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XCVU080-2FFVB1760I: High-Performance Virtex UltraScale+ FPGA

Original price was: $20.00.Current price is: $19.00.

The XCVU080-2FFVB1760I is a cutting-edge field-programmable gate array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, aerospace, defense, and high-performance computing environments.

Product Specifications

Core Architecture

The XCVU080-2FFVB1760I features advanced 20nm technology with exceptional processing capabilities:

  • Logic Cells: 872,000 system logic cells
  • CLB Flip-Flops: 1,108,800 flip-flops for high-speed sequential logic
  • CLB LUTs: 554,400 lookup tables for flexible combinational logic
  • Block RAM: 38.4 Mb total block RAM capacity
  • UltraRAM: 22.5 Mb of distributed UltraRAM for high-density memory applications

DSP and Processing Power

  • DSP Slices: 2,520 DSP48E2 slices for high-performance signal processing
  • Maximum Frequency: Up to 891 MHz for demanding real-time applications
  • Transceivers: 56 GTY transceivers supporting up to 32.75 Gbps data rates

Package and Interface Details

  • Package Type: FFVB1760 (Fine-Pitch Ball Grid Array)
  • Pin Count: 1,760 pins for extensive I/O connectivity
  • Speed Grade: -2 (industrial temperature range)
  • Temperature Range: -40ยฐC to +100ยฐC junction temperature
  • Voltage: Multiple power domains with advanced power management

Price Information

Pricing for the XCVU080-2FFVB1760I varies based on quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities.

Note: Prices are subject to change and may vary by region and supplier.

Documents & Media

Technical Documentation

  • Product Brief: Comprehensive overview of XCVU080-2FFVB1760I capabilities
  • Datasheet: Complete electrical and timing specifications
  • User Guide: Detailed implementation guidelines and best practices
  • Package Information: Mechanical drawings and thermal characteristics
  • Selection Guide: Comparison with other Virtex UltraScale+ devices

Development Resources

  • Vivado Design Suite: Complete development environment
  • IP Catalog: Pre-verified IP cores and reference designs
  • Application Notes: Implementation guides for specific use cases
  • White Papers: Technical deep-dives and performance analysis

Related Resources

Development Tools

  • Vivado Design Suite: Primary development environment for XCVU080-2FFVB1760I
  • Vivado HLS: High-level synthesis tools for C/C++ development
  • SDK: Software development kit for embedded applications
  • ChipScope Pro: Real-time debugging and verification tools

Evaluation Boards

  • VCU108 Evaluation Kit: Development platform optimized for Virtex UltraScale+ FPGAs
  • Custom carrier boards: Third-party solutions for specific applications

Software Support

  • Device drivers: Linux and Windows support packages
  • Reference designs: Proven implementations for common applications
  • IP cores: Pre-verified intellectual property for faster development

Training and Support

  • Technical documentation: Comprehensive guides and tutorials
  • Community forums: Peer-to-peer support and knowledge sharing
  • Professional services: Design consulting and technical support

Environmental & Export Classifications

Environmental Compliance

The XCVU080-2FFVB1760I meets stringent environmental standards:

  • RoHS Compliant: Restriction of Hazardous Substances directive compliance
  • REACH Compliant: Registration, Evaluation, Authorization of Chemicals regulation
  • Conflict Minerals: Compliant with conflict minerals reporting requirements
  • Halogen-Free: Environmentally friendly packaging materials

Export Control Classifications

  • ECCN: Export Control Classification Number as per U.S. Department of Commerce
  • HTS: Harmonized Tariff Schedule classification for international trade
  • Country of Origin: Manufacturing location for trade compliance
  • Export Restrictions: Specific regulations may apply to certain destinations

Quality Standards

  • ISO 9001: Quality management system certification
  • Automotive Grade: AEC-Q100 qualification for automotive applications (where applicable)
  • Military/Aerospace: MIL-STD compliance for defense applications
  • Industrial Temperature: Extended temperature range operation

Packaging and Shipping

  • Moisture Sensitivity: Level 3 (168 hours at 30ยฐC/60% RH)
  • ESD Classification: Class 1A electrostatic discharge sensitivity
  • Packaging: Anti-static trays and moisture barrier bags
  • Shelf Life: Specified storage conditions and duration

The XCVU080-2FFVB1760I represents the pinnacle of FPGA technology, combining high performance, flexibility, and reliability for the most demanding applications. Its comprehensive feature set and robust environmental qualifications make it ideal for mission-critical deployments across multiple industries.