The XC2VP50-5FF1152C is a powerful field-programmable gate array (FPGA) from Xilinx’s Virtex-II Pro series, designed to deliver exceptional performance for demanding digital signal processing, embedded processing, and high-speed connectivity applications. This advanced FPGA combines reconfigurable logic with embedded PowerPC processors, making it an ideal solution for complex system-on-chip designs.
Product Specifications
The XC2VP50-5FF1152C features robust specifications that make it suitable for high-performance applications:
Core Architecture:
- Logic cells: 53,136 system gates
- Configurable logic blocks (CLBs): 4,112
- Block RAM: 232 blocks (18 Kb each)
- Distributed RAM: 536 Kb
- Embedded multipliers: 232 (18×18 bit)
Processing Power:
- Two embedded PowerPC 405 processors
- Operating frequency up to 300 MHz
- Dedicated memory controller interfaces
- Advanced clock management with digital clock managers (DCMs)
Package Details:
- Package type: FF1152 (Fine-pitch Ball Grid Array)
- Total pins: 1,152
- Speed grade: -5 (high performance)
- Operating temperature: Commercial (0ยฐC to +85ยฐC)
I/O Capabilities:
- Maximum user I/O pins: 692
- Support for multiple I/O standards including LVDS, SSTL, and HSTL
- High-speed serial connectivity options
- Differential signaling support
Price
The XC2VP50-5FF1152C pricing varies based on order quantity and supplier. Contact authorized Xilinx distributors for current pricing information and volume discounts. The XC2VP50-5FF1152C typically falls within the premium FPGA price range due to its advanced features and high-performance capabilities.
Factors affecting XC2VP50-5FF1152C pricing include:
- Order quantity and lead times
- Package and speed grade specifications
- Market availability and demand
- Distributor pricing policies
Documents & Media
Essential documentation for the XC2VP50-5FF1152C includes:
Technical Documentation:
- Virtex-II Pro FPGA datasheet with complete electrical specifications
- XC2VP50-5FF1152C pinout and package information
- Power consumption and thermal management guidelines
- Design methodology and best practices guide
Development Resources:
- Xilinx ISE Design Suite compatibility information
- Reference designs and application notes
- Board layout guidelines for FF1152 package
- Signal integrity considerations for high-speed designs
Software Tools:
- Xilinx Vivado Design Suite support (for newer tool versions)
- PowerPC processor development tools
- Embedded development kit (EDK) resources
- IP core libraries and interfaces
Related Resources
The XC2VP50-5FF1152C ecosystem includes various complementary products and resources:
Development Platforms:
- Xilinx evaluation boards featuring the XC2VP50-5FF1152C
- Third-party development kits and reference designs
- Prototyping boards with expansion interfaces
- Debug and programming tools
Compatible IP Cores:
- Memory controllers for DDR, DDR2, and QDR interfaces
- High-speed communication protocols (Ethernet, PCI Express)
- Digital signal processing (DSP) IP blocks
- Video and image processing cores
Design Services:
- Xilinx Alliance Program partners
- FPGA design consulting services
- Board design and layout services
- System integration support
Training and Support:
- Xilinx University Program resources
- Online training courses and webinars
- Technical support and community forums
- Application-specific design workshops
Environmental & Export Classifications
The XC2VP50-5FF1152C complies with international environmental and export regulations:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliance for European markets
- Conflict minerals reporting compliance
- Green packaging initiatives support
Export Classifications:
- Export Control Classification Number (ECCN) as specified by US Department of Commerce
- Compliance with International Traffic in Arms Regulations (ITAR) where applicable
- Country-specific import/export documentation requirements
- End-use and end-user restrictions may apply
Quality Standards:
- ISO 9001 certified manufacturing processes
- Automotive qualification levels where applicable
- Military and aerospace grade options available
- Extended temperature range variants for harsh environments
Packaging and Handling:
- Moisture sensitivity level (MSL) ratings
- Electrostatic discharge (ESD) protection requirements
- Proper storage and handling guidelines
- Shelf life and traceability information
The XC2VP50-5FF1152C represents a proven solution for applications requiring high-performance reconfigurable computing with embedded processing capabilities. Its combination of logic density, processing power, and connectivity options makes it suitable for telecommunications, aerospace, defense, and industrial applications where reliability and performance are critical requirements.
