1. Product Specifications
Core Specifications
- Part Number: XQVR300-3CB228I
- Manufacturer: Xilinx (now AMD)
- Family: QPro Virtex 2.5V Radiation-Hardened FPGAs
- Process Technology: 0.22 µm 5-layer epitaxial process
- System Gates: 322.97K Gates
- Logic Cells: 6912 Cells
- Operating Voltage: 2.5V
- Package Type: 228-Pin CQFP (Ceramic Quad Flat Package)
- Package Code: CB228I
Performance Characteristics
- Maximum Frequency: Up to 200 MHz system performance
- Temperature Range: -55°C to +125°C (Military Grade)
- Radiation Tolerance: 100K Rad(si) Total Ionizing Dose
- Latch-up Immunity: LET = 125 MeV cm²/mg
Architecture Features
- Clock Management: Four dedicated delay-locked loops (DLLs) for advanced clock control
- Global Clock Networks: Four primary low-skew global clock distribution nets, plus 24 secondary global nets
- Memory System: Hierarchical memory system with configurable LUTs and dual-ported RAMs
- I/O Standards: Multi-standard SelectIO™ interfaces supporting 16 high-performance interface standards
- Arithmetic Support: Dedicated carry logic for high-speed arithmetic and dedicated multiplier support
Quality & Compliance
- Certification: QML (Qualified Manufacturers List) certified
- Boundary Scan: IEEE 1149.1 boundary-scan logic
- Temperature Sensing: Die-temperature sensing device
2. Price
Pricing Information:
- Contact authorized distributors for current pricing
- Price monitoring available through global electronic component suppliers
- Request quote (RFQ) available through major electronics distributors
- Pricing varies based on quantity, lead time, and market conditions
Note: Due to the specialized nature and radiation-hardened features of the XQVR300-3CB228I, pricing is typically provided upon request and may vary significantly based on application requirements and order volume.
3. Documents & Media
Technical Documentation
- Datasheet: Official Xilinx XQVR300 series datasheet (PDF format)
- User Guide: QPro Virtex 2.5V Radiation-Hardened FPGAs User Guide
- Application Notes: Radiation-hardened design implementation guidelines
- Package Specifications: CB228I package mechanical drawings and specifications
- Pin Configuration: Detailed pinout diagrams and signal descriptions
Design Resources
- Development Tools: Supported by FPGA Foundation and Alliance Development Systems
- Software Support: Complete support for Unified Libraries, Relationally Placed Macros, and Design Manager
- Design Examples: Reference designs for space and satellite applications
- Simulation Models: SPICE and behavioral models for design verification
Media Resources
- Product images and package photos
- Application block diagrams
- Performance benchmarks and test results
- Case studies from space and defense applications
4. Related Resources
Development Tools
- Xilinx Vivado Design Suite: User-friendly synthesis and implementation tools
- ISE Design Tools: Legacy support for QPro Virtex family
- Programming Hardware: Compatible JTAG programmers and cables
- Evaluation Boards: Development boards for QPro Virtex 2.5V Radiation-Hardened FPGAs
Compatible Products
- XQV300 Series: Related variants in the QPro Virtex 300 family
- XQVR300-1CB228I: Speed grade -1 variant
- XQVR300-4CB228I: Speed grade -4 variant
- Alternative Packages: BGA and other package options
Technical Support
- Application Engineering: Specialized support for radiation-hardened designs
- Training Resources: Courses on radiation-hardened FPGA design
- Design Services: Professional services for mission-critical applications
- Community Forums: FPGA Forum and technical discussions
Industry Applications
- Space Systems: Satellite payload processing and control systems
- Defense Electronics: Military radar and communication systems
- Nuclear Instrumentation: Radiation monitoring and control systems
- Medical Devices: Radiation therapy equipment control systems
5. Environmental & Export Classifications
Environmental Specifications
- Operating Temperature: -55°C to +125°C (Military Grade)
- Storage Temperature: -65°C to +150°C
- Humidity: 10% to 95% non-condensing
- Altitude: Sea level to 70,000 feet
- Vibration: Per MIL-STD-883 requirements
- Shock: Per MIL-STD-883 requirements
Radiation Hardness
- Total Ionizing Dose (TID): Guaranteed to 100K Rad(si)
- Single Event Upset (SEU): Immunity achievable with recommended redundancy
- Latch-up: Immune to LET = 125 MeV cm²/mg
- Neutron Fluence: Per QPro Virtex family specifications
Export Control Classifications
- ECCN (Export Control Classification Number): Contact manufacturer for current classification
- ITAR Status: Subject to U.S. export regulations
- Country Restrictions: May require export licenses for certain destinations
- End-Use Restrictions: Military and space applications may have additional requirements
Compliance Standards
- MIL-STD-883: Military standard for semiconductor device testing
- MIL-PRF-38535: Military specification for microcircuits
- QML-Q: Qualified Manufacturers List Class Q
- RoHS: Compliant with Restriction of Hazardous Substances directive
- REACH: Compliant with EU chemical regulations
Packaging & Handling
- ESD Sensitivity: Class 1 (≥2000V Human Body Model)
- Moisture Sensitivity: Level 3 per JEDEC J-STD-020
- Lead-Free: Available in lead-free package options
- Traceability: Full lot traceability per military requirements
Manufacturer: AMD Xilinx, Inc.
Product Family: QPro Virtex 2.5V Radiation-Hardened FPGAs
Availability: Contact authorized distributors for current stock and lead times
Technical Support: Available through AMD Xilinx support channels and authorized distributors
Note: Specifications subject to change without notice. Please refer to the latest datasheet for the most current information.
