High-Performance Field Programmable Gate Array for Advanced Digital Processing Applications
The XCVU160-2FLGC2104I is a high-density Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale family, designed to deliver exceptional performance, power efficiency, and processing capabilities for demanding applications. This advanced FPGA combines cutting-edge 20nm technology with innovative UltraScale architecture to provide unprecedented computational power and flexibility.
1. Product Specifications
Core Specifications
- Part Number: XCVU160-2FLGC2104I
- Manufacturer: AMD (formerly Xilinx)
- Family: Virtex UltraScale
- Technology Node: 20nm
- Package Type: FCBGA (Flip Chip Ball Grid Array)
- Pin Count: 2104 pins
- Speed Grade: -2 (Commercial grade)
Logic Resources
- Logic Cells: 1,621,200 cells
- Logic Blocks: 926,400
- Macrocells: 2,026,500
- Total RAM: 13,005 Kbit
- I/O Count: 416 user I/Os
Performance Features
- Supply Voltage: 0.95V core voltage
- Operating Temperature: Commercial temperature range
- Power Optimization: Advanced UltraScale power management
- DSP Slices: High-performance digital signal processing capabilities
- Block RAM: Integrated memory blocks for data storage
Package Details
- Package Style: FCBGA-2104
- Ball Pitch: Industry-standard spacing
- Thermal Performance: Optimized for high-performance applications
- Pin Configuration: 2104-pin flip chip ball grid array
2. Pricing Information
The XCVU160-2FLGC2104I pricing varies based on quantity, distributor, and current market conditions. For the most competitive pricing and availability:
Procurement Options
- Authorized Distributors: Contact certified AMD/Xilinx distributors
- Volume Pricing: Significant discounts available for bulk orders
- Quote Requests: Submit BOM for custom pricing
- Lead Times: Varies by supplier and quantity requirements
Cost Considerations
- Unit Price: Contact distributors for current pricing
- Development Costs: Factor in Vivado Design Suite licensing
- Support Costs: Consider technical support and training requirements
- Total Cost of Ownership: Evaluate long-term project requirements
Note: Pricing is subject to change based on market conditions. Contact authorized distributors for current pricing and availability.
3. Documents & Media
Technical Documentation
- Product Datasheet: Comprehensive specifications and electrical characteristics
- User Guide: Implementation guidelines and best practices
- Package and Pinout Files: Detailed pin assignments and package drawings
- Programming Guide: Configuration and programming instructions
Development Resources
- Vivado Design Suite: Primary development environment
- IP Core Library: Pre-designed intellectual property blocks
- Reference Designs: Example implementations and tutorials
- Application Notes: Specific use case implementations
Support Materials
- Errata Documents: Known issues and workarounds
- Migration Guides: Upgrade paths from previous generations
- Thermal Management: Heat dissipation guidelines
- Signal Integrity: High-speed design considerations
Download Sources
- AMD/Xilinx Support Portal
- Authorized distributor technical libraries
- Development tool integrated help systems
- Community forums and knowledge bases
4. Related Resources
Development Tools
- Vivado Design Suite: Industry-leading FPGA development environment
- Vivado HLS: High-level synthesis for C/C++/SystemC
- SDK/Vitis: Software development kit for embedded applications
- ModelSim: HDL simulation and verification tools
Evaluation Platforms
- Development Boards: Third-party evaluation platforms
- Starter Kits: Entry-level development systems
- Reference Designs: Pre-configured application examples
- Evaluation Modules: Specialized testing platforms
Technical Support
- AMD Support Portal: Official technical support and documentation
- Community Forums: User-driven support and discussions
- Training Programs: Certification and educational resources
- Professional Services: Design consulting and implementation support
Compatible Technologies
- PCIe Interfaces: High-speed peripheral connectivity
- Ethernet Controllers: 100G and multi-gigabit networking
- Memory Interfaces: DDR4, QDR, and other high-speed memory
- Transceiver Technology: Multi-gigabit serial communication
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliance: Complies with EU chemical safety regulations
- Lead-Free: Manufactured using lead-free processes
- Halogen Status: Check specific documentation for halogen content
- Operating Temperature: Commercial temperature range (0ยฐC to 85ยฐC)
- Storage Temperature: Extended temperature range for storage
Export Control Information
- Export Control Classification Number (ECCN): Contact AMD for current classification
- Country of Origin: Check with manufacturer for current production location
- Export Licensing: May require export license for certain destinations
- Technology Transfer: Subject to U.S. export control regulations
- End-Use Restrictions: Certain applications may require additional licensing
Regulatory Certifications
- CE Marking: European Conformity certification
- FCC Compliance: Federal Communications Commission approval
- ITAR Classification: Check for International Traffic in Arms Regulations status
- EAR99 Status: May be subject to Export Administration Regulations
Quality Standards
- ISO Certification: Manufactured under ISO quality standards
- Automotive Grade: Check specifications for automotive compliance requirements
- Industrial Grade: Suitable for industrial temperature ranges
- Quality Assurance: Comprehensive testing and validation procedures
Applications and Use Cases
The XCVU160-2FLGC2104I is ideal for:
- High-performance computing accelerators
- Advanced driver assistance systems (ADAS)
- Machine learning and AI inference
- 5G wireless infrastructure
- Video processing and transcoding
- Aerospace and defense systems
- Medical imaging equipment
- High-frequency trading systems
Why Choose XCVU160-2FLGC2104I?
This FPGA delivers the perfect balance of performance, power efficiency, and cost-effectiveness for demanding applications requiring high-speed processing, flexible I/O configurations, and advanced connectivity options. The UltraScale architecture provides superior performance per watt while maintaining compatibility with existing design flows and IP libraries.
For technical specifications, pricing, and availability of the XCVU160-2FLGC2104I, contact authorized AMD distributors or visit the official AMD support portal.
