The XC2VP70-6FF1517I is a powerful Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex-II Pro series, designed to deliver exceptional performance for demanding digital signal processing, networking, and embedded system applications. This industrial-grade FPGA combines advanced programmable logic with integrated PowerPC processors to provide a comprehensive solution for complex design requirements.
Product Specification
The XC2VP70-6FF1517I features robust specifications that make it ideal for high-performance applications:
Core Architecture:
- Logic cells: 74,448 system gates
- CLB array: 88 x 120 configurable logic blocks
- Block RAM: 328 blocks (18 Kb each)
- Distributed RAM: 1,207 Kb total capacity
- PowerPC 405 processors: 2 embedded 32-bit RISC cores
- Digital Clock Manager (DCM): 12 units for advanced clock management
I/O Capabilities:
- Maximum user I/O pins: 1,200
- Package: FF1517 (Fine-pitch Ball Grid Array)
- Speed grade: -6 (high performance)
- Temperature range: Industrial (-40ยฐC to +85ยฐC)
- Voltage: 1.5V core, 3.3V I/O
Performance Features:
- System clock frequency: Up to 420 MHz
- Dedicated multipliers: 328 x 18-bit multipliers
- SelectIO technology for flexible I/O standards
- On-chip debugging capabilities
Price
The XC2VP70-6FF1517I pricing varies based on quantity and supplier. For current pricing information and volume discounts, please contact authorized Xilinx distributors or electronic component suppliers. Factors affecting price include:
- Order quantity (unit vs. bulk pricing)
- Lead time requirements
- Regional availability
- Market conditions
Contact your preferred electronics distributor for real-time XC2VP70-6FF1517I pricing and availability status.
Documents & Media
Essential documentation and resources for the XC2VP70-6FF1517I include:
Technical Documentation:
- Virtex-II Pro FPGA Data Sheet
- XC2VP70-6FF1517I Device Specifications
- Package and Pinout Information
- Power and Thermal Guidelines
- Migration and Compatibility Guide
Design Resources:
- Xilinx ISE Design Suite compatibility information
- Reference designs and application notes
- PCB layout guidelines for FF1517 package
- Signal integrity considerations
- Power supply design recommendations
Software Support:
- Xilinx Vivado Design Suite (legacy support)
- IP core libraries and reference designs
- Debugging and verification tools
- Programming and configuration utilities
Related Resources
Complementary products and resources that work with the XC2VP70-6FF1517I:
Development Tools:
- Xilinx development boards featuring Virtex-II Pro FPGAs
- Programming cables and configuration devices
- Evaluation kits and starter packages
- Third-party development platforms
Compatible Components:
- Memory interfaces (DDR, QDR, SRAM)
- High-speed transceivers and interfaces
- Power management solutions
- Cooling and thermal management systems
Technical Support:
- Xilinx technical documentation library
- Community forums and user groups
- Application engineering support
- Training and certification programs
Environmental & Export Classifications
The XC2VP70-6FF1517I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Industrial temperature range operation
- Moisture sensitivity level (MSL) rating
- Halogen-free package options available
Export Classifications:
- Export Control Classification Number (ECCN) as applicable
- International trade compliance
- Country-specific import/export restrictions
- Dual-use technology considerations
Quality Standards:
- ISO 9001 manufacturing quality systems
- Military and aerospace grade options
- Reliability testing and qualification
- Long-term availability programs
Safety Certifications:
- UL recognition where applicable
- FCC compliance for electromagnetic emissions
- CE marking for European markets
- Regional safety and regulatory approvals
The XC2VP70-6FF1517I represents a proven solution for applications requiring high-performance programmable logic with integrated processing capabilities. Its combination of advanced features, industrial-grade reliability, and comprehensive development ecosystem makes it an excellent choice for demanding applications in telecommunications, defense, industrial automation, and high-performance computing markets.
