Overview
The XCVU190-3FLGC2104E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Virtex UltraScale family, designed to deliver exceptional performance for demanding computational applications. This advanced FPGA combines high logic density with superior power efficiency, making it an ideal choice for data centers, aerospace, defense, and high-performance computing applications.
1. Product Specifications
Core Architecture
- FPGA Family: Virtex UltraScale Series
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Part Number: XCVU190-3FLGC2104E
- Technology Node: 20nm process technology
- Speed Grade: -3 (high performance)
Logic Resources
- Logic Cells: 1,879,920 system logic cells
- Macrocells: 2,349,900 total macrocells
- Logic Blocks: 1,074,240 configurable logic blocks (CLBs)
- Total RAM: 136,090 Kbits block RAM
- DSP Slices: High-density DSP blocks for signal processing
Physical Characteristics
- Package Type: FCBGA (Flip Chip Ball Grid Array)
- Pin Count: 2104-pin configuration
- Package Code: FLGC2104E
- I/O Pins: 416 user I/O pins
- Operating Voltage: 0.95V core voltage
- I/O Supply Voltage: 3.3V
Performance Specifications
- Maximum Operating Frequency: 725 MHz
- Clock Management: Mixed-Mode Clock Manager (MMCM) and Phase-Locked Loop (PLL)
- Core Supply Voltage Range: 922mV to 979mV
- Temperature Range: Commercial grade (0ยฐC to 85ยฐC)
Advanced Features
- UltraScale Architecture: Next-generation stacked silicon interconnect (SSI) technology
- Power Optimization: Advanced power management for reduced total power consumption
- High-Speed Transceivers: Integrated multi-gigabit transceivers
- Memory Interface: Support for DDR4, DDR3, and other high-speed memory standards
2. Pricing Information
The XCVU190-3FLGC2104E pricing varies based on quantity, distributor, and current market conditions. Key pricing considerations include:
Price Factors
- Volume Discounts: Bulk pricing available for quantities over 25 units
- Lead Times: Standard lead times range from 12-16 weeks
- Authorized Distributors: Available through Digi-Key, Newark, Mouser, and other authorized channels
- Quote Requests: Contact distributors for current pricing and availability
Market Intelligence
Real-time pricing data is available through electronic component search engines like Octopart and distributor websites. Historical price trends indicate stable pricing with occasional fluctuations based on global semiconductor supply conditions.
3. Documents & Media
Technical Documentation
- Datasheet: Complete technical specifications and electrical characteristics
- User Guide: UG575 – UltraScale Architecture and Product Data Sheet
- Package Files: Pinout files available in TXT and CSV formats
- Application Notes: Design guidelines and implementation recommendations
Development Resources
- Vivado Design Suite: Primary development environment for XCVU190-3FLGC2104E
- IP Cores: Extensive library of pre-verified intellectual property blocks
- Reference Designs: Example implementations for common applications
- Software Support: Full toolchain support including synthesis, implementation, and debugging
Media Resources
- Block Diagrams: Detailed architecture illustrations
- Package Drawings: Mechanical specifications and dimensions
- Thermal Models: Junction-to-ambient thermal resistance data
- PCB Layout Guidelines: Best practices for board design
4. Related Resources
Development Platforms
- Evaluation Boards: Various development boards supporting XCVU190 series
- Starter Kits: Complete development solutions for rapid prototyping
- Reference Platforms: Industry-standard evaluation platforms
Compatible Products
- XCVU190-2FLGC2104E: Lower speed grade variant (-2 speed grade)
- XCVU190-1FLGC2104E: Entry-level speed grade option
- Package Variants: Alternative package options (FLGB, FLGA)
Technical Support
- FPGA Forums: Community-driven support and knowledge sharing
- Application Engineers: Direct technical support from AMD Xilinx
- Training Resources: Online courses and certification programs
- Design Services: Professional design consultation and implementation services
Software Ecosystem
- Vivado HLS: High-level synthesis for C/C++ to RTL conversion
- SDSoC: Software-defined SoC development environment
- PetaLinux: Embedded Linux development tools
- Vitis: Unified software platform for FPGA and SoC development
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Meets RoHS (Restriction of Hazardous Substances) requirements
- REACH Compliance: Compliant with European chemical safety regulations
- Halogen-Free: Lead-free and halogen-free package construction
- Environmental Rating: Pb-free and environmentally conscious manufacturing
Export Control Information
- ECCN Classification: Export Control Classification Number available upon request
- HTS Code: Harmonized Tariff Schedule classification for international trade
- Country of Origin: Manufactured in authorized AMD Xilinx facilities
- Export Restrictions: Subject to applicable export control regulations
Packaging & Handling
- Moisture Sensitivity Level (MSL): Specified moisture sensitivity rating
- ESD Protection: Electrostatic discharge protection requirements
- Storage Conditions: Temperature and humidity specifications for storage
- Shelf Life: Extended shelf life under proper storage conditions
Quality Standards
- ISO Certification: Manufactured under ISO quality management systems
- Automotive Grade: Available in automotive-qualified versions (contact for details)
- Industrial Temperature: Extended temperature range options available
- Reliability Testing: Comprehensive qualification and reliability testing
Applications
The XCVU190-3FLGC2104E excels in applications requiring high computational performance and flexibility:
- Data Center Acceleration: Machine learning inference and data analytics
- 5G Wireless Infrastructure: Baseband processing and beamforming
- Aerospace & Defense: Radar processing and software-defined radio
- High-Performance Computing: Scientific computing and simulation
- Video Processing: 4K/8K video transcoding and broadcasting
- Network Infrastructure: Packet processing and protocol offload
Conclusion
The XCVU190-3FLGC2104E represents the pinnacle of FPGA technology, combining advanced 20nm process technology with the proven UltraScale architecture. Its exceptional balance of performance, power efficiency, and flexibility makes it an ideal choice for next-generation applications requiring programmable acceleration and high-speed processing capabilities.
For detailed technical specifications, pricing information, and design support, contact authorized AMD Xilinx distributors or visit the official AMD Xilinx website.
