Product Overview
The XCVU125-3FLVB2104E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex UltraScale family. This high-performance programmable logic device combines exceptional processing power with advanced energy efficiency, making it ideal for demanding applications requiring complex digital processing and high-speed data handling.
1. Product Specifications
Core Architecture
- FPGA Family: Virtex UltraScale
- Technology Node: 20nm
- Logic Elements: 1,566,600 cells
- Logic Blocks: 716,160 blocks
- Speed Grade: -3 (high performance)
Memory and Storage
- Total RAM Bits: 90,726,400 bits (90.7 Mbit)
- Block RAM: High-density embedded memory blocks
- Memory Architecture: Advanced on-chip memory hierarchy
I/O and Connectivity
- I/O Count: 702 I/O pins
- Package Type: 2104-pin Flip-Chip BGA (FCBGA)
- Package Size: 47.5mm x 47.5mm
- Pin Count: 2104 pins
Electrical Specifications
- Supply Voltage: 0.970V ~ 1.030V
- Operating Temperature: 0°C ~ 100°C (Junction Temperature)
- Mounting Type: Surface Mount
- Part Status: Active
Performance Features
- High-Speed Processing: Optimized for maximum throughput
- DSP Capabilities: Advanced Digital Signal Processing blocks
- Transceiver Support: High-speed serial I/O capabilities
- Clock Management: Multiple clock domains and PLL resources
2. Pricing Information
Pricing: Contact for Quote (RFQ)
- Minimum Order Quantity: 1 piece
- Available Inventory: 10,000+ pieces in stock
- Package: Tray packaging
- Lead Time: 5-10 business days
Note: Due to market fluctuations, pricing is provided upon request. Contact authorized distributors for current pricing and volume discounts.
3. Documents & Media
Official Documentation
- Datasheet: XCVU125-3FLVB2104E PDF datasheet available
- User Guide: Virtex UltraScale FPGA User Guide
- Package Information: UG575 – Package and pinout specifications
- Pin Configuration: ASCII and CSV format pinout files
Development Resources
- Design Tools: Vivado Design Suite compatibility
- Development Environment: Full Xilinx toolchain support
- Programming: JTAG and configuration interfaces
- Simulation: ModelSim and Vivado Simulator support
Technical Support
- Application Notes: Available through AMD Xilinx portal
- Reference Designs: Sample implementations and examples
- Community Support: AMD Customer Community access
- Technical Documentation: Comprehensive user manuals
4. Related Resources
Development Tools
- Vivado Design Suite: Primary development environment
- Vitis Unified Software Platform: For acceleration development
- System Generator: MATLAB/Simulink integration
- SDK: Software Development Kit for embedded applications
Evaluation Platforms
- Development Boards: Compatible with Virtex UltraScale evaluation kits
- Evaluation Kits: VCU118 and similar platforms
- Reference Designs: Industry-standard implementations
- Training Resources: Online courses and documentation
Compatible Products
- Memory Interfaces: DDR4, DDR3, QDR support
- Transceivers: High-speed serial connectivity
- Processing Units: ARM Cortex integration capabilities
- Peripheral Interfaces: PCIe, Ethernet, USB support
Application Areas
- Data Center Acceleration: Machine learning and AI workloads
- 5G Infrastructure: Wireless communication systems
- Video Processing: Real-time video analytics
- Industrial Automation: Control and monitoring systems
- Aerospace & Defense: Mission-critical applications
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Yes – Fully compliant with RoHS 2/3 directives
- REACH Compliance: Compliant with EU REACH regulations
- Lead-Free: Pb-free manufacturing process
- Halogen-Free: Environmentally friendly materials
RoHS Certification Details
- Restricted Substances: Below allowable limits for all 10 restricted substances
- Heavy Metals: Lead, Mercury, Cadmium within specifications
- Flame Retardants: PBB/PBDE compliant
- Phthalates: DEHP, BBP, DBP, DIBP compliant
Export Classifications
- ECCN: Export Control Classification Number available
- Country of Origin: Manufactured in certified facilities
- Trade Compliance: Meets international trade regulations
- Customs Classification: HS code classification available
Quality Standards
- ISO Certification: ISO 9001 manufacturing quality
- Automotive: AEC-Q100 qualified variants available
- Military: MIL-STD specifications for defense applications
- Industrial: Extended temperature range options
Packaging and Shipping
- MSL Rating: Moisture Sensitivity Level classification
- ESD Protection: Electrostatic discharge safe packaging
- Traceability: Full lot traceability and documentation
- Shelf Life: Long-term storage specifications
Why Choose XCVU125-3FLVB2104E?
The XCVU125-3FLVB2104E represents the pinnacle of FPGA technology, offering:
Superior Performance: With over 1.5 million logic elements and advanced 20nm technology, this device delivers exceptional computational power for the most demanding applications.
Energy Efficiency: UltraScale architecture provides unprecedented power savings while maintaining peak performance, making it ideal for power-constrained environments.
Versatile Connectivity: 702 I/O pins and advanced transceiver capabilities enable seamless integration with modern system architectures.
Comprehensive Support: Backed by AMD Xilinx’s industry-leading development tools and extensive documentation, ensuring rapid time-to-market for your projects.
Proven Reliability: Manufactured to the highest quality standards with full environmental compliance and extensive testing protocols.
For technical specifications, pricing information, or to request samples of the XCVU125-3FLVB2104E, contact your authorized AMD Xilinx distributor or visit the official AMD website.
