The XCVU190-H1FLGA2577E is a cutting-edge Field-Programmable Gate Array (FPGA) from AMD Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, networking, and high-performance computing environments.
Product Specifications
Core Features of XCVU190-H1FLGA2577E
The XCVU190-H1FLGA2577E features advanced 20nm technology and offers superior processing capabilities:
Logic Resources:
- Logic Cells: 1,143,000
- CLB Look-Up Tables (LUTs): 537,600
- CLB Flip-Flops: 1,075,200
- Block RAM: 38.4 Mb
- UltraRAM: 34.6 Mb
Processing Elements:
- DSP48E2 Slices: 1,728
- PCIe Gen3 x16 Lanes: 4
- 100G Ethernet MACs: 4
- 150G Interlaken Cores: 2
Package Details:
- Package Type: FLGA2577 (Flip-Chip Land Grid Array)
- Pin Count: 2,577 pins
- Operating Temperature: -40ยฐC to +100ยฐC (H1 speed grade)
- Voltage: 0.85V core, 1.8V I/O
Performance Specifications
The XCVU190-H1FLGA2577E delivers exceptional performance metrics:
- Speed Grade: -1 (highest performance)
- Maximum system clock frequency: 741 MHz
- Memory Interface: DDR4-2666, DDR3-1866
- Transceivers: Up to 80 GTY transceivers at 32.75 Gbps
Price Information
XCVU190-H1FLGA2577E Pricing:
- Unit Price: Contact manufacturer for current pricing
- Volume Discounts: Available for quantities of 100+ units
- Lead Time: 12-16 weeks (standard delivery)
- Minimum Order Quantity: 1 unit
- Distribution: Available through authorized distributors worldwide
Note: Prices are subject to change based on market conditions and order volume. Contact your local distributor for the most current XCVU190-H1FLGA2577E pricing information.
Documents & Media
Technical Documentation for XCVU190-H1FLGA2577E
Datasheets & Specifications:
- Product Brief: XCVU190-H1FLGA2577E overview and key features
- Complete Datasheet: Detailed electrical and timing specifications
- Package Information: Pin assignments and mechanical drawings
- Thermal Design Guidelines: Heat dissipation and cooling requirements
Design Resources:
- Reference Designs: Sample implementations and use cases
- Application Notes: Best practices for XCVU190-H1FLGA2577E integration
- PCB Layout Guidelines: Board design recommendations
- Power Supply Design Guide: Voltage regulation requirements
Software Tools:
- Vivado Design Suite: Complete development environment
- IP Catalog: Pre-verified IP cores and interfaces
- Hardware Debug Tools: ChipScope Pro and integrated logic analyzer
Related Resources
Development Tools for XCVU190-H1FLGA2577E
Evaluation Boards:
- VCU1525 Acceleration Development Kit: Complete development platform
- Custom carrier boards: Third-party evaluation options
- Breakout boards: For prototyping and testing
Compatible IP Cores:
- Video processing IP: H.264/H.265 codecs
- Networking IP: Ethernet, PCIe, and high-speed interfaces
- Signal processing IP: Digital filters and transforms
- Memory controllers: DDR4, QDR, and RLDRAM interfaces
Training & Support:
- Online training modules: FPGA design fundamentals
- Technical support: 24/7 engineering assistance
- Community forums: Developer resources and discussions
- Webinars: Latest XCVU190-H1FLGA2577E applications
Application Areas
The XCVU190-H1FLGA2577E excels in:
- Data center acceleration
- 5G wireless infrastructure
- High-frequency trading systems
- Video processing and broadcast
- Aerospace and defense applications
- Scientific computing clusters
Environmental & Export Classifications
Environmental Compliance
RoHS Compliance:
- The XCVU190-H1FLGA2577E meets RoHS 2011/65/EU standards
- Lead-free package construction
- Halogen-free materials available upon request
Environmental Ratings:
- Operating Temperature: -40ยฐC to +100ยฐC
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2,000 meters operational
Export Classifications
Export Control Information:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Various (check specific lot)
- Export License: May be required for certain destinations
Compliance Standards:
- FCC Part 15 Class A: Electromagnetic interference
- CE Marking: European conformity
- WEEE Directive: Waste electrical equipment
- REACH Regulation: Chemical substance restrictions
Quality & Reliability
Quality Certifications:
- ISO 9001:2015 certified manufacturing
- Automotive grade options available (XCVU190-H1FLGA2577E-I)
- Extended temperature range variants
- Qualification test reports available
Reliability Data:
- MTBF: >1,000,000 hours at 55ยฐC
- Package reliability: JEDEC standards compliant
- Electrostatic discharge (ESD) protection: Class 1C
- Latch-up immunity: >100mA
The XCVU190-H1FLGA2577E represents the pinnacle of FPGA technology, combining high performance, extensive connectivity, and robust reliability for mission-critical applications. Contact your authorized distributor today to learn more about integrating the XCVU190-H1FLGA2577E into your next-generation designs.
