The XCVU190-1FLGA2577I is a powerful field-programmable gate array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, aerospace, defense, and high-performance computing environments.
Product Specification
The XCVU190-1FLGA2577I features cutting-edge 20nm technology and provides outstanding computational capabilities for complex digital signal processing and acceleration workloads.
Key Technical Specifications:
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 2,286,000
- CLB LUTs: 1,143,000 6-input lookup tables
- Block RAM: 75.9 Mb total block RAM capacity
- UltraRAM: 360 Mb of UltraRAM for high-capacity storage
- DSP Slices: 6,840 DSP48E2 slices for signal processing
- Package Type: FLGA2577 (Flip-Chip Land Grid Array)
- Speed Grade: -1 (industrial temperature range)
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
- I/O Pins: 832 user I/O pins
- Transceivers: 80 GTY transceivers supporting up to 32.75 Gbps
- PCIe Support: PCIe Gen4 x16 connectivity
The XCVU190-1FLGA2577I incorporates advanced features including built-in security capabilities, hardened memory controllers, and integrated 100G Ethernet MACs, making it ideal for next-generation networking and acceleration applications.
Price
Pricing for the XCVU190-1FLGA2577I varies based on quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability information. Volume discounts are typically available for large-quantity orders.
For budget planning purposes, enterprise customers should expect pricing in the high-end FPGA category, reflecting the advanced capabilities and extensive resources of this Virtex UltraScale+ device.
Documents & Media
Technical Documentation:
- Product Data Sheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive implementation and design guidelines
- Package and Pinout Information: Detailed pin assignments and package dimensions
- Power and Thermal Management Guide: Thermal design considerations and power consumption data
- Migration Guide: Information for upgrading from previous FPGA generations
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Evaluation board documentation
- IP core integration guides
Quality and Reliability:
- Qualification reports and reliability data
- Quality management system certifications
- Environmental testing results
Related Resources
Development Tools:
- Vivado Design Suite: Primary development environment for the XCVU190-1FLGA2577I
- Vitis Unified Software Platform: High-level synthesis and application development
- Hardware Debug Tools: ChipScope and integrated logic analyzers
Evaluation Platforms:
- VCU190 Evaluation Kit: Complete development platform featuring the XCVU190-1FLGA2577I
- Custom carrier boards and development modules from third-party vendors
IP Cores and Libraries:
- Xilinx IP catalog with hundreds of verified IP cores
- Third-party IP solutions optimized for Virtex UltraScale+ architecture
- Open-source HDL libraries and reference implementations
Training and Support:
- Xilinx University Program educational resources
- Technical support documentation and knowledge base
- Community forums and design methodology guides
Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with European chemicals regulation
- Halogen-Free: Environmentally conscious packaging and materials
- Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial grade I suffix)
- Storage Temperature Range: -65ยฐC to +150ยฐC
Export Control Information:
- ECCN Classification: Subject to US Export Administration Regulations (EAR)
- Country of Origin: Manufactured in controlled facilities with full traceability
- Export License: May require export license for certain destinations
- ITAR Status: Not subject to International Traffic in Arms Regulations
Quality Standards:
- ISO 9001: Manufactured under certified quality management systems
- Automotive Grade: AEC-Q100 qualified variants available
- Military/Aerospace: Extended temperature and screening options available
Packaging and Handling:
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- ESD Protection: Proper electrostatic discharge handling required
- Tray Packaging: Anti-static trays for secure shipping and storage
The XCVU190-1FLGA2577I represents the pinnacle of FPGA technology, combining massive parallel processing capabilities with advanced connectivity features. Its robust environmental specifications and comprehensive compliance certifications make it suitable for deployment in the most demanding applications across multiple industries.
