The XCVU065-2FFVC1517E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, communications, and high-performance computing markets.
Product Specification
The XCVU065-2FFVC1517E features advanced 20nm technology with impressive capabilities:
Core Features:
- Logic Cells: 692,150 system logic cells providing extensive programmable logic resources
- Memory: 38.4 Mb of UltraRAM and 41.6 Mb of block RAM for high-bandwidth data storage
- DSP Slices: 2,520 DSP48E2 slices enabling efficient signal processing operations
- Package: FFVC1517 package with 1517 pins in a flip-chip BGA configuration
- Speed Grade: -2 speed grade offering balanced performance and power consumption
- I/O Pins: 676 user I/O pins supporting various interface standards
- Transceivers: 48 GTY transceivers capable of up to 32.75 Gbps data rates
Technical Specifications:
- Operating voltage: 0.85V core, 1.8V auxiliary
- Temperature range: Commercial (0ยฐC to +85ยฐC)
- Advanced clocking resources with MMCM and PLL capabilities
- PCIe Gen4 x16 endpoint and root port support
- 100G Ethernet MAC and extensive memory controller support
Price
The XCVU065-2FFVC1517E is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities and extensive feature set. Contact authorized distributors for current pricing and volume discounts. Typical applications justify the investment through superior performance, reduced system complexity, and faster time-to-market advantages.
Documents & Media
Technical Documentation:
- Complete datasheet with electrical characteristics and timing specifications
- UltraScale+ FPGA configuration user guide
- Package and pinout information with PCB design guidelines
- Power and thermal management documentation
- Programming and debugging user guides
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Board design files and layout recommendations
- Simulation models and timing analysis tools
Media Resources:
- Product overview videos and technical presentations
- Webinar recordings covering implementation best practices
- Case studies demonstrating real-world applications
- Community forums and technical support resources
Related Resources
Development Tools:
- Vivado Design Suite for synthesis, implementation, and debugging
- Vitis unified software platform for embedded and acceleration development
- ChipScope Pro for in-system verification and debugging
- Power estimator tools for thermal and power analysis
Evaluation Platforms:
- VCU118 evaluation board featuring the XCVU065-2FFVC1517E
- Development kits with example designs and tutorials
- Partner ecosystem boards and modules
- Third-party IP cores and reference designs
Support Ecosystem:
- Extensive partner network for custom board design
- Professional services for design optimization
- Training programs and certification courses
- Technical community forums and knowledge base
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant lead-free package construction
- REACH regulation compliance for European markets
- Conflict minerals reporting template (CMRT) available
- ISO 14001 environmental management system certified manufacturing
Export Classifications:
- ECCN: 3A001.A.7 (US Department of Commerce)
- HTS: 8542.33.0001 (Harmonized Tariff Schedule)
- CCATS: Available upon request for specific applications
- Country-specific export requirements may apply
Quality Standards:
- Manufactured in ISO 9001:2015 certified facilities
- Automotive-grade quality processes and testing
- Extended temperature and reliability testing
- Comprehensive quality assurance documentation
The XCVU065-2FFVC1517E represents the pinnacle of FPGA technology, combining massive parallel processing capabilities with advanced I/O features and comprehensive development tool support. This makes it ideal for next-generation applications requiring the highest levels of performance, flexibility, and reliability.
