The XC2VP7-7FGG456C is a powerful field-programmable gate array (FPGA) from Xilinx’s Virtex-II Pro series, designed to deliver exceptional performance for demanding digital signal processing and embedded system applications. This advanced programmable logic device combines high-speed processing capabilities with flexible configuration options, making it an ideal choice for telecommunications, aerospace, and industrial control systems.
Product Specification
The XC2VP7-7FGG456C features a robust architecture built on 90nm process technology, offering superior performance and reliability. This FPGA incorporates 4,928 logic cells with distributed RAM capabilities, providing ample resources for complex digital designs. The device includes 88 dedicated 18×18 multipliers, enabling efficient implementation of digital signal processing algorithms and mathematical operations.
Key specifications of the XC2VP7-7FGG456C include 396 configurable logic blocks (CLBs) and 556 Kbits of block RAM, delivering substantial memory resources for data-intensive applications. The device operates across a commercial temperature range of 0ยฐC to +85ยฐC, ensuring reliable performance in standard operating environments. The FGG456 package provides 456 pins in a fine-pitch ball grid array format, offering extensive I/O connectivity options.
The XC2VP7-7FGG456C supports multiple I/O standards including LVDS, LVPECL, and SSTL, making it compatible with various interface requirements. The device features a maximum operating frequency of up to 420 MHz, enabling high-speed data processing and real-time applications. Power consumption is optimized through advanced power management features, reducing overall system energy requirements.
Price
Pricing for the XC2VP7-7FGG456C varies based on quantity, supplier, and market conditions. The device is available through authorized Xilinx distributors and electronic component suppliers worldwide. Volume pricing discounts are typically available for large-quantity orders, making the XC2VP7-7FGG456C cost-effective for production applications.
Current market pricing for the XC2VP7-7FGG456C ranges from approximately $200 to $400 per unit for small quantities, with significant reductions available for orders exceeding 100 pieces. OEM pricing and long-term supply agreements can provide additional cost savings for high-volume applications. Contact authorized distributors for current pricing and availability information.
Documents & Media
Comprehensive documentation is available for the XC2VP7-7FGG456C to support design and implementation activities. The official Xilinx datasheet provides detailed electrical specifications, timing parameters, and package information. Application notes covering power estimation, thermal management, and design optimization techniques are available through the Xilinx documentation portal.
The XC2VP7-7FGG456C reference manual includes pinout diagrams, package dimensions, and recommended PCB layout guidelines. Development tools documentation covers ISE Design Suite compatibility and synthesis optimization strategies. Video tutorials and webinars demonstrate best practices for implementing designs using the XC2VP7-7FGG456C architecture.
Additional resources include IBIS models for signal integrity analysis, SPICE models for circuit simulation, and 3D package models for mechanical design verification. The Xilinx Answer Database provides solutions to common design challenges and implementation issues specific to the XC2VP7-7FGG456C.
Related Resources
The XC2VP7-7FGG456C is supported by a comprehensive ecosystem of development tools and intellectual property cores. Xilinx ISE Design Suite provides the primary development environment, offering synthesis, place-and-route, and timing analysis capabilities optimized for Virtex-II Pro devices.
Development boards featuring the XC2VP7-7FGG456C enable rapid prototyping and design validation. These evaluation platforms include essential peripherals, memory interfaces, and connectivity options for testing applications. Third-party IP cores covering communication protocols, digital signal processing functions, and embedded processor interfaces are available to accelerate development cycles.
The XC2VP7-7FGG456C is part of the broader Virtex-II Pro family, providing migration paths to higher-density devices as requirements evolve. Compatible devices include the XC2VP4, XC2VP20, and XC2VP30, offering scalability for various application needs. Design tools and methodologies developed for the XC2VP7-7FGG456C can be leveraged across the entire product family.
Environmental & Export Classifications
The XC2VP7-7FGG456C complies with international environmental standards including RoHS (Restriction of Hazardous Substances) directive, ensuring lead-free construction and environmental compatibility. The device meets REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) requirements for the European market.
Export classification for the XC2VP7-7FGG456C follows applicable trade regulations and export control requirements. The device is subject to U.S. Export Administration Regulations (EAR) and may require export licenses for certain end-use applications or destinations. Designers should verify current export classifications and licensing requirements before international shipment.
Environmental operating specifications for the XC2VP7-7FGG456C include commercial temperature range operation from 0ยฐC to +85ยฐC with junction temperature ratings up to 125ยฐC. The device demonstrates excellent reliability with mean time between failure (MTBF) ratings exceeding industry standards. Proper thermal management and derating guidelines ensure optimal performance across the specified operating range.
The XC2VP7-7FGG456C packaging materials are halogen-free and comply with moisture sensitivity level (MSL) requirements for safe handling and assembly. Environmental stress testing validates device performance under various conditions including temperature cycling, humidity exposure, and mechanical stress scenarios.
