The XCVU095-1FFVD1517I is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, aerospace, defense, and high-performance computing environments.
Product Specifications
The XCVU095-1FFVD1517I features advanced 20nm technology with impressive specifications that make it ideal for complex digital signal processing and acceleration tasks:
Core Architecture:
- Logic Cells: 1,278,000
- CLB Flip-Flops: 1,225,200
- CLB LUTs: 612,600
- Block RAM: 75.9 Mb
- UltraRAM: 360 Mb
- DSP Slices: 768
Package Details:
- Package Type: FFVD1517 (Fine-pitch Flip Chip Ball Grid Array)
- Pin Count: 1,517 pins
- Speed Grade: -1 (standard performance)
- Operating Temperature: Industrial grade (I) – suitable for -40ยฐC to +100ยฐC
Key Features:
- Advanced 20nm FinFET+ technology
- High-bandwidth memory controller support
- Integrated 100G Ethernet and PCIe Gen4 connectivity
- Power-efficient design with dynamic power management
- Support for high-speed transceivers up to 32.75 Gbps
Price
The XCVU095-1FFVD1517I is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities. Contact authorized Xilinx distributors for current pricing, volume discounts, and availability. Pricing typically varies based on:
- Order quantity and volume commitments
- Lead times and delivery requirements
- Additional services such as programming and testing
- Regional market conditions
For the most competitive pricing on the XCVU095-1FFVD1517I, request quotes from multiple authorized distributors and consider long-term supply agreements for volume applications.
Documents & Media
Essential documentation for the XCVU095-1FFVD1517I includes:
Technical Documentation:
- Product Brief and Datasheet
- DC and AC Switching Characteristics
- Package and Pinout Specifications
- PCB Design Guidelines
- Thermal Management Guidelines
Design Resources:
- Vivado Design Suite compatibility information
- IP Core documentation
- Reference designs and application notes
- Power estimation and analysis tools
- Signal integrity guidelines
Development Tools:
- Vivado Design Suite support files
- Hardware debugging capabilities
- Simulation models and libraries
- Example designs and tutorials
Related Resources
The XCVU095-1FFVD1517I integrates seamlessly with Xilinx’s comprehensive ecosystem:
Development Platforms:
- Virtex UltraScale+ evaluation boards
- Custom development platforms from third-party vendors
- Prototyping and validation systems
Software Tools:
- Vivado Design Suite for synthesis and implementation
- Vitis unified software platform for application development
- IP Integrator for system-level design
- Hardware debugging and analysis tools
Support Resources:
- Xilinx technical support and documentation
- Community forums and knowledge base
- Training courses and certification programs
- Partner ecosystem for specialized applications
Environmental & Export Classifications
The XCVU095-1FFVD1517I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals compliance
- ISO 14001 environmental management standards
Export Classifications:
- Export Control Classification Number (ECCN) as defined by US Department of Commerce
- Compliance with International Traffic in Arms Regulations (ITAR) where applicable
- Country-specific import/export requirements
- End-use and end-user restrictions may apply
Quality Standards:
- Automotive-grade options available (AEC-Q100 qualified variants)
- Military and aerospace grade screening available
- Industrial temperature range operation (-40ยฐC to +100ยฐC)
- Extended reliability testing and qualification
The XCVU095-1FFVD1517I represents the pinnacle of FPGA technology, offering designers the performance, flexibility, and reliability needed for next-generation applications in artificial intelligence, machine learning, 5G communications, and high-performance computing platforms.
