The XCVU080-2FFVD1517E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) Virtex UltraScale family, designed to deliver exceptional performance for demanding applications. This advanced programmable logic device combines high-density integration with superior processing capabilities, making it ideal for complex digital signal processing, networking, and high-performance computing applications.
Product Specifications
Core Architecture & Performance
- Family: Virtex UltraScale FPGA
- Part Number: XCVU080-2FFVD1517E
- Manufacturer: AMD (formerly Xilinx)
- Technology Node: 20nm FinFET+ process technology
- Logic Elements: 975,000 logic cells / 780,000 logic cells
- System Logic Cells: 51,200,000
- Speed Grade: -2 (Commercial grade)
Package & Physical Characteristics
- Package Type: 1517-BBGA, FCBGA (Flip Chip Ball Grid Array)
- Pin Count: 1517 pins
- I/O Count: 338 user I/O pins
- Mounting Type: Surface Mount Technology (SMT)
- Package Designation: FFVD1517E
Operating Conditions
- Operating Temperature Range: 0°C to 100°C (TJ – Junction Temperature)
- Supply Voltage: 0.922V to 0.979V
- Core Voltage: Optimized for low power consumption
- Product Status: Active production
Key Features
- UltraScale Architecture: Advanced 20nm technology for optimal power efficiency
- High-Performance Processing: Superior computational capabilities for complex algorithms
- Flexible I/O: 338 configurable I/O pins for versatile connectivity
- Advanced Packaging: 1517-pin FCBGA for high-density applications
- RoHS Compliant: ROHS3 compliant for environmental standards
Price Information
Current Market Pricing
The XCVU080-2FFVD1517E is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities:
- Reference Price: $14,621.01 (as of 2023 market data)
- Price Category: High-end enterprise FPGA
- Lead Time: 30 week(s) manufacturer lead time
- Availability: Active production with global distributor network
Note: Pricing for XCVU080-2FFVD1517E varies based on quantity, distributor, and current market conditions. Contact authorized distributors for current pricing and volume discounts.
Cost Considerations
- Volume pricing available for bulk orders
- Extended lead times may affect project timelines
- Price fluctuations common in high-end FPGA market
- Alternative part numbers available for different speed grades
Documents & Media
Technical Documentation
- Official Datasheet: Available from AMD/Xilinx technical portal
- User Guide: Comprehensive implementation guidance
- Pin Configuration: Detailed pinout diagrams and I/O planning
- Application Notes: Design implementation examples
Development Resources
- CAD Models: Free downloadable models for PCB design
- Schematic Symbols: Standard library components
- Footprint Libraries: Accurate package dimensions
- Reference Designs: Proven implementation examples
Software & Tools
- Vivado Design Suite: Primary development environment
- Programming Tools: Configuration and debugging utilities
- IP Catalog: Pre-verified intellectual property cores
- Simulation Models: Behavioral and timing models
Related Resources
Development Platforms
- Evaluation Boards: Available through third-party vendors
- Reference Platforms: Industry-standard development kits
- Partner Ecosystems: Extensive third-party support network
Compatible Products
- Memory Interfaces: DDR4, DDR3, QDR support
- Communication Protocols: PCIe, Ethernet, USB implementations
- Processing Units: ARM-based and soft-core processors
- Analog Front-Ends: High-speed data converter compatibility
Application Areas
- Data Center Acceleration: Machine learning and AI workloads
- 5G/6G Infrastructure: Wireless baseband processing
- Video Processing: 4K/8K encoding and transcoding
- Financial Services: High-frequency trading systems
- Aerospace & Defense: Radar and communication systems
Technical Support
- Community Forums: Active developer community
- Technical Documentation: Comprehensive design guides
- Training Resources: Online courses and certification programs
- Professional Services: Design consultation and support
Environmental & Export Classifications
Environmental Compliance
- RoHS Status: ROHS3 Compliant
- REACH Compliance: Meets European chemical regulations
- Conflict Minerals: Compliant with Dodd-Frank requirements
- Environmental Impact: Lead-free manufacturing process
Export Control Classifications
- Export Control Classification Number (ECCN): Subject to U.S. export regulations
- Country of Origin: Manufactured in global AMD facilities
- Trade Compliance: Meets international trade requirements
- Licensing Requirements: May require export licenses for certain destinations
Quality & Reliability Standards
- ISO Certification: Manufactured under ISO 9001 quality standards
- Automotive Standards: Suitable for industrial applications
- Reliability Testing: Comprehensive qualification testing
- Warranty Coverage: Standard manufacturer warranty terms
Packaging & Handling
- Moisture Sensitivity Level: MSL-3 (168 hours at 30°C/60% RH)
- Storage Requirements: Controlled humidity and temperature
- ESD Protection: Electrostatic discharge sensitive device
- Handling Procedures: Follow IPC/JEDEC standards
Keywords: XCVU080-2FFVD1517E, Virtex UltraScale FPGA, AMD FPGA, Xilinx FPGA, Field Programmable Gate Array, 20nm FPGA, High-Performance Computing, Data Center Acceleration, FCBGA Package, 338 I/O FPGA, 975K Logic Elements
Meta Description: XCVU080-2FFVD1517E – High-performance Virtex UltraScale FPGA with 975K logic elements, 338 I/O, 20nm technology. Perfect for data center acceleration, 5G infrastructure, and advanced computing applications.
