The XC2VP50-6FFG1517C represents a powerful member of Xilinx’s Virtex-II Pro FPGA family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, and high-speed digital signal processing. This advanced field-programmable gate array combines versatility with robust processing capabilities to meet the requirements of complex embedded systems.
Product Specification
The XC2VP50-6FFG1517C features a comprehensive set of specifications that make it suitable for high-performance applications:
Core Architecture:
- Device family: Virtex-II Pro
- Logic cells: 53,136 equivalent gates
- Configurable logic blocks (CLBs): 4,928
- Block RAM: 232 blocks (18Kb each)
- Distributed RAM: 616Kb
- PowerPC 405 processors: 2 embedded cores
I/O Capabilities:
- Total I/O pins: 1,200
- Package type: FFG1517 (Fine-pitch Ball Grid Array)
- Speed grade: -6 (high performance)
- Operating voltage: 1.5V core, 3.3V/2.5V I/O
- Maximum operating frequency: Up to 420MHz
Package Details:
- Package size: 40mm x 40mm
- Pin count: 1,517 pins
- Commercial temperature range: 0ยฐC to +85ยฐC
- Industrial temperature range: -40ยฐC to +100ยฐC
The XC2VP50-6FFG1517C integrates advanced features including dedicated multipliers, phase-locked loops (PLLs), and high-speed serial transceivers, making it ideal for applications requiring intensive parallel processing and real-time performance.
Price
Pricing for the XC2VP50-6FFG1517C varies based on quantity, supplier, and market conditions. The device is positioned as a premium FPGA solution, reflecting its advanced capabilities and high-performance specifications. For current pricing information, customers should contact authorized Xilinx distributors or electronic component suppliers. Volume discounts are typically available for production quantities, and pricing may vary for different temperature grades and packaging options.
Documents & Media
Comprehensive documentation supports the XC2VP50-6FFG1517C implementation:
Technical Documentation:
- Product datasheet with complete electrical and timing specifications
- User guide detailing architecture and design considerations
- Package and pinout information
- Application notes for specific use cases
- Design constraint files and timing models
Development Resources:
- Reference designs and example projects
- Board layout guidelines and thermal considerations
- Power consumption analysis and estimation tools
- Migration guides from previous FPGA families
- Simulation models and verification IP
Software Support:
- Xilinx ISE Design Suite compatibility
- ChipScope Pro debugging tools
- EDK (Embedded Development Kit) support
- Third-party tool integration guides
These resources ensure designers can effectively implement the XC2VP50-6FFG1517C in their applications while optimizing performance and reducing development time.
Related Resources
The XC2VP50-6FFG1517C ecosystem includes various supporting components and tools:
Development Boards:
- Xilinx ML403 evaluation platform
- Custom development boards from third-party vendors
- Prototyping solutions and carrier cards
Companion Devices:
- Configuration memory devices (Platform Flash)
- Power management solutions
- Clock generation and distribution circuits
- High-speed connectors and interface components
Design Tools:
- Xilinx Platform Studio for embedded processor design
- System Generator for DSP applications
- Timing analysis and constraint tools
- Intellectual Property (IP) cores library
Training and Support:
- Technical training courses and workshops
- Application engineering support
- Online forums and community resources
- Design service partnerships
These resources provide comprehensive support for implementing the XC2VP50-6FFG1517C in various applications, from initial concept through production deployment.
Environmental & Export Classifications
The XC2VP50-6FFG1517C meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliant
- Pb-free (lead-free) manufacturing process
- Halogen-free packaging options available
- ISO 14001 environmental management system certified
Quality Standards:
- Automotive AEC-Q100 qualification available
- Military temperature range versions (-55ยฐC to +125ยฐC)
- Radiation-tolerant variants for space applications
- Extended reliability testing and qualification
Export Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- Subject to US Export Administration Regulations (EAR)
- Dual-use technology classification
- License requirements for certain destinations
Regulatory Certifications:
- CE marking for European markets
- FCC compliance for US applications
- IC certification for Canadian markets
- Various international telecommunications approvals
The XC2VP50-6FFG1517C incorporates environmental considerations throughout its lifecycle, from manufacturing through end-of-life disposal, ensuring compliance with global environmental regulations and supporting sustainable design practices.
This advanced FPGA solution provides designers with the performance, flexibility, and reliability needed for next-generation embedded systems while maintaining compliance with environmental and export requirements worldwide.
