The XCVU080-H1FFVD1517E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale family, designed for demanding applications requiring exceptional processing power and flexibility. This advanced FPGA delivers optimal performance for data center acceleration, high-speed networking, and complex signal processing applications.
Product Specifications
Core Specifications
- Part Number: XCVU080-H1FFVD1517E
- Family: Virtex UltraScale
- Manufacturer: AMD (formerly Xilinx)
- Technology Node: 20nm
- Logic Cells: 975,000 (780,000 programmable cells)
- Package Type: 1517-Pin FCBGA (Flip-Chip Ball Grid Array)
- I/O Count: 338 user I/O pins
- Speed Grade: High-performance grade
- Operating Temperature: 0ยฐC to 100ยฐC (TJ)
- Supply Voltage: 0.922V to 0.979V
Memory and DSP Resources
- Block RAM: 50.0Mb total on-chip memory
- UltraRAM: Next-generation on-chip memory for reduced BOM cost
- DSP Slices: High-density DSP blocks optimized for signal processing
- Configuration Memory: Non-volatile configuration support
Advanced Features
- 20nm FinFET+ Technology: Delivers superior power efficiency
- Stacked Silicon Interconnect (SSI): Enhanced performance and scalability
- High-Speed Transceivers: Support for multi-gigabit serial communication
- Clock Management: Advanced clocking resources with low jitter
- Security Features: Built-in encryption and authentication capabilities
Package Details
- Package: FFVD1517 (Fine-pitch Flip-chip Ball Grid Array)
- Pin Count: 1517 pins
- Mounting Type: Surface Mount Technology (SMT)
- RoHS Compliance: RoHS3 compliant for environmental standards
Price Information
The XCVU080-H1FFVD1517E pricing varies based on quantity, supplier, and market conditions. Typical pricing ranges:
- Single Unit Price: $14,000 – $18,000 USD
- Volume Pricing: Contact authorized distributors for bulk pricing
- Lead Time: 30-45 weeks (subject to availability)
- Price Fluctuation: Prices monitored in real-time across global suppliers
Authorized Distributors
- DigiKey Electronics
- Mouser Electronics
- Arrow Electronics
- Avnet
- Regional authorized distributors
Note: Prices are subject to change based on market conditions and availability. Contact distributors for current pricing and stock availability.
Documents & Media
Technical Documentation
- Datasheet: DS890 – UltraScale Overview Datasheet (PDF)
- User Guide: UG575 – UltraScale Packaging and Pinout Guide
- Package Files: TXT and CSV format pinout files
- Application Notes: Various application-specific design guides
- Reference Designs: Pre-built designs for common applications
Design Tools & Software
- Vivado Design Suite: Primary development environment
- SDK: Software Development Kit for embedded applications
- IP Catalog: Extensive library of verified IP cores
- Simulation Tools: ModelSim, Questa integration support
Media Resources
- Product Images: High-resolution package and die photos
- Block Diagrams: Architectural overview diagrams
- 3D Models: CAD models for mechanical design
- Video Tutorials: Getting started and advanced design guides
Related Resources
Development Platforms
- VCU118 Evaluation Kit: Virtex UltraScale+ development board
- ZCU104: Zynq UltraScale+ evaluation kit
- Custom Development Boards: Third-party evaluation platforms
Compatible IP Cores
- High-Speed Networking: Ethernet, PCIe, Interlaken
- Signal Processing: FFT, FIR filters, video codecs
- Memory Controllers: DDR4, HBM, QDR
- Communication Protocols: USB, CAN, SPI, I2C
Design Examples
- Machine Learning Acceleration: AI/ML inference examples
- 5G Wireless: Baseband processing reference designs
- Data Center: Acceleration and offload applications
- Automotive: ADAS and autonomous driving applications
Support Resources
- Technical Forums: Community support and discussions
- Application Engineers: Direct technical support
- Training Courses: Online and in-person training options
- Design Services: Professional design assistance
Alternative Parts
- XCVU080-3FFVC1517E: Different speed grade variant
- XCVU080-2FFVD1517E: Alternative speed grade option
- XCVU080-H1FFVB2104E: Different package option (2104-pin)
- XCVU080-H1FFVC1517E: Alternative I/O configuration
Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS3 Compliant (Restriction of Hazardous Substances)
- REACH Compliance: European chemical regulation compliant
- WEEE Directive: Waste electrical equipment directive compliant
- Green Initiative: Lead-free and halogen-free options available
Operating Conditions
- Temperature Range: 0ยฐC to 100ยฐC junction temperature
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 3,000 meters operational
- Vibration: MIL-STD-883 compliant
- Shock: IEC 60068-2-27 certified
Export Control Classifications
- ECCN: Export Control Classification Number applies
- Country of Origin: Manufactured in various global facilities
- Export Restrictions: Subject to US Export Administration Regulations
- License Requirements: May require export license for certain destinations
Packaging & Shipping
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level)
- Storage Temperature: -55ยฐC to +150ยฐC
- Shelf Life: 12 months in controlled environment
- Packaging: Anti-static tray, sealed moisture barrier bag
- Quantity per Tray: 48 units standard
Quality Standards
- ISO 9001: Quality management system certified
- ISO 14001: Environmental management certified
- IATF 16949: Automotive quality standard (applicable variants)
- IPC Standards: PCB assembly and soldering standards
Keywords: XCVU080-H1FFVD1517E, Virtex UltraScale FPGA, AMD Xilinx, high-performance FPGA, 20nm technology, 975000 logic cells, 1517-pin FCBGA, data center acceleration, signal processing
