The XCVU190-2FLGA2577E is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, communications, and high-performance computing environments.
Product Specification
The XCVU190-2FLGA2577E features advanced 20nm technology with impressive specifications that make it ideal for complex digital signal processing and acceleration tasks:
Core Architecture:
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 2,286,000
- CLB LUTs: 1,143,000 6-input lookup tables
- Block RAM: 75.9 Mb total block RAM
- UltraRAM: 360 Mb of UltraRAM memory
Processing Capabilities:
- DSP Slices: 1,968 DSP48E2 slices for high-speed arithmetic operations
- Speed Grade: -2 (standard performance)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
Package Details:
- Package Type: FLGA2577 (Fine-pitch Land Grid Array)
- Pin Count: 2,577 pins
- Package Size: 45mm x 45mm
- I/O Pins: 832 user I/O pins
Memory and Connectivity:
- PCIe: PCIe Gen3 x16 capability
- Transceivers: 48 GTY transceivers supporting up to 32.75 Gbps
- Memory Controllers: DDR4-2666 support with built-in error correction
Price
The XCVU190-2FLGA2577E is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities. Contact authorized Xilinx distributors for current pricing information, as costs vary based on:
- Order quantities (volume discounts available)
- Lead times and availability
- Regional market conditions
- Support and warranty requirements
Typical pricing ranges from $8,000 to $12,000 per unit for standard commercial quantities, with significant reductions available for large-volume orders.
Documents & Media
Technical Documentation:
- XCVU190-2FLGA2577E Product Brief
- Virtex UltraScale+ FPGA Data Sheet (DS893)
- Packaging and Pinout Specifications
- Power and Thermal Design Guidelines
- PCB Design and Layout Guidelines
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Evaluation board documentation
- Programming and configuration guides
Software Tools:
- Xilinx Vivado Design Suite support
- SDK and runtime libraries
- Simulation models and timing files
- Power estimation tools
Related Resources
Development Boards:
- Xilinx VCU190 Evaluation Platform
- Custom carrier boards from third-party vendors
- Prototyping and development kits
Compatible Products:
- Other Virtex UltraScale+ family members
- Zynq UltraScale+ MPSoCs for hybrid solutions
- Kintex UltraScale+ for cost-optimized alternatives
Application Areas:
- 5G wireless infrastructure
- Machine learning acceleration
- High-frequency trading systems
- Aerospace and defense applications
- Data center acceleration cards
Support Resources:
- Xilinx Community Forums
- Technical support portal
- Training and certification programs
- Partner ecosystem and design services
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (lead-free package)
- REACH regulation compliance
- Conflict minerals reporting available
- ISO 14001 environmental management certification
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Junction temperature: Up to 100ยฐC
- Storage temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Various (check specific lot)
- Export licensing may be required for certain destinations
Quality and Reliability:
- Automotive-grade versions available (XCVU190-2FLGA2577I)
- Extended temperature range options
- Radiation-tolerant variants for space applications
- Military/aerospace screening available
Packaging and Shipping:
- Moisture sensitivity level (MSL): Level 3
- Antistatic packaging required
- Dry pack shipping for optimal handling
- Traceability documentation included
The XCVU190-2FLGA2577E represents the pinnacle of FPGA technology, combining massive parallel processing capabilities with flexible programmability to accelerate the most demanding computational workloads across industries.
