Product Overview
The XCVU190-H1FLGB2104E is a premium Field Programmable Gate Array (FPGA) from AMD Xilinx’s Virtex UltraScale family, engineered for demanding high-performance computing applications. This advanced FPGA combines exceptional processing power with energy efficiency, making it ideal for data center acceleration, machine learning inference, and complex digital signal processing applications.
1. Product Specifications
Core Architecture
- Product Family: Virtex UltraScale Series
- Part Number: XCVU190-H1FLGB2104E
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Process Technology: 20nm FinFET+ technology
- Architecture: UltraScale FPGA architecture
Logic Resources
- Logic Cells: 2,349,900 cells
- Logic Blocks: 1,074,240 CLBs (Configurable Logic Blocks)
- System Logic Cells: 1,879,920 equivalent
- LUTs (Look-Up Tables): High-density 6-input LUT configuration
- Flip-Flops: Advanced register resources
Memory Specifications
- Block RAM: 132.9 Mb total block RAM
- Total RAM Bits: 136,090 Kbit
- UltraRAM: On-chip memory blocks for reduced BOM cost
- Distributed RAM: Integrated throughout the fabric
Processing Resources
- DSP Slices: High-performance DSP48E2 slices
- DSP Performance: Optimized for signal processing applications
- Multiply-Accumulate Units: Hardware-accelerated MAC operations
I/O and Connectivity
- User I/Os: 702 I/O pins
- Package Type: FCBGA (Flip Chip Ball Grid Array)
- Pin Count: 2104 pins
- I/O Standards: Support for multiple I/O standards including LVDS, SSTL, HSTL
- High-Speed Transceivers: Next-generation transceivers for high-bandwidth applications
Clock Management
- Clock Management: MMCM (Mixed-Mode Clock Manager) and PLL
- Operating Frequency: Up to 725 MHz maximum frequency
- Speed Grade: H1 (High-performance grade)
- Clock Networks: Global and regional clock distribution
Power Specifications
- Core Supply Voltage: 0.95V nominal
- I/O Supply Voltage: 3.3V compatible
- Power Optimization: Advanced power management features
- Thermal Management: Integrated thermal monitoring
Package Details
- Package Style: FCBGA-2104
- Package Size: Optimized for high-density applications
- Ball Pitch: Industry-standard ball grid array
- Thermal Characteristics: Enhanced thermal performance
2. Price Information
Market Pricing
The XCVU190-H1FLGB2104E is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities:
- Estimated Price Range: $20,000 – $45,000+ (varies by distributor and quantity)
- Volume Pricing: Significant discounts available for bulk orders
- Lead Time: Varies by supplier, typically 12-26 weeks for standard orders
- Availability: Available through authorized distributors
Cost Considerations
- Premium pricing reflects advanced 20nm technology and high logic density
- Volume discounts available for quantities of 25+ units
- Engineering samples may be available for qualified customers
- Consider total system cost including development tools and support
Purchasing Options
- Direct from AMD Xilinx authorized distributors
- Available through major electronics distributors
- Custom pricing available for high-volume applications
- Leasing options may be available for development projects
3. Documents & Media
Technical Documentation
- Official Datasheet: Complete electrical and mechanical specifications
- User Guide (UG575): Comprehensive implementation guide
- Package and Pinout Files: Available in TXT and CSV formats
- Application Notes: Design implementation best practices
Design Resources
- Vivado Design Suite: Primary development environment
- IP Catalog: Extensive library of verified IP cores
- Reference Designs: Proven implementation examples
- Development Boards: Compatible evaluation platforms
Software Tools
- Vivado ML: AI/ML-optimized development flow
- Vitis Unified Software Platform: Accelerated application development
- System Generator: MATLAB/Simulink integration
- ChipScope Pro: Advanced debugging capabilities
Support Materials
- Technical Support: Access to Xilinx technical experts
- Community Forums: Peer-to-peer technical discussions
- Training Materials: Online and instructor-led courses
- Webinars: Regular technical presentations
4. Related Resources
Development Ecosystem
- Evaluation Boards: Various development platforms available
- Starter Kits: Entry-level development solutions
- Reference Designs: Proven implementation templates
- IP Portfolio: Extensive intellectual property library
Compatible Products
- XCVU190-H1FLGC2104E: Alternative package option (FCBGA-2104C)
- XCVU190-H1FLGA2577E: Alternative package with 2577 pins
- XCVU160 Series: Lower-capacity alternatives
- XCVU220 Series: Higher-capacity options
Application Areas
- Data Center Acceleration: High-throughput computing applications
- Machine Learning: Inference and training acceleration
- 5G Wireless Infrastructure: Base station and network equipment
- Video Processing: 4K/8K video transcoding and processing
- Automotive: ADAS and autonomous vehicle systems
- Aerospace & Defense: Mission-critical applications
Design Services
- Consulting Services: Expert design assistance
- Training Programs: Comprehensive FPGA education
- Design Reviews: Professional design validation
- Support Contracts: Extended technical support options
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with RoHS directive
- REACH Regulation: Compliant with EU REACH requirements
- Lead-Free: Pb-free package and assembly process
- Green Packaging: Environmentally conscious packaging materials
Operating Conditions
- Operating Temperature: Commercial and extended temperature ranges available
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: Up to 95% non-condensing
- Altitude: Up to 2000m operational
Export Classifications
- ECCN: Export Control Classification Number compliance
- Country of Origin: Manufactured in qualified facilities
- Export Restrictions: Subject to export administration regulations
- Documentation: Proper export documentation provided
Quality Standards
- ISO 9001: Quality management system certified
- JEDEC Standards: Compliant with industry standards
- Automotive Grade: AEC-Q100 qualified versions available
- Military Grade: MIL-STD qualified options for defense applications
Reliability Data
- MTBF: Mean Time Between Failures data available
- Qualification: Extensive qualification testing performed
- Stress Testing: Temperature cycling and thermal shock tested
- Long-term Reliability: Proven track record in field applications
Why Choose XCVU190-H1FLGB2104E?
The XCVU190-H1FLGB2104E represents the pinnacle of FPGA technology, offering unmatched performance for the most demanding applications. With its advanced UltraScale architecture, high logic density, and comprehensive development ecosystem, this FPGA enables engineers to tackle complex design challenges while maintaining optimal power efficiency.
Key Benefits:
- Maximum performance with 20nm technology
- Extensive logic resources for complex designs
- Advanced power management for energy efficiency
- Comprehensive development tool support
- Proven reliability in mission-critical applications
For technical specifications, pricing information, or design support, contact your local AMD Xilinx representative or authorized distributor to discuss your specific application requirements.
