Product Specification
The XC3SD1800A-CS484 offers robust performance characteristics that set it apart in the FPGA market:
Core Architecture:
- Logic Cells: 1.8 million system gates
- Configurable Logic Blocks (CLBs): 11,648 slices
- Distributed RAM: 186 Kbits
- Block RAM: 1,872 Kbits total memory
- Package Type: CS484 (484-pin Chip Scale Ball Grid Array)
DSP Processing Power:
- Dedicated 18×18 multipliers: 84 units
- Maximum operating frequency: Up to 200 MHz
- Advanced DSP48 slices for optimized arithmetic operations
- Hardware support for complex mathematical functions
I/O Capabilities:
- User I/O pins: 372 maximum
- Differential I/O pairs: 186
- High-speed LVDS support
- Multiple I/O standards compatibility including LVCMOS, SSTL, and HSTL
Memory and Storage:
- Dual-port block RAM with configurable widths
- Distributed SelectRAM+ memory
- Configuration memory: External serial flash or parallel PROM support
The XC3SD1800A-CS484 operates reliably across commercial temperature ranges (-40ยฐC to +85ยฐC) with low power consumption, making it suitable for both industrial and commercial applications.
Price
Pricing for the XC3SD1800A-CS484 varies based on quantity, packaging options, and supplier relationships. Contact authorized Xilinx distributors for current pricing information, volume discounts, and availability. The XC3SD1800A-CS484 typically falls within the mid-range pricing tier for Spartan-3A DSP devices, offering excellent value for its comprehensive feature set and processing capabilities.
Documents & Media
Technical Documentation:
- XC3SD1800A-CS484 Product Data Sheet
- Spartan-3A DSP Family User Guide
- Package and Pinout Specifications
- Power and Thermal Management Guidelines
- Migration and Compatibility Notes
Development Resources:
- Reference designs and application notes
- Development board schematics and layouts
- Software driver examples and libraries
- Vivado Design Suite compatibility information
- ISE Design Suite legacy support documentation
Quality and Reliability:
- Qualification test reports
- Reliability data and MTBF calculations
- Environmental stress testing results
- Package reliability specifications
Related Resources
Development Tools:
- Xilinx Vivado Design Suite for synthesis and implementation
- SDK (Software Development Kit) for embedded processor designs
- ChipScope Pro for real-time debugging and analysis
- ModelSim simulation environment compatibility
Evaluation Platforms:
- Spartan-3A DSP development boards featuring the XC3SD1800A-CS484
- Reference design kits for specific applications
- Prototyping accessories and expansion modules
Application Areas:
- Digital signal processing systems
- Software-defined radio implementations
- High-speed data acquisition systems
- Video and image processing applications
- Industrial control and automation
- Communications infrastructure equipment
Support Resources:
- Xilinx technical support forums and knowledge base
- Training courses and certification programs
- Partner ecosystem for design services and consultation
- Community-driven project repositories and examples
Environmental & Export Classifications
Environmental Compliance: The XC3SD1800A-CS484 meets stringent environmental standards including RoHS (Restriction of Hazardous Substances) compliance, ensuring lead-free manufacturing processes. The device is manufactured using environmentally responsible processes and materials that minimize environmental impact throughout the product lifecycle.
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Industrial temperature range: -40ยฐC to +85ยฐC (specific grades)
- Humidity resistance: Up to 85% relative humidity
- Shock and vibration resistance per industry standards
Export Control Information: The XC3SD1800A-CS484 is subject to export control regulations and may require appropriate licenses for international shipment. Users should consult current Export Administration Regulations (EAR) and International Traffic in Arms Regulations (ITAR) guidelines before international distribution. The device classification and any restrictions depend on the end-use application and destination country.
Quality Standards:
- ISO 9001 certified manufacturing
- Automotive grade options available (AEC-Q100 qualified)
- Military and aerospace grade variants for specialized applications
- Full traceability and quality documentation available
Package Environmental Data:
- Moisture sensitivity level (MSL): Level 3
- Peak reflow temperature: 260ยฐC
- Storage temperature range: -65ยฐC to +150ยฐC
- Electrostatic discharge (ESD) protection: Human Body Model Class 2
The XC3SD1800A-CS484 represents an excellent choice for engineers seeking a balance of performance, features, and cost-effectiveness in their FPGA-based designs. With comprehensive development support and proven reliability, this device enables rapid prototyping and production deployment across diverse applications requiring sophisticated digital signal processing capabilities.
