The XC2VP40-6FFG1148I is a powerful Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex-II Pro family, designed for demanding applications requiring high-speed processing and embedded processing capabilities. This advanced FPGA combines programmable logic with integrated PowerPC processors, making it ideal for telecommunications, networking, signal processing, and embedded system applications.
Product Specifications
Core Features
- Device Family: Virtex-II Pro
- Part Number: XC2VP40-6FFG1148I
- Logic Cells: 46,693 logic cells
- System Gates: 4 million system gates
- Package Type: FFG1148 (Fine-Pitch Ball Grid Array)
- Speed Grade: -6 (high performance)
- Total I/O: 804 user I/O pins
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
Memory Resources
- Block RAM: 3,456 Kb total distributed RAM
- Distributed RAM: 587 Kb
- Configuration Memory: SRAM-based configuration
Processing Power
- PowerPC Processors: 2 embedded PowerPC 405 processors
- Processor Speed: Up to 400 MHz
- DSP Slices: 192 XtremeDSP slices for high-performance signal processing
- Clock Management: 8 Digital Clock Managers (DCMs)
Package Details
- Package Size: 35mm x 35mm
- Pin Count: 1148 pins
- Ball Pitch: 1.0mm
- Mounting Type: Surface mount
Price
The XC2VP40-6FFG1148I pricing varies based on quantity, distribution channel, and market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for orders of 100+ units.
Pricing Factors:
- Quantity breaks available
- Lead times may vary (2-16 weeks standard)
- Industrial temperature grade premium
- Package and speed grade specifications
Documents & Media
Technical Documentation
- Datasheet: Virtex-II Pro Family Complete Data Sheet
- User Guide: Virtex-II Pro Platform FPGA User Guide
- Migration Guide: Virtex-II Pro to Virtex-4 Migration Guide
- Application Notes: Signal integrity, power management, and design guidelines
Design Resources
- Development Tools: Xilinx ISE Design Suite compatibility
- Reference Designs: Embedded processor reference designs
- IP Cores: Compatible with Xilinx IP core library
- Evaluation Boards: ML310 and ML300 development platforms
Software Support
- Xilinx ISE: Integrated Software Environment
- EDK: Embedded Development Kit for PowerPC development
- ChipScope Pro: On-chip debugging and verification
- ModelSim: Simulation software compatibility
Related Resources
Compatible Products
- XC2VP30-6FFG896I: Lower-density alternative
- XC2VP50-6FFG1148I: Higher-density option in same package
- XC2VP20-6FFG896C: Commercial temperature grade variant
Development Platforms
- ML310: Complete development platform for XC2VP40
- ML300: Alternative development board option
- Custom Boards: Third-party development solutions available
Design Tools
- Xilinx Platform Studio: Embedded system design
- System Generator: DSP design tool
- PlanAhead: Physical design and analysis tool
Support Resources
- Xilinx Forums: Community support and discussions
- Application Support: Technical support from Xilinx
- Training Materials: Online courses and documentation
- Partner Network: Authorized design service providers
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package construction
- REACH Compliant: EU chemical regulation compliance
- Conflict Minerals: Compliant with conflict minerals regulations
- Green Package: Halogen-free materials available
Operating Conditions
- Temperature Range: -40ยฐC to +100ยฐC junction temperature
- Humidity: 85% relative humidity maximum
- Vibration: MIL-STD-202 compliant
- Shock: MIL-STD-202 compliant
Export Classification
- ECCN: 3A001 (Export Control Classification Number)
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Various (check specific lot)
- Export Licensing: May require export license for certain countries
Quality Standards
- Quality Grade: Industrial standard
- Reliability: MTBF > 1,000,000 hours
- Testing: 100% production tested
- Qualification: Automotive and industrial qualified
Packaging Options
- Tape and Reel: Standard packaging for automated assembly
- Tray: Alternative packaging option
- Moisture Sensitivity: Level 3 (192 hours at 30ยฐC/60% RH)
- Lead Frame: Copper lead frame construction
The XC2VP40-6FFG1148I represents proven FPGA technology for applications requiring embedded processing, high-speed I/O, and substantial logic resources. Its combination of PowerPC processors, DSP capabilities, and extensive I/O makes it suitable for complex system designs in telecommunications, aerospace, defense, and industrial applications.
