Product Overview
The XCVU080-1FFVB2104I is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex UltraScale family. This advanced semiconductor device delivers exceptional processing power and programmable flexibility for demanding applications in telecommunications, data centers, aerospace, and high-performance computing systems.
1. Product Specifications
Core Technical Specifications
Part Number: XCVU080-1FFVB2104I
Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
Product Family: Virtex UltraScale
Technology Node: 20nm process technology
Key Performance Features
- Logic Elements/Cells: 780,000 logic cells
- I/O Count: 702 user I/O pins
- Package Type: 2104-pin FCBGA (Flip Chip Ball Grid Array)
- Package Size: 47.5mm × 47.5mm
- Speed Grade: -1 (Industrial temperature range)
- Operating Voltage: 0.95V core voltage
- Temperature Range: 0°C to 100°C (TJ – Junction Temperature)
- Mounting Type: Surface Mount Technology (SMT)
Memory and Processing Resources
- Block RAM: 50.0 Mb total block RAM capacity
- DSP Slices: High-density DSP blocks for signal processing
- Clock Management: Advanced clocking with multiple CMTs (Clock Management Tiles)
- Configuration Memory: Non-volatile configuration storage
- UltraScale Architecture: Next-generation FPGA architecture optimized for power efficiency
Connectivity and I/O Features
- High-Speed Transceivers: Multi-gigabit transceiver capability
- Programmable I/O Standards: Support for multiple voltage standards
- Serial Connectivity: High-bandwidth serial I/O interfaces
- Parallel Processing: Massive parallel processing capabilities
- PCIe Support: Integrated PCIe endpoint and root port functionality
2. Price Information
The XCVU080-1FFVB2104I pricing varies based on quantity, delivery terms, and market conditions. As a high-end FPGA device, typical pricing considerations include:
Pricing Factors
- Volume Discounts: Significant price reductions available for bulk orders
- Lead Time: Standard lead times may affect pricing
- Distribution Channel: Authorized distributors vs. direct from manufacturer
- Market Availability: Supply and demand fluctuations impact pricing
Cost Considerations
- Development Costs: Factor in software licensing and development tools
- Supporting Components: Additional components required for complete implementation
- Long-term Supply: Consider lifecycle and obsolescence planning
Note: For current pricing and availability, contact authorized AMD Xilinx distributors or submit a Request for Quote (RFQ) through official channels.
3. Documents & Media
Official Documentation
- Datasheet: Complete technical specifications and electrical characteristics
- User Guide: Comprehensive implementation and design guidance
- Package and Pinout Files: Detailed pin assignment and package specifications
- Application Notes: Design implementation best practices
- Errata Documents: Known issues and recommended workarounds
Design Resources
- Reference Designs: Pre-built design examples and templates
- IP Core Library: Extensive intellectual property core collection
- Development Boards: Compatible evaluation and development platforms
- Software Tools: Vivado Design Suite compatibility information
Media Resources
- Product Images: High-resolution component photography
- Block Diagrams: Architectural overview illustrations
- Package Drawings: Mechanical specifications and dimensions
- Thermal Models: Thermal analysis and simulation files
4. Related Resources
Development Tools
- Vivado Design Suite: Primary development environment for XCVU080-1FFVB2104I
- SDK (Software Development Kit): Embedded software development tools
- HLS (High-Level Synthesis): C/C++ to RTL synthesis capabilities
- System Generator: MATLAB/Simulink integration for DSP design
Compatible Products
- Development Boards: Evaluation platforms featuring XCVU080-1FFVB2104I
- Reference Designs: Industry-specific implementation examples
- IP Cores: Licensed and free intellectual property blocks
- Third-Party Tools: EDA tool compatibility and support
Support Resources
- Technical Support: AMD Xilinx technical support services
- Community Forums: Developer community and knowledge sharing
- Training Materials: Educational resources and certification programs
- Design Services: Professional design and consulting services
Application Areas
- Data Center Acceleration: Server and cloud computing applications
- 5G Infrastructure: Telecommunications and wireless communication
- Aerospace & Defense: Mission-critical and high-reliability systems
- Automotive Electronics: Advanced driver assistance systems (ADAS)
- Industrial Automation: Process control and manufacturing systems
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS3 compliant – meets European restriction of hazardous substances
- REACH Regulation: Compliant with European chemical safety requirements
- Conflict Minerals: Compliant with conflict minerals reporting requirements
- Environmental Rating: Industrial temperature grade (-40°C to +100°C ambient)
Export Control Classifications
- ECCN (Export Control Classification Number): Subject to US export administration regulations
- Country of Origin: Manufactured in controlled facilities with supply chain transparency
- Export Licensing: May require export licenses for certain destinations
- ITAR Compliance: Not subject to International Traffic in Arms Regulations for standard commercial versions
Quality and Reliability Standards
- ISO Certification: Manufactured in ISO 9001 certified facilities
- Automotive Grade: Available in automotive-qualified versions for safety-critical applications
- Reliability Testing: Extensive qualification testing including temperature cycling, humidity, and vibration
- Quality Assurance: Comprehensive testing and quality control processes
Packaging and Shipping
- Anti-Static Packaging: ESD-safe packaging and handling procedures
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classified packaging
- Traceability: Full lot traceability and manufacturing records
- Global Distribution: Worldwide availability through authorized distribution network
Why Choose XCVU080-1FFVB2104I?
The XCVU080-1FFVB2104I represents the pinnacle of FPGA technology, combining AMD Xilinx’s proven UltraScale architecture with cutting-edge 20nm process technology. This device offers unmatched performance per watt, extensive I/O capabilities, and comprehensive development tool support, making it the ideal choice for next-generation system designs requiring maximum flexibility and performance.
Whether you’re developing high-speed networking equipment, advanced signal processing systems, or cutting-edge AI acceleration platforms, the XCVU080-1FFVB2104I provides the computational power and adaptability needed to bring your most ambitious projects to life.
For detailed technical specifications, pricing information, and design support, contact your local AMD Xilinx representative or authorized distributor.
