The XC2VP70-5FFG1517C is a powerful platform FPGA from Xilinx’s Virtex-II Pro family, designed to deliver exceptional performance for complex digital systems and embedded applications. This field-programmable gate array combines advanced processing capabilities with multi-gigabit transceivers, making it ideal for telecommunication, wireless, networking, video, and DSP applications.
Product Specifications
Core Architecture
- Logic Cells: 74,448 logic cells for complex digital designs
- Process Technology: Leading-edge 0.13 ยตm CMOS nine-layer copper process
- Operating Voltage: 1.5V core voltage for efficient power consumption
- System Gates: Multi-million gate capacity for platform-scale designs
Package Details
- Package Type: 1517-pin Fine-pitch Ceramic Ball Grid Array (FCBGA)
- Part Number: XC2VP70-5FFG1517C
- Speed Grade: -5 (standard performance grade)
- I/O Count: 964 user I/O pins for extensive connectivity
Advanced Features
- Embedded Transceivers: Up to 20 RocketIO Multi-Gigabit Transceivers (MGTs)
- Embedded Processors: Supports PowerPC CPU blocks for system-on-chip designs
- Memory Interface: High-speed memory interfacing capabilities
- Operating Frequency: Up to 1050MHz system performance
- IP Core Support: Compatible with extensive Xilinx IP core library
Technical Capabilities
- Configurable Logic Blocks (CLBs): Multiple CLBs equivalent to thousands of ASIC gates
- DSP Applications: Optimized for digital signal processing workloads
- System Integration: Enhanced programmable logic design capabilities
- Flexible Architecture: Wide variety of configurable features for custom designs
Price Information
The XC2VP70-5FFG1517C pricing varies by distributor and quantity. Based on current market availability, the component is listed as “New original, 2000 pcs Stock Available” at major distributors. For current pricing:
- Pricing Model: Quote-based (RFQ – Request for Quote)
- Availability: In stock at multiple authorized distributors
- Quantity Discounts: Available for bulk orders
- Lead Time: Typically ships from stock for standard quantities
Contact authorized distributors for current pricing and volume discounts. Prices may vary based on market conditions, order quantity, and specific customer requirements.
Documents & Media
Technical Documentation
- Primary Datasheet: XC2VP7-6FFG896C.pdf (related family datasheet)
- User Guide: Virtex-II Pro and Virtex-II Pro X FPGA User Guide
- Selection Guide: Virtex-II Series FPGAs Product Selection Guide
- Application Notes: Available through Xilinx/AMD documentation portal
Design Resources
- Development Tools: Compatible with Xilinx ISE and Vivado Design Suite
- Programming Languages: Supports VHDL and Verilog hardware description languages
- Reference Designs: Available IP cores and design examples
- Simulation Models: Behavioral and timing simulation models
Support Materials
- Pin-out Information: Detailed I/O pin assignments and ball map
- Timing Specifications: Setup, hold, and propagation delay characteristics
- Power Consumption: Dynamic and static power analysis data
- Thermal Guidelines: Package thermal resistance and cooling requirements
Related Resources
Compatible Development Boards
- Virtex-II Pro Development System: Educational and prototyping platform
- Custom Evaluation Boards: Third-party development solutions
- Reference Designs: Demonstration projects and starter templates
Software Tools
- Xilinx ISE: Legacy development environment (recommended for Virtex-II Pro)
- EDK (Embedded Development Kit): For embedded processor development
- ChipScope Pro: Hardware debugging and analysis tool
- ModelSim: Third-party simulation environment
Alternative Products
- XC2VP70-7FFG1517C: Higher speed grade variant (-7 vs -5)
- XC2VP50-5FFG1517C: Lower logic cell count option (52,000 cells)
- XC2VP100-5FFG1517C: Higher logic cell count option (100,000+ cells)
Application Areas
- Telecommunications: Base station processing and protocol handling
- Wireless Infrastructure: SDR (Software Defined Radio) implementations
- Video Processing: Real-time video encoding/decoding systems
- Network Equipment: High-speed packet processing and routing
- DSP Applications: Signal processing and filtering algorithms
Environmental & Export Classifications
Operating Conditions
- Commercial Temperature Range: 0ยฐC to +85ยฐC ambient temperature
- Storage Temperature: -65ยฐC to +150ยฐC for long-term storage
- Humidity: 5% to 95% relative humidity (non-condensing)
- Voltage Tolerance: ยฑ5% supply voltage variation
Environmental Compliance
- RoHS Compliant: Lead-free package construction
- REACH Compliance: Meets European chemical safety regulations
- Conflict Minerals: Compliant with conflict minerals reporting
- Green Package: Environmentally friendly materials and processes
Export Classifications
- ECCN: Export Control Classification Number as per US Commerce regulations
- HTS Code: Harmonized Tariff Schedule classification for customs
- Country of Origin: Manufacturing location for trade documentation
- Export Restrictions: May require export licenses for certain destinations
Quality Standards
- Automotive Grade: Available in automotive-qualified versions
- Industrial Temperature: Extended temperature range options available
- Quality Certification: ISO 9001 manufacturing standards
- Reliability Testing: JEDEC standard qualification testing
Package Information
- Moisture Sensitivity: Level 3 (MSL-3) for handling and storage
- ESD Protection: Electrostatic discharge sensitive device precautions
- Lead Finish: Lead-free solder ball attachment
- Package Marking: Laser-etched part identification and traceability codes
Note: The XC2VP70-5FFG1517C is a mature product from Xilinx’s legacy Virtex-II Pro family. While still manufactured and supported, newer FPGA families offer enhanced performance and features for new designs. Consult with Xilinx/AMD for current product recommendations and migration paths.
