Product Specifications
The XC3SD3400A-CSG484 features robust architecture optimized for DSP-intensive applications. This FPGA includes 53,712 logic cells and 126 dedicated DSP48A slices, making it ideal for high-performance signal processing tasks. The device operates with a 1.2V core voltage and supports multiple I/O standards.
Key specifications of the XC3SD3400A-CSG484 include 1,876 Kbits of total block RAM, 519 user I/Os, and a maximum frequency of 320 MHz for DSP applications. The CSG484 package provides a compact 23mm x 23mm BGA form factor with 484 balls, ensuring efficient board space utilization while maintaining excellent thermal performance.
The XC3SD3400A-CSG484 supports various configuration modes including master serial, slave serial, and boundary scan configurations. With its advanced 90nm process technology, this FPGA delivers superior power efficiency while maintaining high performance standards required for modern embedded systems.
Price
The XC3SD3400A-CSG484 pricing varies based on quantity, supplier, and market conditions. Typical unit prices range from $45 to $85 for single quantities, with significant volume discounts available for orders of 100+ units. Educational institutions and authorized distributors may qualify for special pricing on the XC3SD3400A-CSG484.
For current pricing on the XC3SD3400A-CSG484, contact authorized Xilinx distributors such as Digi-Key, Mouser Electronics, or Arrow Electronics. Bulk pricing tiers typically offer 15-30% savings for quantities above 1,000 units, making the XC3SD3400A-CSG484 cost-effective for production applications.
Price factors affecting the XC3SD3400A-CSG484 include package type, speed grade, temperature range, and current market availability. Long-term supply agreements can help secure favorable pricing for the XC3SD3400A-CSG484 in high-volume applications.
Documents & Media
Comprehensive documentation for the XC3SD3400A-CSG484 includes the official datasheet, packaging specifications, and application notes. The Spartan-3A DSP FPGA User Guide provides detailed information about the XC3SD3400A-CSG484 architecture, configuration options, and design considerations.
Technical resources for the XC3SD3400A-CSG484 include PCB layout guidelines, thermal management recommendations, and power supply design guides. These documents ensure proper implementation of the XC3SD3400A-CSG484 in your designs while maximizing performance and reliability.
Development tools documentation covers ISE Design Suite compatibility with the XC3SD3400A-CSG484, including synthesis, implementation, and debugging procedures. Video tutorials and webinars provide additional learning resources for engineers working with the XC3SD3400A-CSG484.
Related Resources
The XC3SD3400A-CSG484 ecosystem includes evaluation boards, development kits, and reference designs that accelerate project development. The Spartan-3A DSP Starter Kit provides a comprehensive platform for evaluating XC3SD3400A-CSG484 capabilities in real-world applications.
IP cores compatible with the XC3SD3400A-CSG484 include digital filters, FFT processors, and communication protocol stacks available through Xilinx IP catalog. Third-party IP vendors also offer specialized cores optimized for the XC3SD3400A-CSG484 architecture.
Software tools supporting the XC3SD3400A-CSG484 include ISE Design Suite, ChipScope Pro, and MATLAB/Simulink integration. These tools provide complete design flow support from concept to production for XC3SD3400A-CSG484-based projects.
Environmental & Export Classifications
The XC3SD3400A-CSG484 meets strict environmental standards including RoHS compliance and REACH regulation requirements. This FPGA operates reliably across commercial temperature ranges (-40ยฐC to +85ยฐC) and industrial applications requiring extended temperature performance.
Export classification for the XC3SD3400A-CSG484 falls under ECCN 3A991.a.2, making it suitable for most commercial applications worldwide. However, specific export restrictions may apply depending on end-use applications and destination countries for the XC3SD3400A-CSG484.
The XC3SD3400A-CSG484 packaging uses lead-free materials and halogen-free molding compounds, supporting environmentally conscious manufacturing processes. Moisture sensitivity level (MSL) classification ensures proper handling procedures for the XC3SD3400A-CSG484 during assembly operations.
Quality certifications for the XC3SD3400A-CSG484 include ISO 9001 manufacturing standards and automotive-grade reliability testing where applicable. These certifications ensure consistent performance and long-term reliability of the XC3SD3400A-CSG484 across diverse applications.
The XC3SD3400A-CSG484 represents proven FPGA technology for DSP applications requiring high performance, reliability, and cost-effectiveness. Contact authorized distributors for current availability and pricing information.
