ยฐC
- Humidity: 5% to 95% non-condensing
Quality Standards
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management system
- IATF 16949: Automotive quality standard (where applicable)
- AS9100: Aerospace quality standard (where applicable)
Export Classifications
- ECCN (Export Control Classification Number): Subject to US export regulations
- Country of Origin: Various manufacturing locations
- HTUS Classification: Harmonized Tariff Schedule classification
- Export License Requirements: May require export license for certain destinations
Packaging & Handling
- MSL Rating: Moisture Sensitivity Level classification
- ESD Sensitive: Requires proper electrostatic discharge handling
- Packaging Type: Tray packaging standard
- Shelf Life: Industry standard component shelf life
Certifications
- CE Marking: European Conformity marking (where applicable)
- FCC Compliance: Federal Communications Commission compliance
- IC Certification: Industry Canada certification
- WEEE Directive: Waste Electrical and Electronic Equipment compliance
Keywords: XCVU095-2FFVA1760E, Virtex UltraScale, FPGA, AMD Xilinx, 20nm technology, programmable logic, high-performance computing, digital signal processing, FCBGA package, 940K logic cells
Applications: Data center acceleration, 5G infrastructure, aerospace & defense, high-performance computing, machine learning acceleration, video processing, networking equipment, test & measurement systems
