Product Overview
The XC2VP4-6FGG256I is a high-density, low-power Field Programmable Gate Array (FPGA) from AMD Xilinx’s acclaimed Virtex-II Pro family. This advanced FPGA delivers exceptional performance for high-speed digital signal processing and data encryption applications, making it an ideal choice for demanding embedded systems and industrial applications.
1. Product Specifications
Technical Specifications
Part Number: XC2VP4-6FGG256I
Manufacturer: AMD Xilinx, Inc.
Product Family: Virtex-II Pro
Package Type: 256-BGA (Ball Grid Array)
Mounting Type: Surface Mount
Performance Characteristics
- Logic Elements: 6,768 logic cells
- I/O Count: 140 I/O pins
- Operating Frequency: Up to 1200MHz
- Technology Node: 0.13ฮผm CMOS technology
- Operating Voltage: 1.425V ~ 1.575V supply voltage
- Operating Temperature: -40ยฐC ~ 100ยฐC (TJ)
Memory and Processing Features
- On-chip RAM: 256 Kbit of embedded memory
- Logic Resources: 267 Kbit of logic resources
- Embedded Processors: 1 PowerPC processor core integrated
- High-Speed I/O: 4 Rocket I/O transceivers
2. Pricing Information
The XC2VP4-6FGG256I is available from multiple authorized distributors worldwide. Current stock levels show over 2,846 pieces available from major suppliers, ensuring reliable supply chain support.
Pricing Details:
- Competitive market pricing available upon request
- Volume discounts available for bulk orders
- Orders over $5,000 may qualify for additional discounts
- Contact authorized distributors for current quotations
Stock Availability:
- Multiple suppliers maintain substantial inventory
- New, original factory-sealed components
- 365-day warranty coverage included
3. Documents & Media
Technical Documentation
Datasheet: Official XC2VP4-6FGG256I datasheet available in PDF format from AMD Xilinx
Application Notes: Comprehensive design guides and implementation examples
Reference Designs: Sample projects and code examples
Development Tools: Compatible with Xilinx Vivado Design Suite and ISE tools
Design Resources
- Pin configuration diagrams
- Package mechanical drawings
- Thermal characteristics data
- Power consumption specifications
- Signal integrity guidelines
4. Related Resources
Development Tools and Software
- Xilinx Vivado Design Suite: Primary development environment
- ISE Design Suite: Legacy tool support
- SDK (Software Development Kit): For PowerPC processor development
- ChipScope Pro: For real-time debugging and analysis
Compatible Products
- Evaluation boards and development kits
- Programming cables and adapters
- Memory interfaces and controllers
- Communication protocol IP cores
Application Areas
The XC2VP4-6FGG256I excels in diverse applications including industrial automation, medical devices, military systems, home automation, robotics, and unmanned aerial vehicles. Its high-performance capabilities make it particularly suitable for:
- Digital signal processing applications
- Real-time data encryption and security
- High-speed communication systems
- Embedded system-on-chip (SoC) designs
- Aerospace and defense applications
5. Environmental & Export Classifications
Environmental Compliance
RoHS Status: RoHS3 Compliant – Meets current environmental regulations for lead-free manufacturing
Material Composition: Lead-free, environmentally friendly materials
Recycling: Supports electronic waste recycling programs
Export and Trade Classifications
Product Status: Obsolete – No longer in active production but available through authorized distributors
Export Control: Subject to standard semiconductor export regulations
Country of Origin: Manufactured under AMD Xilinx quality standards
Certifications: Meets international quality and safety standards
Quality and Reliability
- Quality Grade: Commercial/Industrial grade component
- Reliability Testing: Extensive qualification and reliability testing performed
- Manufacturing Standards: ISO 9001 certified manufacturing processes
- Traceability: Full component traceability and lot tracking available
Packaging and Handling
- ESD Protection: Anti-static packaging for electrostatic discharge protection
- Moisture Sensitivity: Appropriate moisture barrier packaging
- Shipping: Professional packaging to prevent damage during transport
- Storage: Recommended storage conditions for optimal component life
Note: While the XC2VP4-6FGG256I is classified as obsolete by the manufacturer, it remains available through authorized distributors and aftermarket suppliers. For new designs, consider current-generation AMD Xilinx FPGA families that offer enhanced performance and continued support.
