The XC2VP70-6FFG1704C represents a pinnacle of field-programmable gate array (FPGA) technology, delivering exceptional performance for demanding digital signal processing, telecommunications, and embedded processing applications. This Xilinx Virtex-II Pro device combines high-density programmable logic with integrated PowerPC processors, making it an ideal solution for complex system-on-chip designs.
Product Specifications
The XC2VP70-6FFG1704C features robust specifications designed for high-performance applications:
Core Architecture:
- Logic Cells: 74,448 system gates
- Configurable Logic Blocks (CLBs): 8,816
- Block RAM: 328 blocks (18Kb each)
- Total Block RAM: 5,904 Kb
- Embedded PowerPC 405 processors: 2 cores
- Digital Clock Manager (DCM): 12 units
I/O and Connectivity:
- Package: FFG1704 (Fine-Pitch Ball Grid Array)
- Total I/O pins: 1,200
- User I/O: 996
- Differential I/O pairs: 396
- Speed grade: -6 (high performance)
Performance Characteristics:
- Maximum operating frequency: Up to 420 MHz
- Power consumption: Optimized for balance between performance and efficiency
- Operating temperature range: Commercial grade (0ยฐC to +85ยฐC)
- Supply voltage: 1.5V core, 3.3V I/O
The XC2VP70-6FFG1704C supports multiple I/O standards including LVDS, LVPECL, and GTL+, ensuring compatibility with various system interfaces and protocols.
Price
Pricing for the XC2VP70-6FFG1704C varies based on quantity, supplier, and market conditions. As a high-end FPGA from Xilinx’s Virtex-II Pro series, this device typically commands premium pricing reflecting its advanced capabilities and integrated processor cores.
For current pricing information on the XC2VP70-6FFG1704C, contact authorized Xilinx distributors or semiconductor suppliers. Volume discounts and long-term supply agreements may be available for production quantities.
Documents & Media
Essential documentation for the XC2VP70-6FFG1704C includes:
Technical Documentation:
- Virtex-II Pro FPGA User Guide
- XC2VP70-6FFG1704C datasheet with electrical specifications
- Package information and pinout diagrams
- DC and switching characteristics
- Power consumption analysis
Design Resources:
- Xilinx ISE Design Suite compatibility guides
- Reference designs and application notes
- PowerPC processor documentation
- Clock management and timing analysis guides
Development Tools:
- Xilinx Platform Studio (XPS) for embedded processor design
- ChipScope Pro for on-chip debugging
- Timing analysis tools and constraints guides
All documentation for the XC2VP70-6FFG1704C is available through Xilinx’s official documentation portal and authorized distribution partners.
Related Resources
The XC2VP70-6FFG1704C ecosystem includes comprehensive development resources:
Development Boards:
- Xilinx ML310 development platform
- Third-party evaluation boards supporting FFG1704 package
- Custom carrier boards for specific applications
Software Tools:
- Xilinx ISE Design Suite for FPGA development
- Embedded Development Kit (EDK) for processor-based designs
- ModelSim simulation software compatibility
Application Areas:
- High-speed digital signal processing
- Telecommunications infrastructure
- Medical imaging systems
- Aerospace and defense applications
- Industrial automation and control
Training and Support:
- Xilinx University Program resources
- Technical support through authorized channels
- Community forums and design examples
The XC2VP70-6FFG1704C benefits from Xilinx’s extensive partner ecosystem, providing additional IP cores, development tools, and consulting services.
Environmental & Export Classifications
The XC2VP70-6FFG1704C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free)
- REACH regulation compliance
- Conflict minerals reporting
- Environmental management system certifications
Export Control Classifications:
- ECCN (Export Control Classification Number): Specific classification varies by application
- Country of origin: Manufactured in Xilinx-approved facilities
- Export licensing requirements may apply for certain destinations
Quality Standards:
- ISO 9001 certified manufacturing
- Automotive-grade options available (contact manufacturer)
- Military and aerospace screening available
- Extended temperature range variants
Reliability Testing:
- JEDEC standard compliance
- Accelerated life testing
- Environmental stress screening
- Qualification data available upon request
The XC2VP70-6FFG1704C undergoes comprehensive testing to ensure reliable operation across specified environmental conditions and maintains compliance with international trade regulations.
The XC2VP70-6FFG1704C represents Xilinx’s commitment to delivering high-performance FPGA solutions with integrated processing capabilities, making it an excellent choice for advanced digital systems requiring both programmable logic and embedded processing power.
