The XCVU080-3FFVD1517E is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s Virtex UltraScale family, designed for demanding applications requiring exceptional processing power, advanced I/O capabilities, and superior power efficiency. This cutting-edge FPGA delivers unprecedented performance for data center acceleration, 5G infrastructure, aerospace and defense, and high-performance computing applications.
1. Product Specifications
Core Architecture
- Product Family: Virtex UltraScale FPGA
- Part Number: XCVU080-3FFVD1517E
- Logic Cells: 780,000 cells
- Process Technology: 20nm TSMC FinFET+ process
- Operating Voltage: 1.0V core voltage
- Speed Grade: -3 (high performance)
Memory and Logic Resources
- System Logic Cells: 780,000
- Flip-Flops: Abundant embedded flip-flops for sequential logic
- Look-Up Tables (LUTs): High-density 6-input LUTs
- Block RAM: Substantial block RAM capacity for data buffering
- DSP Slices: Integrated DSP48E2 slices for signal processing
Package and I/O Specifications
- Package Type: FFVD1517 (Fine-pitch Flip Chip Very Dense)
- Pin Count: 1,517 pins
- Form Factor: FCBGA (Flip Chip Ball Grid Array)
- I/O Pins: 338 user I/O pins
- Differential Pairs: High-speed differential signaling support
Performance Characteristics
- Maximum Operating Frequency: High-speed operation up to 891 MHz (fabric dependent)
- Transceiver Support: GTH transceivers for high-speed serial connectivity
- Memory Interface: DDR4/DDR3L support with high bandwidth
- PCIe Support: Integrated PCIe Gen3 hard blocks
Advanced Features
- UltraScale Architecture: Advanced 20nm FinFET+ technology
- Power Management: Advanced power gating and clock gating
- Security Features: Built-in encryption and authentication
- Partial Reconfiguration: Dynamic reconfiguration capabilities
2. Price Information
Note: Pricing for the XCVU080-3FFVD1517E varies based on quantity, lead time, and distributor. For current pricing information:
- Volume Pricing: Available upon request for quantities of 25+ units
- Sample Pricing: Contact authorized distributors for evaluation samples
- Lead Time: Standard lead times range from 12-20 weeks depending on demand
- Price Range: Premium FPGA pricing tier (contact for specific quotes)
Recommended Actions:
- Contact authorized distributors for current pricing
- Request quotes for volume orders
- Inquire about development board pricing for prototyping
3. Documents & Media
Technical Documentation
- Datasheet: DS890 – UltraScale Architecture and Product Data Sheet
- User Guides:
- UG575 – UltraScale Architecture Package and Pinout Product Guide
- UG973 – UltraScale Architecture Libraries Guide
- UG974 – UltraScale Architecture Clocking Resources User Guide
Development Resources
- Vivado Design Suite: Primary development environment for XCVU080-3FFVD1517E
- Reference Designs: Available through Xilinx GitHub and partner ecosystem
- Application Notes: Specific implementation guides for common use cases
- Package Files: Pinout files available in TXT and CSV formats
Supporting Media
- Product Brief: High-level overview and key features
- Selection Guide: Comparative analysis with other UltraScale devices
- White Papers: Technical deep-dives on UltraScale architecture
- Webinars: Design methodology and best practices
Development Tools
- Vivado ML Edition: Advanced synthesis and implementation
- Vitis Unified Software Platform: For software acceleration
- System Generator: MATLAB/Simulink integration
- SDK/Vitis: Embedded software development
4. Related Resources
Development Boards and Kits
- VCU118 Evaluation Kit: Recommended development platform for UltraScale+ evaluation
- Custom Carrier Boards: Available from ecosystem partners
- FMC Modules: Daughter cards for specific interface requirements
Compatible Products
- XCVU095-3FFVD1517E: Higher density variant in same package
- XCVU080-2FFVD1517E: Lower speed grade variant
- XCVU080-3FFVB2104E: Alternative package option with more I/O
Ecosystem Partners
- Development Partners: Avnet, Arrow Electronics, Premier Farnell
- Board Partners: Digilent, Terasic, Alpha Data
- IP Providers: Extensive third-party IP ecosystem
- Design Services: Certified design consultants and service providers
Training and Support
- Online Training: Xilinx University Program courses
- Technical Support: AMD Xilinx support portal and forums
- Community Resources: Developer forums and user groups
- Certification Programs: Professional development opportunities
Application Areas
- 5G Infrastructure: Massive MIMO, beamforming, and baseband processing
- Data Center: Hardware acceleration and network processing
- Aerospace & Defense: Radar processing, signal intelligence, and secure communications
- High-Performance Computing: Scientific computing and financial modeling
- Industrial Automation: Machine vision and real-time control
5. Environmental & Export Classifications
RoHS Compliance
- RoHS Status: Compliant with RoHS 2 Directive (2011/65/EU)
- Restricted Substances: Meets limitations for lead, mercury, cadmium, hexavalent chromium, PBB, PBDE, and phthalates
- Certification: CE marking required for EU market compliance
- Documentation: RoHS compliance declaration available from manufacturer
Environmental Standards
- REACH Compliance: Conforms to EU REACH regulation for chemical substances
- WEEE Directive: Supports waste electrical and electronic equipment recycling requirements
- Green Packaging: Environmentally responsible packaging materials
- Lead-Free: Lead-free BGA solder balls and assembly process
Export Control Classifications
- ECCN: 3A001.a.2 (Export Control Classification Number)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- Country of Origin: Varies by manufacturing facility
- Export Restrictions: Subject to US export administration regulations
Quality and Reliability
- ISO Certifications: Manufactured in ISO 9001 certified facilities
- Automotive Grade: AEC-Q100 qualified versions available for automotive applications
- Temperature Range: Commercial (0ยฐC to +85ยฐC) and Extended (-40ยฐC to +100ยฐC) options
- MTBF: Mean Time Between Failures data available in reliability reports
Packaging and Handling
- ESD Sensitivity: Class 1A electrostatic discharge sensitive device
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level)
- Storage Requirements: Dry storage in anti-static packaging
- Handling Precautions: ESD precautions required during assembly
For technical inquiries, pricing information, or design support regarding the XCVU080-3FFVD1517E, contact authorized AMD Xilinx distributors or visit the official AMD website for comprehensive resources and documentation.
