Overview
The XCVU095-3FFVB1760E is a flagship Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale family, engineered for demanding applications requiring maximum performance and advanced processing capabilities. This high-speed grade-3 device delivers exceptional performance for data center acceleration, machine learning, and high-bandwidth applications.
Product Specifications
Core Architecture
- Device Family: Virtex UltraScale FPGA
- Part Number: XCVU095-3FFVB1760E
- Logic Cells: 940,800 cells
- Speed Grade: -3 (highest performance)
- Process Technology: 20nm node
- Core Voltage: 0.95V
- Operating Temperature: Extended commercial range
Package Details
- Package Type: FCBGA (Flip Chip Ball Grid Array)
- Pin Count: 1760 pins
- Package Code: FFV
- Ball Pitch: Fine pitch for high-density routing
- Thermal Solution: Advanced thermal interface compatible
Key Performance Features
- System Logic Cells: 940,800 configurable logic blocks
- DSP Slices: High-performance DSP48E2 slices for signal processing
- Block RAM: Distributed memory architecture with UltraRAM
- I/O Pins: 702 user I/O pins for maximum connectivity
- Transceivers: High-speed serial transceivers supporting 100G Ethernet and 150G Interlaken
- PCIe Support: PCIe Gen3 x8 and x16 endpoint and root port configurations
Advanced Capabilities
- UltraScale Architecture: Next-generation stacked silicon interconnect (SSI) technology
- Power Efficiency: Optimized for low power consumption with smart power management
- High-Speed Interfaces: Support for DDR4, QDR-IV, and high-speed memory controllers
- Security Features: Hardware-based security and anti-tamper capabilities
- Processing System: Heterogeneous processing acceleration support
Price Information
Current Market Pricing
The XCVU095-3FFVB1760E is positioned as a premium FPGA with pricing reflecting its advanced capabilities and speed grade-3 performance. Pricing typically varies based on:
- Quantity Breaks: Volume discounts available for large orders
- Distributor Selection: Authorized distributors offer competitive pricing
- Lead Times: Pricing may fluctuate based on availability and demand
- Package Options: Different package variants affect final pricing
Ordering Information
- Minimum Order Quantity: Contact distributors for MOQ requirements
- Lead Time: Standard lead times range from 12-26 weeks
- Availability: Available through authorized AMD/Xilinx distributors
- Sample Requests: Engineering samples available for qualified customers
Note: For current pricing and availability, contact authorized distributors or submit a quote request through official channels.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical and timing specifications
- User Guide: Comprehensive implementation and design guidance
- Package Information: Detailed package drawings and pin assignments
- Application Notes: Design best practices and implementation examples
- Errata: Known issues and workarounds for design considerations
Software & Tools
- Vivado Design Suite: Primary development environment for XCVU095-3FFVB1760E
- IP Catalog: Extensive library of verified IP cores and interfaces
- Simulation Models: Behavioral and timing simulation models
- Reference Designs: Pre-built designs for common applications
- Board Support Packages: Development board support and examples
Media Resources
- Product Videos: Technical overviews and application demonstrations
- Webinars: Live and recorded technical sessions
- Training Materials: Online courses and certification programs
- Community Forums: User support and design discussion platforms
Related Resources
Development Ecosystem
- Evaluation Boards: VCU095 evaluation platform for rapid prototyping
- Development Kits: Complete development solutions with software and IP
- Partner Solutions: Third-party board and module providers
- Training Programs: Comprehensive FPGA design training courses
Technical Support
- Design Services: Professional design assistance and consulting
- Technical Forums: Community-driven support and knowledge sharing
- Application Engineers: Direct technical support for complex designs
- Documentation Portal: Comprehensive resource library and search
Competitive Advantages
- Performance Leadership: Highest speed grade in the XCVU095 family
- Proven Architecture: Battle-tested UltraScale technology
- Ecosystem Support: Extensive tool and IP ecosystem
- Long-term Availability: Industrial-grade product lifecycle support
Application Areas
- Data Center Acceleration: Machine learning and AI workloads
- High-Frequency Trading: Ultra-low latency financial applications
- Aerospace & Defense: Mission-critical processing systems
- Test & Measurement: High-speed signal processing and analysis
- Communications Infrastructure: 5G and beyond wireless systems
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with RoHS 2011/65/EU directives
- REACH Regulation: Compliant with REACH SVHC requirements
- Halogen-Free: Meets halogen-free package requirements
- Lead-Free: Pb-free solder bump and package construction
- Conflict Minerals: Compliant with conflict minerals regulations
Quality & Reliability
- Quality Standards: ISO 9001:2015 certified manufacturing
- Reliability Testing: Comprehensive JEDEC standard qualification
- Moisture Sensitivity: MSL-3 rating for handling requirements
- ESD Protection: Human Body Model (HBM) and Charged Device Model (CDM) qualified
- Operating Life: 20+ year design life expectancy
Export Classifications
- ECCN: Export Control Classification Number as per US regulations
- HTS Code: Harmonized Tariff Schedule classification
- Country of Origin: Manufacturing location and origin documentation
- Export Licensing: Compliance with international export regulations
- Dual-Use Technology: Appropriate handling for dual-use applications
Packaging & Handling
- Moisture Barrier Bag: Vacuum-sealed packaging for moisture protection
- Baking Requirements: Specific baking procedures if moisture limits exceeded
- Handling Precautions: ESD-safe handling and storage requirements
- Traceability: Full lot traceability and serialization support
- Shipping Classifications: Proper shipping and handling classifications
XCVU095-3FFVB1760E represents the pinnacle of FPGA technology, combining exceptional performance with comprehensive development support. This advanced device enables breakthrough applications in high-performance computing, communications, and acceleration markets. Contact authorized distributors for current pricing, availability, and technical support.
Keywords: XCVU095-3FFVB1760E, Virtex UltraScale FPGA, high-performance FPGA, AMD FPGA, field programmable gate array, 20nm FPGA, speed grade 3, FCBGA-1760, data center acceleration, machine learning FPGA
