1. Product Specifications
Core Architecture
The XC3SD1800A-4FGG676C-NW features a robust architecture built on advanced 90nm process technology:
- System Gates: 1,800,000 gates equivalent
- Logic Cells: 37,440 configurable logic cells
- Configurable Logic Blocks (CLBs): 15,552 logic cells arranged in 1,944 CLBs
- DSP48A Slices: 84 dedicated 18ร18 multiplier blocks for high-performance arithmetic operations
- Block RAM: 1,188 Kb total memory distributed across 84 blocks of 18 Kb each
Performance Specifications
- Maximum Clock Frequency: 667 MHz (-4 speed grade)
- DSP Performance: DSP48A slices operate at 250 MHz
- Operating Voltage: 1.2V core voltage
- Process Technology: 90nm CMOS technology
Package Details
- Package Type: Fine-Pitch Ball Grid Array (FBGA)
- Pin Count: 676 pins
- Package Designation: FGG676
- I/O Count: 519 user I/O pins
- Temperature Grade: Commercial (0ยฐC to +85ยฐC)
Key Features
- XtremeDSP DSP48A Technology: Advanced 18ร18 multiplier blocks with accumulator
- Enhanced Block RAM: Fast block memory with output registers
- Proven 90nm Technology: Delivers superior functionality and bandwidth per dollar
- High-Speed Transceivers: Enable fast connectivity for system integration
- Low Power Consumption: Optimized for energy-efficient operation
2. Price
Current Market Pricing (2025)
Pricing for the XC3SD1800A-4FGG676C-NW varies based on quantity and supplier:
- Single Unit Price: Contact authorized distributors for current pricing
- Volume Pricing: Significant discounts available for production quantities (100+ units)
- Price Range: Typically $150-$275 per unit depending on order volume and market conditions
Authorized Distributors
- Digi-Key Electronics: Part Number 122-1538-ND
- Avnet: Comprehensive support and volume pricing
- Arrow Electronics: Global distribution network
- Future Electronics: Regional availability
- Mouser Electronics: Online ordering platform
Note: Prices are subject to change based on market conditions, component availability, and order specifications. Contact authorized distributors for real-time pricing and availability.
3. Documents & Media
Technical Documentation
- Product Datasheet: Comprehensive specifications and electrical characteristics (102 pages)
- User Guide: Detailed implementation guidelines and best practices
- Package Information: Mechanical drawings, pin assignments, and thermal data
- Application Notes: Design optimization and implementation examples
- Errata Documentation: Known issues and workarounds
Design Resources
- Reference Designs: Pre-built application examples for common use cases
- IP Core Library: Verified intellectual property blocks for rapid development
- Power Analysis Tools: Thermal and power consumption calculation utilities
- Pin Planning Tools: Package pinout and signal assignment utilities
Software & Development Tools
- Xilinx Vivado Design Suite: Complete FPGA development environment
- System Generator: MATLAB/Simulink integration for DSP design workflows
- ISE Design Suite: Legacy development environment (for compatibility)
- SDK (Software Development Kit): Embedded software development tools
4. Related Resources
Development Platforms
- Spartan-3A DSP Starter Kit: Complete evaluation platform featuring the XC3SD1800A
- Custom Development Boards: Third-party solutions for specific applications
- Prototyping Modules: Rapid development and testing platforms
Compatible Products
- XC3SD1800A-4FGG676I: Industrial temperature grade variant (-40ยฐC to +100ยฐC)
- XC3SD1800A-5FGG676C: Higher speed grade variant (770 MHz)
- XC3SD3400A Series: Higher capacity devices in the same family
Application Examples
- Broadband Access Equipment: High-speed data processing and routing
- Home Networking Devices: Router and switch implementations
- Display/Projection Systems: Video processing and enhancement
- Digital Television: Broadcasting and signal processing equipment
- Industrial Automation: Control systems and data acquisition
- Medical Imaging: Real-time image processing applications
Technical Support
- Xilinx Forums: Community-driven technical discussions
- Application Engineering: Direct support from Xilinx technical experts
- Training Courses: FPGA design methodology and tool training
- Webinars: Regular technical presentations and updates
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets European Union Restriction of Hazardous Substances directive
- REACH Compliant: Complies with European chemicals regulation
- Lead-Free: Uses lead-free solder and packaging materials
- Halogen-Free: Available in halogen-free package options
Export Control Information
- ECCN Classification: 3A001.a.2.c
- Export Administration Regulations: Subject to U.S. Export Administration Regulations (EAR)
- Country Restrictions: Specific export restrictions may apply to certain destinations
- License Requirements: May require export license for certain applications or countries
Operating Conditions
- Storage Temperature: -65ยฐC to +150ยฐC
- Operating Humidity: 10% to 90% relative humidity (non-condensing)
- MSL Rating: Moisture Sensitivity Level 3 (192 hours at 30ยฐC/60% RH)
- Package Marking: Industry-standard marking for traceability
Quality Standards
- ISO 9001: Manufactured under ISO 9001 quality management systems
- Automotive Grade: AEC-Q100 qualified variants available for automotive applications
- Reliability Testing: Comprehensive qualification testing including thermal cycling and stress testing
The XC3SD1800A-4FGG676C-NW represents the pinnacle of FPGA technology for demanding DSP applications, offering unmatched performance, flexibility, and reliability in a single, cost-effective device.
For technical support, pricing inquiries, or application assistance, contact your local Xilinx representative or authorized distributor.
