The XCVU160-1FLGB2104I is a cutting-edge field-programmable gate array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, aerospace, defense, and high-performance computing environments.
Product Specification
The XCVU160-1FLGB2104I features advanced 20nm technology with impressive specifications that make it ideal for complex digital signal processing and acceleration tasks. This FPGA includes 1,182,240 logic cells and 1,728 DSP slices, providing substantial computational power for parallel processing applications.
Key specifications of the XCVU160-1FLGB2104I include:
- Logic Cells: 1,182,240 system logic cells
- Block RAM: 75.9 Mb total block RAM
- UltraRAM: 360 Mb UltraRAM capacity
- DSP Slices: 1,728 DSP58 slices for signal processing
- Package: FLGB2104 (1760-pin flip chip BGA)
- Speed Grade: -1 (industrial temperature range)
- I/O Pins: Up to 832 user I/O pins
- Transceivers: 80 GTY transceivers supporting up to 32.75 Gbps
- PCIe: PCIe Gen4 x16 support
The XCVU160-1FLGB2104I operates across an industrial temperature range of -40ยฐC to +100ยฐC, ensuring reliable performance in harsh environments. The device supports multiple voltage standards and features advanced power management capabilities for optimized energy efficiency.
Price
Pricing for the XCVU160-1FLGB2104I varies based on quantity, distribution channel, and current market conditions. As a high-end FPGA solution, this device typically falls within the premium price range reflecting its advanced capabilities and performance specifications.
For current pricing information on the XCVU160-1FLGB2104I:
- Contact authorized Xilinx distributors
- Request quotes through official semiconductor suppliers
- Check with regional electronics component vendors
- Consult Xilinx direct sales for volume pricing
Pricing considerations include lead times, packaging options, and additional support services that may affect the total cost of ownership for the XCVU160-1FLGB2104I in your specific application.
Documents & Media
Comprehensive documentation and media resources are available for the XCVU160-1FLGB2104I to support design implementation and development:
Technical Documentation:
- Xilinx Virtex UltraScale+ FPGA Data Sheet
- XCVU160-1FLGB2104I Product Brief
- Package and Pinout Specifications
- Electrical Characteristics and AC/DC Parameters
- Thermal and Power Consumption Guidelines
Design Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Board design guidelines for FLGB2104 package
- Signal integrity recommendations
- Power delivery network design guides
Software Tools:
- Vivado Design Suite support files
- Device-specific constraint files
- Simulation models and libraries
- Programming and configuration utilities
These resources ensure developers can effectively utilize the XCVU160-1FLGB2104I’s capabilities while minimizing development time and potential design issues.
Related Resources
The XCVU160-1FLGB2104I ecosystem includes various related resources to enhance development and implementation:
Development Boards:
- Xilinx VCU118 Evaluation Kit (compatible platform)
- Custom carrier boards supporting FLGB2104 package
- Third-party development platforms
IP Cores and Libraries:
- Xilinx IP catalog compatibility
- Signal processing IP cores
- Connectivity IP for networking applications
- Video and imaging processing IP
Partner Solutions:
- Third-party development tools
- Specialized software applications
- System integration services
- Technical support and consulting
Community Resources:
- Xilinx Developer Forums
- Application notes and white papers
- Video tutorials and webinars
- User community contributions
These resources provide comprehensive support for implementing the XCVU160-1FLGB2104I in various applications, from prototyping to production deployment.
Environmental & Export Classifications
The XCVU160-1FLGB2104I meets stringent environmental and regulatory requirements for global deployment:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliance
- Conflict minerals reporting compliance
- Green packaging initiatives support
Operating Environmental Conditions:
- Industrial temperature range: -40ยฐC to +100ยฐC junction temperature
- Storage temperature range: -65ยฐC to +150ยฐC
- Humidity tolerance: Up to 85% relative humidity
- Altitude operation: Up to 2000 meters
Export Classification:
- Export Control Classification Number (ECCN) as specified by US Department of Commerce
- Country-specific import/export regulations compliance
- International Traffic in Arms Regulations (ITAR) considerations where applicable
Quality Standards:
- ISO 9001 manufacturing quality certification
- Automotive qualification standards compliance where applicable
- Military and aerospace standards compatibility
Packaging and Shipping:
- Anti-static packaging for ESD protection
- Moisture sensitivity level (MSL) rating compliance
- Traceability and lot control for supply chain management
The XCVU160-1FLGB2104I’s environmental and export classifications ensure global availability while meeting regional regulatory requirements for deployment in various markets and applications.
