Product Specifications
The XC3SD1800A-5FG676C delivers outstanding performance through its comprehensive feature set:
Core Architecture:
- 1,800,000 system gates providing extensive logic capacity
- 84,480 logic cells for complex digital designs
- 84 dedicated 18×18 multiplier blocks optimized for DSP operations
- 126 Kbits of distributed RAM for flexible memory implementation
- 3,456 Kbits of block RAM for high-capacity data storage
Package and Performance:
- FG676 Fine-Pitch Ball Grid Array (FBGA) package with 676 pins
- Speed grade -5 offering balanced performance and power consumption
- Commercial temperature range (0ยฐC to +85ยฐC)
- Advanced 90nm process technology for enhanced efficiency
I/O Capabilities:
- 519 user I/O pins for extensive connectivity options
- Support for multiple I/O standards including LVDS, LVTTL, and LVCMOS
- Differential signaling support for high-speed applications
- Hot-swappable I/O capability for system flexibility
Memory and Processing:
- Integrated memory controller support
- Advanced clock management with up to 8 Digital Clock Managers (DCMs)
- Built-in configuration memory interface
- Support for partial reconfiguration capabilities
Pricing Information
The XC3SD1800A-5FG676C offers competitive pricing for its performance class. Pricing varies based on:
- Order quantity (volume discounts available)
- Distribution channel and authorized resellers
- Regional market conditions
- Lead times and availability
For current pricing on the XC3SD1800A-5FG676C, contact authorized Xilinx distributors or visit official semiconductor marketplaces. Educational institutions and qualifying organizations may be eligible for special pricing programs.
Documents & Media
Comprehensive technical documentation supports the XC3SD1800A-5FG676C implementation:
Essential Documentation:
- Official datasheet with complete electrical specifications
- Pin configuration and package mechanical drawings
- Application notes for DSP-specific implementations
- Migration guides from other FPGA families
- Power consumption analysis and thermal management guides
Development Resources:
- Reference designs for common DSP applications
- Hardware development kits and evaluation boards
- Software compatibility matrices
- Programming and configuration guides
- Debugging and troubleshooting documentation
Design Tools:
- Xilinx ISE Design Suite compatibility information
- Constraint file templates and examples
- Simulation models and testbenches
- Board layout guidelines and recommendations
Related Resources
The XC3SD1800A-5FG676C ecosystem includes numerous supporting resources:
Development Boards:
- Spartan-3A DSP evaluation platforms
- Third-party development kits and modules
- Reference design implementations
- Educational training boards
Compatible Components:
- Memory interfaces (DDR, DDR2, QDR)
- High-speed transceivers and communication interfaces
- Power management solutions optimized for Spartan-3A DSP
- Clock generation and distribution circuits
Software Tools:
- Xilinx ISE Design Suite (legacy support)
- IP core libraries for DSP functions
- System-level design tools
- Verification and validation software
Community Support:
- Technical forums and user communities
- Application-specific design examples
- Video tutorials and training materials
- Webinars and technical presentations
Environmental & Export Classifications
The XC3SD1800A-5FG676C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliance for European markets
- Lead-free soldering process compatible
- Halogen-free package options available
Quality Standards:
- Automotive-qualified versions available (contact manufacturer)
- Industrial temperature range variants
- Enhanced screening options for critical applications
- Long-term supply commitment programs
Export Classifications:
- ECCN (Export Control Classification Number) designation
- Country-specific import/export requirements
- Trade compliance documentation available
- International shipping and handling guidelines
Reliability Standards:
- JEDEC qualification standards compliance
- Extended temperature testing and validation
- Accelerated life testing results
- Quality management system certifications
The XC3SD1800A-5FG676C represents an excellent balance of performance, features, and cost-effectiveness for DSP-intensive applications. Its robust architecture, comprehensive development ecosystem, and regulatory compliance make it a reliable choice for both prototyping and production deployments across diverse industries.
Whether you’re developing next-generation communication systems, implementing advanced control algorithms, or creating innovative consumer electronics, the XC3SD1800A-5FG676C provides the processing power and flexibility needed to bring your designs to life efficiently and effectively.
