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XC2VP70-5FF1517I – High-Performance Virtex-II Pro FPGA

Original price was: $20.00.Current price is: $19.00.

The XC2VP70-5FF1517I is a premium field-programmable gate array (FPGA) from Xilinx’s renowned Virtex-II Pro family, designed for demanding applications requiring high-performance programmable logic solutions. This advanced FPGA delivers exceptional processing capabilities with integrated multi-gigabit transceivers and PowerPC processor blocks, making it an ideal choice for telecommunications, wireless, networking, video processing, and digital signal processing applications.

1. Product Specifications

Core Architecture

  • Family: Virtex-II Pro FPGA
  • Logic Cells: 74,448 cells
  • Technology Node: 0.13ยตm CMOS nine-layer copper process
  • Operating Frequency: 1050MHz maximum
  • Supply Voltage: 1.5V

Package & I/O

  • Package Type: 1517-Pin FCBGA (Flip Chip Ball Grid Array)
  • I/O Count: 964 user I/O pins
  • Speed Grade: -5 (commercial grade)
  • Temperature Range: Commercial (0ยฐC to +85ยฐC)

Key Features

  • RocketIO Transceivers: Up to 20 embedded Multi-Gigabit Transceivers (MGTs)
  • PowerPC Blocks: Integrated hard PowerPC 405 processor cores
  • Block RAM: Distributed throughout the device for high-performance memory applications
  • DSP Capabilities: Dedicated multipliers and DSP blocks for signal processing
  • Configuration: Multiple configuration modes including JTAG, SelectMAP, and serial modes

Performance Characteristics

  • High-Speed Serial I/O: Multi-gigabit capability for advanced communication protocols
  • Low Power Consumption: Optimized power management features
  • High Logic Density: Maximum utilization of silicon area for complex designs
  • Flexible Clocking: Advanced clock management with DCMs and PLLs

2. Price

The XC2VP70-5FF1517I pricing varies based on quantity and supplier:

  • Small Quantities (1-99 pieces): Contact distributors for current market pricing
  • Volume Pricing (100+ pieces): Significant discounts available for bulk orders
  • Price Range: Market prices fluctuate based on availability and demand

For the most current pricing, we recommend requesting quotes from authorized distributors such as:

  • Electronic component distributors with real-time market intelligence
  • Authorized Xilinx/AMD distributors
  • Specialty FPGA suppliers

Note: This device may have limited availability as it belongs to a mature product family. Contact suppliers for current stock status.

3. Documents & Media

Official Documentation

  • Datasheet: Virtex-II Pro and Virtex-II Pro X Platform FPGAs Complete Data Sheet
  • User Guide: Virtex-II Pro and Virtex-II Pro X FPGA User Guide
  • Package Information: FF1517 package specifications and pinout diagrams
  • Configuration Guide: Configuration and readback procedures

Development Resources

  • Design Tools: Xilinx Vivado Design Suite (recommended) or legacy ISE Design Suite
  • IP Cores: Compatible with Xilinx IP core library
  • Reference Designs: Available through Xilinx support channels
  • Application Notes: Specific to Virtex-II Pro architecture and RocketIO implementation

Technical Support Materials

  • Pinout Information: Complete pin assignment and electrical specifications
  • Programming Files: Bitstream generation and configuration guidelines
  • Errata: Known issues and workarounds for silicon revisions

4. Related Resources

Development Platforms

  • Evaluation Boards: Third-party development boards featuring XC2VP70
  • Reference Designs: Telecommunications and networking reference implementations
  • Starter Kits: FPGA development platforms for prototyping

Software Tools

  • Vivado Design Suite: Modern design environment for synthesis, implementation, and debugging
  • Legacy ISE: Classical design flow support (discontinued but still functional)
  • ChipScope Pro: On-chip debugging and analysis tool
  • FPGA Editor: Low-level design editing and optimization

Compatible Components

  • Memory Interfaces: DDR, SRAM, and other high-speed memory controllers
  • Communication Protocols: PCIe, Ethernet, SONET/SDH, and custom serial protocols
  • Processing Elements: MicroBlaze soft processors and third-party IP cores

Application Areas

  • Telecommunications: Base station controllers, optical networking equipment
  • Wireless Infrastructure: Signal processing, protocol implementation
  • Industrial Automation: Real-time control systems, motor drives
  • Medical Devices: High-performance imaging and diagnostic equipment
  • Aerospace & Defense: Radar processing, communication systems

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliant: Meets European Union Restriction of Hazardous Substances directive
  • Lead-Free: Compatible with lead-free soldering processes
  • REACH Compliance: Complies with European chemical regulation requirements
  • Conflict Minerals: Sourced in compliance with conflict minerals regulations

Operating Conditions

  • Commercial Temperature Range: 0ยฐC to +85ยฐC junction temperature
  • Storage Temperature: -65ยฐC to +150ยฐC
  • Humidity: 85% relative humidity (non-condensing)
  • Thermal Considerations: Requires adequate heat dissipation in high-performance applications

Export Classifications

  • ECCN (Export Control Classification Number): Subject to U.S. export regulations
  • Country of Origin: Manufactured in authorized facilities
  • Export Restrictions: May require export licenses for certain destinations
  • Dual-Use Technology: Subject to technology transfer restrictions

Quality & Reliability

  • Automotive Grade: Not qualified for automotive applications (contact manufacturer for automotive variants)
  • Industrial Grade: Suitable for industrial temperature ranges
  • Quality Standards: Manufactured under ISO quality management systems
  • Reliability Testing: Extensive qualification testing including HTOL, thermal cycling, and HAST

Handling Precautions

  • ESD Sensitive: Requires electrostatic discharge protection during handling
  • Moisture Sensitive: MSL (Moisture Sensitivity Level) classification applies
  • Thermal Management: Proper heat sink design required for high-performance applications
  • Package Integrity: Handle with care to prevent BGA ball damage

The XC2VP70-5FF1517I represents mature FPGA technology with proven reliability for established designs. For new designs, consider current-generation Xilinx/AMD FPGA families for the latest features and long-term support.