1. Product Specifications
Core Features
- Part Number: XC3SD1800A-4FG676C
- Manufacturer: Xilinx (now AMD)
- Product Family: Spartan-3A DSP
- Technology: 90nm CMOS process
- System Gates: 1.8 Million gates
- Logic Elements: 37,440 logic cells
Technical Specifications
- Operating Voltage: 1.2V core, 1.8V/3.3V I/O
- Maximum Operating Frequency: 250 MHz
- Number of I/Os: 519 user I/O pins
- Distributed RAM: 260 kbit
- Block RAM: 1,512 kbit (189 kB total)
- XtremeDSP DSP48A Slices: Enhanced DSP processing blocks
- Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
Package Details
- Package Type: FBGA-676 (Fine-pitch Ball Grid Array)
- Pin Count: 676 pins
- Package Size: Fine-pitch surface mount package
- Mounting Style: SMD/SMT (Surface Mount Device/Technology)
Performance Characteristics
- Speed Grade: -4 (standard performance grade)
- Configuration Memory: Internal configuration memory
- Power Consumption: Optimized for low-power applications
- Clock Management: Multiple clock domains with DCM support
2. Price
The XC3SD1800A-4FG676C pricing varies based on quantity, supplier, and market conditions. Current market factors affecting pricing include:
Pricing Factors
- Quantity Breaks: Volume discounts available for large orders
- Lead Time: Standard lead times range from 8-16 weeks for factory orders
- Market Availability: Subject to semiconductor supply chain conditions
- Distributor Network: Available through authorized Xilinx/AMD distributors worldwide
Cost Considerations
- Total Cost of Ownership: Includes development tools, licensing, and support
- Competitive Positioning: Cost-effective alternative to ASIC solutions
- Value Proposition: Superior price-performance ratio for DSP applications
Note: For current pricing and availability, contact authorized distributors or submit RFQ (Request for Quote) through official channels.
3. Documents & Media
Official Documentation
- Datasheet: XC3SD1800A-4FG676C complete specifications and electrical characteristics
- User Guide: Spartan-3A DSP FPGA Family User Guide
- Package Information: FBGA-676 package specifications and PCB layout guidelines
- Application Notes: Design implementation guides and best practices
Development Resources
- Design Files: Reference designs and example projects
- Constraint Files: UCF (User Constraint File) templates
- Simulation Models: VHDL/Verilog behavioral models
- Layout Guidelines: PCB design recommendations and routing guidelines
Software Tools
- Vivado Design Suite: Latest development environment (recommended)
- ISE Design Suite: Legacy development tools (for compatibility)
- IP Catalog: Pre-verified intellectual property cores
- ChipScope Pro: Integrated logic analyzer for debugging
4. Related Resources
Alternative Products
- XC3SD1800A-5FG676C: Higher speed grade variant (-5 vs -4)
- XC3SD1800A-4CSG484C: Alternative package option (484-pin BGA)
- XC3SD3400A-4FG676C: Higher density option (3.4M gates)
Complementary Products
- Configuration Devices: Platform Flash PROMs for configuration storage
- Development Boards: Spartan-3A DSP evaluation platforms
- Debug Tools: JTAG programmers and boundary scan tools
- Power Management: Voltage regulators and power sequencing solutions
Application Areas
- Digital Signal Processing: Audio/video processing, communications
- Industrial Control: Motor control, process automation
- Consumer Electronics: Digital TV, set-top boxes, gaming
- Networking: Ethernet switches, routers, protocol processing
Design Support
- Technical Documentation: Comprehensive design guides and tutorials
- Community Forums: Xilinx developer community and support
- Training Resources: Online courses and certification programs
- Third-party IP: Extensive ecosystem of IP providers
5. Environmental & Export Classifications
RoHS Compliance
- RoHS Status: RoHS3 Compliant (2011/65/EU directive)
- Lead-free: Fully compliant with lead-free manufacturing requirements
- Halogen-free: Available in halogen-free package variants
- Environmental Rating: Meets international environmental standards
Export Control Classifications
- ECCN: Export Control Classification Number (subject to current regulations)
- Country of Origin: Manufacturing location and export implications
- Trade Compliance: Subject to international trade regulations
- Licensing Requirements: May require export licenses for certain destinations
Quality Standards
- ISO Certification: Manufactured under ISO 9001 quality management
- Automotive Grade: Industrial temperature range suitable for automotive applications
- Reliability Testing: Extensive qualification and reliability testing
- Traceability: Full supply chain traceability and documentation
Packaging & Handling
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classification
- ESD Protection: Electrostatic discharge protection requirements
- Storage Conditions: Temperature and humidity storage specifications
- Shipping: Anti-static packaging and handling procedures
The XC3SD1800A-4FG676C represents Xilinx’s commitment to delivering high-performance, cost-effective FPGA solutions for demanding DSP applications. With its robust feature set, comprehensive development ecosystem, and proven reliability, this device enables engineers to accelerate time-to-market while maintaining design flexibility and performance optimization.
For the latest technical specifications, pricing, and availability of the XC3SD1800A-4FG676C, consult with authorized Xilinx/AMD distributors or access the official product documentation through AMD’s technical support portal.
