The XCVU095-1FFVC2104I is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, high-performance computing, and advanced communications systems.
Product Specifications
The XCVU095-1FFVC2104I features robust specifications that make it ideal for complex digital signal processing and high-bandwidth applications:
Core Architecture:
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 2,280,000
- CLB LUTs: 570,000 6-input Look-Up Tables
- Block RAM: 75.9 Mb total block RAM
- UltraRAM: 360 Mb of UltraRAM capacity
DSP and Processing:
- DSP Slices: 768 DSP48E2 slices for high-performance signal processing
- Processing System: ARM Cortex-A53 quad-core processor
- Clock Management: 24 clock management tiles (CMTs)
I/O and Connectivity:
- Package: FFVC2104 (2104-pin Flip Chip BGA)
- I/O Pins: 832 user I/O pins
- High-Speed Transceivers: 80 GTY transceivers supporting up to 32.75 Gbps
- PCIe Support: PCIe Gen4 x16 capability
Operating Conditions:
- Speed Grade: -1 (industrial grade)
- Operating Temperature: -40ยฐC to +100ยฐC junction temperature
- Supply Voltage: Multiple voltage domains (1.0V core, 1.8V auxiliary, 3.3V I/O)
Price
The XCVU095-1FFVC2104I is positioned as a premium FPGA solution, with pricing typically ranging from $8,000 to $12,000 per unit depending on volume and distribution channel. Contact authorized Xilinx distributors for current pricing and availability, as costs may vary based on:
- Order quantity and volume discounts
- Lead times and supply chain conditions
- Regional pricing variations
- Support and development tool licensing
For accurate pricing information, request quotes from official Xilinx partners or authorized electronic component distributors.
Documents & Media
Comprehensive documentation and resources are available for the XCVU095-1FFVC2104I:
Technical Documentation:
- Product datasheet with complete electrical specifications
- Reference manual detailing architecture and configuration
- Package and pinout documentation
- DC and AC switching characteristics
- Power consumption and thermal management guides
Design Resources:
- Vivado Design Suite compatibility information
- IP core integration guidelines
- Hardware debugging and verification guides
- Application notes for specific use cases
Development Tools:
- Xilinx Vivado Design Suite support
- SDK and embedded development resources
- Example designs and reference implementations
- Board design files and layout guidelines
All documentation is available through the official Xilinx website and requires registration for access to the latest versions and updates.
Related Resources
The XCVU095-1FFVC2104I integrates seamlessly with Xilinx’s comprehensive ecosystem:
Development Boards:
- VCU118 Evaluation Kit for rapid prototyping
- ZCU102 Development Board for system-level testing
- Custom carrier boards from third-party vendors
Software Tools:
- Vivado Design Suite for FPGA development
- Vitis unified software platform
- PetaLinux for embedded Linux development
- Model Composer for system-level design
IP Cores and Libraries:
- Xilinx IP catalog with over 100 verified IP cores
- Third-party IP solutions for specialized applications
- Open-source IP repositories and community resources
Support Services:
- Xilinx technical support and training programs
- Partner ecosystem for design services
- Online forums and community support
- Application engineering assistance
Environmental & Export Classifications
The XCVU095-1FFVC2104I complies with international environmental and trade regulations:
Environmental Compliance:
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical safety regulations
- Halogen-Free: Lead-free and halogen-free package construction
- Conflict Minerals: Compliant with conflict minerals reporting requirements
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Manufactured in various locations with final assembly typically in Asia
- Export Restrictions: Subject to US export control regulations and may require licenses for certain destinations
Quality and Reliability:
- Automotive Grade: Available in automotive-qualified versions
- Military/Aerospace: Qualified for harsh environment applications
- Industrial Temperature Range: -40ยฐC to +100ยฐC operation
- Quality Standards: ISO 9001 and AS9100 certified manufacturing
The XCVU095-1FFVC2104I represents the pinnacle of FPGA technology, combining massive logic capacity with advanced processing capabilities to enable next-generation applications in high-performance computing, communications infrastructure, and mission-critical systems.
