The XC2VP7-6FFG896I is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-II Pro series, designed to deliver exceptional performance for demanding digital signal processing, telecommunications, and embedded processing applications. This industrial-grade FPGA combines reconfigurable logic with embedded PowerPC processors, making it an ideal solution for complex system designs requiring both flexibility and processing power.
Product Specifications
The XC2VP7-6FFG896I features robust specifications that set it apart in the FPGA market. This device incorporates 4,928 logic cells and 88 dedicated 18×18 multipliers, providing substantial computational resources for mathematical operations and digital signal processing tasks. The FPGA includes 792 Kb of block RAM, offering ample on-chip memory for data buffering and storage applications.
Built on advanced 90nm process technology, the XC2VP7-6FFG896I operates at a maximum frequency of 420 MHz, ensuring high-speed performance for time-critical applications. The device supports 3.3V, 2.5V, 1.8V, and 1.5V I/O standards, providing excellent compatibility with various system interfaces. With 396 user I/O pins available in the FFG896 package, designers have extensive connectivity options for interfacing with external components.
The XC2VP7-6FFG896I features two embedded PowerPC 405 processors running at up to 300 MHz, enabling sophisticated embedded processing capabilities within the FPGA fabric. These hard-core processors can execute complex algorithms while the reconfigurable logic handles parallel processing tasks, creating a powerful heterogeneous computing platform.
Price Information
Pricing for the XC2VP7-6FFG896I varies based on order quantities, distribution channels, and market conditions. Industrial customers typically purchase this FPGA through authorized distributors or directly from Xilinx partners. Volume pricing discounts are available for large-scale production requirements. Contact authorized distributors for current pricing and availability, as costs may fluctuate due to market demand and supply chain factors.
The XC2VP7-6FFG896I represents excellent value for applications requiring both reconfigurable logic and embedded processing capabilities, offering a cost-effective alternative to separate FPGA and microprocessor solutions.
Documents & Media
Comprehensive documentation supports the XC2VP7-6FFG896I throughout the design cycle. The official datasheet provides detailed electrical specifications, timing parameters, and package information essential for proper implementation. Application notes demonstrate best practices for utilizing the embedded PowerPC processors and optimizing system performance.
The Virtex-II Pro User Guide offers extensive information about the FPGA architecture, configuration options, and design methodologies. Power estimation tools and thermal analysis guides help engineers ensure reliable operation in various environmental conditions. Pin-out diagrams and package drawings facilitate PCB layout and mechanical design considerations.
Development tools including Xilinx ISE Design Suite support the XC2VP7-6FFG896I with synthesis, place-and-route, and debugging capabilities. Reference designs and example projects accelerate development timelines and demonstrate implementation techniques for common applications.
Related Resources
The XC2VP7-6FFG896I integrates seamlessly with Xilinx’s comprehensive ecosystem of development tools, IP cores, and reference designs. ChipScope Pro analyzer enables real-time debugging and signal analysis within the FPGA fabric. MicroBlaze soft processor cores provide additional processing options for applications requiring multiple embedded processors.
Compatible IP cores include high-speed communication interfaces, DSP functions, and memory controllers optimized for the Virtex-II Pro architecture. Third-party development boards and evaluation kits facilitate rapid prototyping and proof-of-concept development using the XC2VP7-6FFG896I.
The device pairs effectively with companion chips including configuration memories, power management ICs, and high-speed transceivers for complete system implementations. Technical support resources include online forums, application engineering assistance, and training materials for maximizing the XC2VP7-6FFG896I’s capabilities.
Environmental & Export Classifications
The XC2VP7-6FFG896I meets stringent environmental and quality standards for industrial applications. The device operates reliably across the industrial temperature range of -40ยฐC to +85ยฐC, ensuring consistent performance in challenging environmental conditions. The FPGA complies with RoHS directives, supporting environmentally conscious design practices.
Export classification information indicates the XC2VP7-6FFG896I falls under specific export control regulations that may require licenses for certain international shipments. Designers should consult current export regulations and work with authorized distributors to ensure compliance with applicable trade restrictions.
The device meets automotive and aerospace quality standards when specified, making it suitable for mission-critical applications requiring high reliability. ESD protection and latch-up immunity specifications ensure robust operation in electromagnetically challenging environments.
Quality certifications include ISO 9001 manufacturing standards, providing assurance of consistent production quality. The XC2VP7-6FFG896I undergoes extensive testing and qualification procedures to guarantee performance across the specified operating conditions and lifetime requirements.
