The XC2VP7-6FGG456I is a high-performance field-programmable gate array (FPGA) from Xilinx’s renowned Virtex-II Pro series. This advanced programmable logic device combines flexible digital signal processing capabilities with embedded PowerPC processors, making it ideal for demanding applications in telecommunications, aerospace, defense, and industrial automation.
Product Specifications
Core Architecture
- Device Family: Virtex-II Pro
- Part Number: XC2VP7-6FGG456I
- Logic Cells: 7,168 equivalent logic cells
- Configurable Logic Blocks (CLBs): 1,232 CLBs
- Slices: 2,464 slices (4 LUTs per slice)
- Embedded Processors: 1 PowerPC 405 processor core
Memory Resources
- Block RAM: 396 Kb total block SelectRAM
- Distributed RAM: 30 Kb distributed SelectRAM
- Block RAM Blocks: 22 blocks of 18 Kb each
I/O and Connectivity
- Package Type: FGG456 (Fine-pitch Ball Grid Array)
- Total I/O Pins: 348 user I/O pins
- Speed Grade: -6 (high performance)
- Voltage: 1.5V core voltage, 3.3V I/O
- Temperature Range: Industrial (-40ยฐC to +85ยฐC)
Advanced Features
- Digital Signal Processing: 28 dedicated 18×18 multipliers
- Clock Management: 8 Digital Clock Manager (DCM) units
- High-Speed Transceivers: Multi-gigabit transceivers available
- Configuration: Multiple configuration modes supported
Pricing Information
The XC2VP7-6FGG456I pricing varies based on quantity and distributor. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for orders of 100+ units. Lead times may vary depending on current market conditions and inventory levels.
Note: Prices are subject to change without notice. Please verify current pricing with authorized distributors.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical and timing specifications
- User Guide: Virtex-II Pro Platform FPGA User Guide
- Application Notes: Design implementation guidelines
- Errata: Known issues and workarounds
- Package Information: Mechanical drawings and pinout diagrams
Design Resources
- Reference Designs: Sample implementations and code examples
- IP Cores: Compatible intellectual property cores
- Development Tools: ISE Design Suite compatibility information
- Simulation Models: VHDL and Verilog simulation libraries
Media Files
- Product Images: High-resolution package photographs
- Block Diagrams: Architecture and functional diagrams
- Video Tutorials: Getting started guides and design walkthroughs
Related Resources
Compatible Development Boards
- ML310 Development Platform: Complete development environment
- ML300 Series Boards: Evaluation and prototyping platforms
- Custom Carrier Boards: Third-party development solutions
Software Tools
- Xilinx ISE Design Suite: Complete design environment
- ChipScope Pro: Real-time debugging and analysis
- System Generator: MATLAB/Simulink integration
- EDK (Embedded Development Kit): PowerPC processor development
Support Resources
- Xilinx Support Center: Technical support and documentation
- Community Forums: User community and knowledge sharing
- Training Courses: Design methodology and best practices
- Application Engineering: Design consultation services
Related Products
- XC2VP4-6FGG456I: Lower-capacity alternative
- XC2VP20-6FGG456I: Higher-capacity option
- XC2VP7-5FGG456I: Speed grade alternative
- XC2VP7-6FGG456C: Commercial temperature range version
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly
- REACH Compliant: European chemical safety regulation
- Conflict Minerals: Compliant with conflict minerals reporting
- Green Product: Xilinx environmental sustainability program
Operating Conditions
- Operating Temperature: -40ยฐC to +85ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 3,000 meters operational
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- Country of Origin: Various (check specific lot markings)
- Export Restrictions: Subject to U.S. export administration regulations
Quality and Reliability
- Quality Standard: ISO 9001:2015 certified manufacturing
- Reliability: Automotive-grade quality where applicable
- Qualification: Full military and commercial temperature testing
- Warranty: Standard manufacturer warranty terms apply
Packaging and Shipping
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level)
- Packaging: Anti-static tray packaging
- Shipping: Dry pack shipping with moisture indicator cards
- Handling: ESD precautions required during installation
The XC2VP7-6FGG456I represents proven FPGA technology with robust performance characteristics suitable for mission-critical applications. This Virtex-II Pro device delivers the flexibility and processing power needed for complex digital signal processing and embedded system designs.
